Toshiba Memory Corporation Announces 96-Layer 3D Flash Memory
June 27 2017 - 10:18PM
Business Wire
Fourth Generation Toshiba Memory Corporation
BiCS FLASH™ adds layers, boosts capacity
Toshiba Memory Corporation, the world leader in memory
solutions, today announced that it has developed a prototype sample
of 96-layer BiCS FLASH™ three-dimensional (3D) flash memory with a
stacked structure[1], with 3-bit-per-cell (triple-level cell, TLC)
technology. Samples of the new 96-layer product, which is a 256
gigabit (32 gigabytes) device, are scheduled for release in the
second half of 2017 and mass production is targeted for 2018. The
new device meets market demands and performance specifications for
applications that include enterprise and consumer SSD, smartphones,
tablets and memory cards.
Going forward, Toshiba Memory Corporation will apply its new
96-layer process technology to larger capacity products, such as
512 gigabit (64 gigabytes) and 4-bit-per-cell (quadruple-level
cell, QLC) technology, in the near future.
The innovative 96-layer stacking process combines with advanced
circuit and manufacturing process technology to achieve a capacity
increase of approximately 40% per unit chip size over the 64-layer
stacking process. It reduces the cost per bit, and increases the
manufacturability of memory capacity per silicon wafer.
Since announcing the world’s first[2] prototype 3D flash memory
technology in 2007, Toshiba Memory Corporation has continued to
advance development of 3D flash memory and is actively promoting
BiCS FLASH™ to meet demand for larger capacities with smaller die
sizes.
This 96-layer BiCS FLASH™ will be manufactured at Yokkaichi
Operations in Fab 5, the new Fab 2, and Fab 6, which will open in
summer 2018.
Note:1. A structure stacking flash memory cells vertically on a
silicon substrate to realize significant density improvements over
planar NAND flash memory, where cells are formed on the silicon
substrate.2. Source: Toshiba Memory Corporation, as of June 12,
2007.* Company names, product names, and service names mentioned
herein may be trademarks of their respective companies.
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Toshiba Memory CorporationKota Yamaji, +81-3-3457-3473Business
Planning Divisionsemicon-NR-mailbox@ml.toshiba.co.jp