PITTSBURGH, Jan. 21, 2019 /PRNewswire/ -- ANSYS (NASDAQ:
ANSS), the global leader and innovator of engineering simulation
software, announced today that it has entered into a definitive
agreement to acquire Helic, the industry-leading provider of
electromagnetic crosstalk solutions for systems on chips (SoCs).
The acquisition of Helic, combined with ANSYS' flagship
electromagnetic and semiconductor solvers, will provide a
comprehensive solution for on-chip, 3D integrated circuit and
chip-package-system electromagnetics and noise analysis. The
transaction is expected to close in the first quarter of 2019.
Management will provide further details regarding the transaction
and its impact on the 2019 financial outlook after the
closing.
Megatrends like 5G, artificial intelligence and cloud computing
are driving more complex semiconductor chip design, including the
increased use of on-chip signal frequencies past 2 gigahertz (GHz)
and complex multiple silicon die in a single package. These
increasingly complex designs often lead to electromagnetic
crosstalk, when unwanted interference caused by electric and
magnetic fields of one signal interferes with another signal.
Helic's solutions help top semiconductor companies debug and
analyze electromagnetic crosstalk issues in their advanced SoC
designs and reduce the risk of silicon failure. When combined with
ANSYS' solutions for electromagnetics and power-integrity noise
analysis, engineers can deploy an electromagnetic-aware design
methodology to design devices in all advanced nodes, optimize the
die size and precisely capture electromagnetic and parasitic
effects from direct current up to 110 GHz.
Headquartered in Santa Clara,
California, Helic has more than 50 employees, including
locations in Greece, Japan and Ireland. Its comprehensive product suite
includes electromagnetic modeling and simulation for highly complex
circuits for sub-10 nanometer technologies. Helic products have
been successfully deployed by worldwide customers in applications
ranging from radio-frequency wireless transceivers, graphics
processing units, high-speed I/Os in multi-core processors and
image sensors and other internet of things connected devices.
"Electromagnetic noise is a key design challenge that is driving
the need for extensive on-chip electromagnetic analysis," said
John Lee, ANSYS vice president and
general manager. "As the leader in multiphysics simulation, ANSYS
already has the leading electromagnetic and semiconductor solutions
on the market. This acquisition brings Helic's, industry leading
on-chip electromagnetic solutions into the ANSYS family –
complementing our leadership in power integrity noise analysis and
helping our customers address the market needs driven by 5G, AI and
cloud computing."
"Helic is thrilled to become part of the ANSYS family. This
acquisition will bring significant benefits to both ANSYS and Helic
customers," said Yorgos Koutsoyannopoulos, president and CEO of
Helic. "ANSYS customers will gain easy access to on-chip
electromagnetics solvers, integrated with the flagship ANSYS
electronics and semiconductor tools. Helic customers will benefit
from inclusion in the ANSYS platform for multi-physics and
chip-package-system."
About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where ANSYS software played a critical role in its
creation. ANSYS is the global leader in engineering
simulation. Through our strategy of Pervasive Engineering
Simulation, we help the world's most innovative companies deliver
radically better products to their customers. By offering the best
and broadest portfolio of engineering simulation software, we help
them solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, ANSYS is
headquartered south of Pittsburgh,
Pennsylvania, U.S.A., Visit www.ansys.com for more
information.
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS-F
Contact
|
Media
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Amy
Pietzak
724.820.4367
amy.pietzak@ansys.com
|
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Investors
|
Annette
Arribas
724.820.3700
annette.arribas@ansys.com
|
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SOURCE ANSYS, Inc.