Newly redesigned lead-free formulation delivers
industry-leading plating rates, enhanced plating performance, bath
stability and greater process flexibility for advanced packaging
applications
WILMINGTON, Del., May 30, 2023
/PRNewswire/ -- DuPont Electronics & Industrial today
introduced DuPont™ SOLDERON™ BP TS 7000, the latest innovation
in tin-silver plating chemistry, at the IEEE Electronic Components
and Technology Conference (ECTC) in Orlando, Florida.
The industry trend toward smaller and more powerful
semiconductor chips continues to propel revolutionary changes in
packaging applications including 2.5D and 3D chip packages. To
enable tighter interconnections and higher circuit density for
microbump applications, it is important to achieve controlled
plating uniformity, smoother surface morphology and void-free
interface during the solder-plating process.
DuPont™ SOLDERON™ BP TS 7000 Tin-Silver Plating Chemistry
is a high-performance tin-silver solder that is optimized for
today's microbump solder-plating applications. Leveraging DuPont's
in-depth experience in electroplating chemistries for wafer-bumping
applications, this new lead-free plating bath improves bump
coplanarity by more than 20%, while delivering tighter silver
percentage control and reliable joints for microbump and C4
(controlled-collapse chip connection) applications. Another key
technical highlight for this product is its excellent bump
coplanarity in challenging mixed critical dimension features within
the same die which directly impacts the assembly process and
reliability.
In addition, the optimized additive system reduces precipitation
risks and improves the stability of the complexer components and
bath stability to extend the bath life. This chemistry has proven
to maintain excellent void-free performance and mechanical
integrity over multiple reflows and repeated thermal stresses. With
a single formulation, SOLDERON™ BP TS 7000 is robust enough for a
wide variety of bump sizes and shapes including C4 bumps which
range from 200μm to 75μm in diameter to copper pillar capping
ranging from 100μm to 10μm in diameter. This eliminates the need to
change the plating bath for microbump and C4 plating that serves
broad end-use applications, including High Bandwidth Memory
(HBM).
"Solder bump plating is a key process step in advanced
packaging," said Shashi Gupta,
global marketing director, Advanced Packaging Technologies, DuPont
Electronics & Industrial. "DuPont has been working with
leading-edge semiconductor manufacturers to continue expanding our
capabilities and portfolio to meet the ever-changing requirements
of this key process. With its excellent plating performance and
efficiency, we are excited that SOLDERON™ BP TS 7000 will set a new
benchmark for tin/silver solder-plating applications."
About DuPont Electronics & Industrial
DuPont
Electronics & Industrial is a global supplier of new
technologies and performance materials serving the semiconductor,
circuit board, display, digital and flexographic printing,
healthcare, aerospace, industrial and transportation industries.
From advanced technology centers worldwide, teams of talented
research scientists and application experts work closely with
customers, providing solutions, products and technical service to
enable next-generation technologies.
https://www.dupont.com/electronics-industrial.html
About DuPont
DuPont (NYSE: DD) is a global innovation
leader with technology-based materials and solutions that help
transform industries and everyday life. Our employees apply diverse
science and expertise to help customers advance their best ideas
and deliver essential innovations in key markets including
electronics, transportation, construction, water, healthcare, and
worker safety. More information about the company, its businesses
and solutions can be found at www.dupont.com.
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otherwise noted, denoted with ™, ℠ or ® are trademarks,
service marks or registered trademarks of affiliates of DuPont de
Nemours, Inc.
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SOURCE DuPont