Achieving Benchmark to Accelerate Adoption of Spectra7's
Technology
SAN JOSE,
Calif., Sept. 20, 2021 /CNW/
-- (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc.
("Spectra7" or the "Company"), a leading provider of
high-performance analog semiconductor products for broadband
connectivity markets, and Foxconn Interconnect Technology, Inc.
(Foxconn), a leading supplier of interconnect solutions, announced
that they have achieved error free performance on a Broadcom
Tomahawk 3 switch. The testing relied on Spectra7 enabled
34AWG 200Gbps Active Copper Cable
(ACC) built by Foxconn up to 2.5m in
length, which are dramatically thinner and easier to route than the
26AWG cables that are typically used
for these demanding applications.
"Achieving this benchmark on Broadcom's Tomahawk
3 platform is significant to maximizing performance within the data
center and will accelerate adoption of our technology in the
rapidly growing Artificial Intelligence and Machine Learning
markets," said Spectra7 CEO Raouf
Halim. "Foxconn Interconnect Technology has unsurpassed
capabilities in development, research, manufacturing engineering,
design and production and is the first to develop 34AWG ACCs using our technology."
Hyperscalers are now requiring thinner and more
flexible cables to accommodate increased rack density. Bend radius
and bend space are key cable parameters. Spectra7's
GaugeChangerTM chips allow smaller 34AWG copper to be used thus dramatically
improving both measurements.
The ACCs ran error free attaining a Bit Error
Rate (BER) of better than 10-15. The benchmark was
achieved with no Forward Error Correction (FEC). FEC
increases the latency by up to 120ns per connection in each
direction and degrades Artificial Intelligence (AI) and Machine
Learning (ML) applications that are increasingly running on
Hyperscaler systems.
The AI market is forecast to grow at 39.7%
CAGR1 and the ML market is forecast to grow at 43.8%
CAGR2 over the years 2019 to 2025.
ABOUT FOXCONN INTERCONNECT TECHNOLOGY, LIMITED
("FIT")
Foxconn Interconnect Technology
(FIT) is a leading global solutions developer and
manufacturer cultivating connectivity for a better world. With
unsurpassed capabilities in development, research, manufacturing
engineering and design, production, supply chain, and go-to-market
planning for world class brands and private label products spanning
B2C and B2B categories, FIT is at the forefront of worldwide
technological trends delivering compelling user experiences at
scale. With offices and manufacturing sites located in
Asia, the Americas and
Europe, FIT is a global leader in
the manufacturing of high precision interconnect components.
For more information, visit FIT's website:
fit-foxconn.com.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high performance
analog semiconductor company delivering unprecedented bandwidth,
speed and resolution to enable disruptive industrial design for
leading electronics manufacturers in virtual reality, augmented
reality, mixed reality, data centers and other connectivity
markets. Spectra7 is based in San Jose,
California with a design center in Cork, Ireland and technical support location
in Dongguan, China. For more
information, please visit www.spectra7.com.
Neither the TSX Venture Exchange nor its
regulation services provided (as that term is defined in the
policies of the TSX Venture Exchange) accepts responsibility for
the adequacy or accuracy of this release.
CAUTIONARY NOTES
Certain statements contained in this press
release constitute "forward-looking statements". All statements
other than statements of historical fact contained in this press
release, including, without limitation, the timing of the effective
date of the Consolidation, the Company's strategy, plans,
objectives, goals and targets, and any statements preceded by,
followed by or that include the words "believe", "expect", "aim",
"intend", "plan", "continue", "will", "may", "would", "anticipate",
"estimate", "forecast", "predict", "project", "seek", "should" or
similar expressions or the negative thereof, are forward-looking
statements. These statements are not historical facts but instead
represent only the Company's expectations, estimates and
projections regarding future events. These statements are not
guarantees of future performance and involve assumptions, risks and
uncertainties that are difficult to predict. Therefore, actual
results may differ materially from what is expressed, implied or
forecasted in such forward-looking statements. Additional factors
that could cause actual results, performance or achievements to
differ materially include, but are not limited to the risk factors
discussed in the Company's Management's Discussion and Analysis for
the year ended December 31, 2020.
Management provides forward-looking statements because it believes
they provide useful information to investors when considering their
investment objectives and cautions investors not to place undue
reliance on forward-looking information. Consequently, all of the
forward-looking statements made in this press release are qualified
by these cautionary statements and other cautionary statements or
factors contained herein, and there can be no assurance that the
actual results or developments will be realized or, even if
substantially realized, that they will have the expected
consequences to, or effects on, the Company. These forward-looking
statements are made as of the date of this press release and the
Company assumes no obligation to update or revise them to reflect
subsequent information, events or circumstances or otherwise,
except as required by law.
For more information, please contact:
Matt
Kreps/Jim Fanucchi
Darrow Associates
214-597-8200
ir@spectra7.com
Spectra7 Microsystems Inc.
Bonnie Tomei
Chief Financial Officer
669-212-1089
ir@spectra7.com
Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com
- Markets and Markets -
https://www.marketsandmarkets.com/Market-Reports/artificial-intelligence-market-74851580.html
- Million Insights -
https://www.prnewswire.com/news-releases/machine-learning-market-size-to-reach-96-7-billion-by-2025--based-on-rising-usage-of-data-science--ai-technologies-for-driving-business-processes--million-insights-301262601.html
View original content to download
multimedia:https://www.prnewswire.com/news-releases/spectra7-and-foxconn-achieve-error-free-performance-on-broadcom-tomahawk-3-switch-with-ultra-thin-34awg-active-copper-cable-301380173.html
SOURCE Spectra7 Microsystems Inc.