LEOBEN, Austria, December 22, 2014 /PRNewswire/ --
- AT&S achieved first disruptive technology for power
electronics solutions for automotive and industrial
applications
- First reference designs show significant miniaturisation up
to 50% for power modules
- Power applications in different power classes in the range
from 50 W to 50 kW
- 50 W power applications are ready for
industrialisation
AT&S is the leading provider for Embedded Component
Packaging Solutions. Its patented ECP® technology enables further
miniaturisation while improving performance. Due to its constant
technology development and strong partnerships, AT&S has now
achieved outstanding results in the field of power electronics.
This solution provides a significant increase in efficiency and
performance for Industrial and Automotive Applications.
(Logo:
http://photos.prnewswire.com/prnh/20141222/721394 )
Together with the EmPower consortium consisting of important
industrial players and scientific partners, the development of
embedded power packages is now ready for industrialisation. After
18 months of project work, the first impressive results have become
visible especially when benchmarking with existing
packaging solutions:
Reference designs have already been produced and show
miniaturisation levels of up to 50% for power modules. With the new
embedding packaging concepts, an efficiency increase through
reduction of power losses and reduced thermal resistances has been
demonstrated. New plating equipment for wafer level plating has
been developed in order to realise double sided copper plated power
dies. This enables a new supply chain for embedded power devices
and new packaging solutions.
Based on this positive development, leading companies from the
Automotive, Industrial & Semiconductor industrial sectors are
now on their way to industrialising these new package solutions.
Power applications (e.g DC/AC, renewable power solutions)
classified in different power ranges from 50 W to 50 kW are targets
on the industrialisation plan.
Andreas Gerstenmayer, CEO AT&S: "The increasing demand in
power electronics confirms our strategy to focus on innovative and
efficient methods to optimise the use of energy. Based on the
results achieved, AT&S is now able to offer customers and
potential customers in the Automotive, Industrial as well as in the
Semiconductor industry our innovative embedded power electronic
packaging solutions."
The EmPower consortium consists of the following members:
- AT&S - Austria
- Continental - Germany
- STMicroelectronics - France/Italy
- TU Wien - Austria
- TU Berlin - Germany
- Atotech - Germany
- Ilfa - Germany
- Fundico - Belgium
About AT&S
AT&S is the European market leader and one of the leading
manufacturers of high-value printed circuit boards. For more
information
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Press contact
Christina Schuller, Head of
Corporate Communications
AT & S Austria Technologie & Systemtechnik AG
+43-(0)3842-200-5908, c.schuller@ats.net,
http://www.ats.net
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