The semiconductor equipment industry has witnessed a gradual
increase in the proportion of packaging and testing equipment, with
the continuous advancement of advanced packaging. Die bonding plays
a crucial role in the post-process of semiconductor
manufacturing.
WILMINGTON, Del., Aug. 19, 2024 /PRNewswire/ -- Allied Market
Research published a report, titled, "Die Bonder Equipment
Market by Type (Manual die bonder, Semiautomatic Die Bonder and
Fully Automatic Die Bonder), Bonding Technique (Epoxy, Eutectic, UV
and Other), and Application (Consumer Electronics, Automotive,
Industrial, Telecommunications and Others): Global Opportunity
Analysis and Industry Forecast, 2024-2032". According to the
report, the die bonder equipment market was valued at
$785.2 million in 2023, and is
estimated to reach $1.9 billion by
2032, growing at a CAGR of 10.8% from 2024 to 2032.
Prime determinants of growth
The die bonding process plays a crucial role in semiconductor
chip manufacturing. It involves detaching the chip from the carrier
and attaching it to the packaging substrate. The quality and
efficiency of die bonding significantly influence the chip's
performance and cost. The rise of the Internet of Things (IoT)
requires fast data processing, driving the demand for advanced
electronic devices. The shift towards autonomous and electric
vehicles in the automotive sector also contributes to the growing
market. Countries like India and
China, experiencing a surge in
smartphone usage to affordable Internet rates, are also playing a
significant role in sustaining the market. The ability to navigate
semiconductor chip shortages and offer cost-effective solutions,
along with prioritizing energy efficiency and maintenance, are key
elements for success in this market.
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Report coverage & details:
Report
Coverage
|
Details
|
Forecast
Period
|
2024–2032
|
Base
Year
|
2023
|
Market Size in
2023
|
$785.2
million
|
Market Size in
2032
|
$1, 859.8
million
|
CAGR
|
9.5 %
|
No. of Pages in
Report
|
315
|
Segments
Covered
|
Type, Application,
Bonding Technique, and Region
|
Drivers
|
Increase in complexity
of semiconductor IC designs
Rise in trend towards
automation in automobiles
Growth in demand across
consumer electronics
|
Opportunities
|
Growth in need for 3D
semiconductor assembly and packaging
|
Restraint
|
High ownership cost and
capital intensity
|
The fully automatic die bonder segment maintains its
leadership throughout the forecast period.
Based on type, the fully automatic die bonder segment held the
highest market share in 2023. The semiconductor industry's
technological progress and the push for smaller electronic devices
make precise and efficient die bonding processes crucial. Fully
automated die bonders are a must to keep up with growing production
needs for consumer and automotive electronics. Automation not only
cuts labor costs and boosts efficiency but also guarantees
consistent quality and reliability, vital in fields such as medical
devices, aerospace, and automotive. In addition, the intricacy of
contemporary chips requires the accuracy provided by fully
automated die bonders, effectively minimizing mistakes and
minimizing material wastage. These combined factors underscore the
increasing significance and need for fully automated die bonders in
the field of high-tech manufacturing.
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The Epoxy segment maintains its leadership throughout the
forecast period.
Based on bonding technique, the epoxy segment held the highest
market share in 2023. Epoxy adhesives have seen significant
improvements in performance owing to advancements in material
science. These advancements have resulted in enhanced thermal
stability, adhesion, and environmental resistance, making epoxy
suitable for a wider range of applications. The growth of the
electronics and semiconductor industry, fueled by the increasing
prevalence and miniaturization of electronic devices, has created a
greater need for reliable bonding techniques such as epoxy
adhesives. In sectors such as automotive and aerospace, epoxy
bonding has a critical role in achieving high-strength and
durability, contributing to weight reduction and fuel efficiency.
In addition, the expanding renewable energy sector, particularly in
solar and wind energy, has further increased the demand for epoxy
adhesives. These adhesives are essential for manufacturing durable
solar panels and wind turbine blades.
The consumer electronics segment maintains its leadership
throughout the forecast period.
Based on application, the consumer electronics segment held the
highest market share in 2023. The rise in smart devices such
as smartphones, tablets, and wearables demand cutting-edge
manufacturing methods, where die bonders play an important role in
ensuring accuracy and dependability during semiconductor component
assembly. The shift towards smaller sizes and denser packaging in
these compact, feature-packed gadgets underscores the importance of
utilizing advanced die bonding machinery. Ongoing progress in
semiconductor technology, which includes the creation of
high-performance, energy-efficient chips, underscores the necessity
for precise and effective bonding procedures facilitated by die
bonders. Moreover, the increasing demand for consumer electronics
results in larger production quantities, with automated die bonder
systems allowing manufacturers to expand their operations while
upholding high standards of quality and uniformity.
The North America region
maintains its leadership throughout the forecast
period.
Based on the region, the North
America held the highest market share in 2023, North
American companies are leading the way in technological innovation,
requires the use of precise and efficient die bonders for
next-generation semiconductor devices. To strengthen domestic
semiconductor manufacturing, government initiatives and investments
including the U.S. chips and science act are being implemented,
thereby increasing the requirement for efficient die bonding
equipment. Furthermore, the automotive and aerospace industries'
growing integration of advanced electronics is fueling the demand
for high-precision die bonders. The presence of major semiconductor
equipment manufacturers in North
America provides easy access to cutting-edge technology and
support. A prime example of this escalating demand is Intel's
investment of $20 billion in two new
semiconductor factories in Arizona, showcasing the demand for advanced
die bonding equipment to facilitate large-scale semiconductor
production and innovation.
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Players: -
- ASM Pacific Technology
- Kulicke & Soffa Industries, Inc.
- Mycronic
- Palomar Technologies
- West•Bond, Inc.
- MicroAssembly Technologies, Ltd.
- Finetech GmbH & Co. KG
- TRESKY GmbH
- Hybond Inc.
- Shibuya Corporation
The report provides a detailed analysis of these key players in
the global die bonder equipment market. These players have adopted
different strategies such as new product launches, collaborations,
expansion, joint ventures, agreements, and others to increase their
market share and maintain dominant shares in different regions. The
report is valuable in highlighting business performance, operating
segments, product portfolio, and strategic moves of market players
to showcase the competitive scenario.
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