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FER Ferrovial SE

40.62
0.00 (0.00%)
Pre Market
Last Updated: 03:10:38
Delayed by 15 minutes

Period:

Draw Mode:

Volume 0
Bid Price 16.20
Ask Price 40.62
News -
Day High

Low
37.00

52 Week Range

High
48.29

Day Low
Share Name Share Symbol Market Stock Type
Ferrovial SE FER NASDAQ Common Stock
  Price Change Price Change % Share Price Last Trade
0.00 0.00% 40.62 03:10:38
Open Price Low Price High Price Close Price Previous Close
40.62
Trades Shares Traded Average Volume 52 Week Range
0 0 - 37.00 - 48.29
Last Trade Type Quantity Price Currency
- 0 US$ 40.62 USD

Ferrovial SE Financials

Market Cap Shares in Issue Float Revenue Profit/Loss EPS PE Ratio
27.27B 740.69M - 8.54B 460M 0.62 59.29
Short Interest Dividends Per Share Dividend Yield Ex-Div Date Insider B/S Insider % Owned
- - - -

more financials information »

Ferrovial News

Date Time Source News Article
5/17/202406:22PR Newswire (US)DXC Technology and Ferrovial to Co-create New Generative..
5/13/202416:42PR Newswire (US)Ferrovial increased adjusted EBITDA by 37.6% in the first..
5/09/202406:30PR Newswire (US)Ferrovial Begins Trading on Nasdaq Under Symbol "FER"
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Historical FER Price Data

Period † Open High Low VWAP Avg. Daily Vol Change %
1 Week39.3842.4637.80541.1136,3031.243.15%
1 Month47.2248.2937.0040.4243,263-6.60-13.98%
3 Months47.2248.2937.0040.4243,263-6.60-13.98%
6 Months47.2248.2937.0040.4243,263-6.60-13.98%
1 Year47.2248.2937.0040.4243,263-6.60-13.98%
3 Years47.2248.2937.0040.4243,263-6.60-13.98%
5 Years47.2248.2937.0040.4243,263-6.60-13.98%

Ferrovial Description

ASML Holding NV is founded in 1984 and based in the Netherlands, ASML is the leader in photolithography systems used in the manufacturing of semiconductors. Photolithography is the process in which a light source is used to expose circuit patterns from a photomask onto a semiconductor wafer. The latest technological advances in this segment allow chipmakers to continually increase the number of transistors on the same area of silicon, with lithography historically representing a meaningful portion of the cost of making cutting-edge chips. Chipmakers require next-generation EUV lithography tools from ASML to continue past the 5-nanometer process node.