CyberOptics Wins Prestigious GLOBAL Technology Award for WX3000™ Metrology and Inspection System
November 17 2021 - 8:00AM
Business Wire
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions, received a 2021 GLOBAL Technology Award in the category
of Metrology for its WX3000™ Metrology and Inspection System. The
award was announced during a ceremony that took place Tuesday, Nov.
16, 2021 at Productronica in Munich, Germany.
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WX3000 Metrology and Inspection system
for wafer-level and advanced packaging applications. (Photo:
Business Wire)
Incorporating the NanoResolution Multi-Reflection Suppression™
(MRS™) sensor, the WX3000 Metrology and Inspection system enables
the ultimate combination of high speed, high resolution and high
accuracy for wafer-level and advanced packaging, to improve yields
and productivity. The proprietary NanoResolution MRS sensor, deemed
best in class, meticulously identifies and rejects multiple
reflections caused by shiny and mirror-like surfaces. Effective
suppression of multiple reflections is critical for highly accurate
measurements.
Performing two to three times faster than alternative
technologies at data processing speeds in excess of 75 million 3D
data points per second, the WX3000 system delivers 100% 3D/2D
metrology and inspection with throughput greater than 25 wafers per
hour.
“We’re delighted to win the 2021 Global Technology Award, which
represents the 26th award related our proprietary MRS sensor
technology,” said Dr. Subodh Kulkarni, President and CEO,
CyberOptics, “As advanced packaging continues to get smaller and
more complex with a lot of variation, there is an increasing need
for highly accurate, 100% inspection and metrology at high speed.
We’re very honored to be recognized for the WX3000 system’s
superior performance that drives improved yields, throughput and
processes for our customers.”
WX3000 systems are designed specifically for various wafer-level
and advanced packaging applications including wafer bumps, solder
balls and bumps, gold bumps and copper pillars. The systems provide
superior measurement and inspection performance for features down
to 25-micron, including bump height, coplanarity, diameter and
shape, relative location and a variety of other measurements.
The GLOBAL Technology Awards have recognized the very best new
innovations in the printed circuit assembly and packaging
industries since 2005. The prestigious awards contest has been
bringing together the global SMT and advanced packaging industry in
a celebration of the companies and people that are achieving the
highest standards and driving our industry forward. For more
information, visit www.globalsmt.net/awards.
For more information, visit www.cyberoptics.com.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: a possible worldwide recession or
depression resulting from the economic consequences of the COVID-19
pandemic; the negative effect on our revenue and operating results
of the COVID-19 crisis on our customers and suppliers and the
global supply chain; market conditions in the global SMT and
semiconductor capital equipment industries; trade relations between
the United States and China and other countries; the timing of
orders and shipments of our products, particularly our 3D MRS
SQ3000 Multi-Function systems and MX systems for memory module
inspection; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
and semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 Multi-Function systems and products
for semiconductor inspection and metrology; costly and time
consuming litigation with third parties related to intellectual
property infringement; the negative impact on our customers and
suppliers due to past and future terrorist threats and attacks and
any acts of war; the impact of the MX3000 orders on our
consolidated gross margin percentage in any future period; risks
related to cancellation or renegotiation of orders we have
received; and other factors set forth in the Company’s filings with
the Securities and Exchange Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20211117005094/en/
Jeffrey A. Bertelsen, Chief Financial Officer 763-542-5000
Carla Furanna Vice President of Global Marketing
952-820-5837
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