Intevac Announces Agreement to Deliver its MATRIX PVD System for Evaluation & Qualification in Advanced Semiconductor Packagi...
July 03 2019 - 8:00AM
Business Wire
Intevac, Inc. (Nasdaq: IVAC), a leading supplier of thin-film
processing systems, today announced it has closed an agreement with
a leading outsourced assembly and test (OSAT) manufacturer to place
its INTEVAC MATRIX® PVD System for evaluation and qualification at
their R&D facility. Scheduled to ship in the fourth quarter,
this system is designed to lower the cost of advanced semiconductor
packaging architectures, enabling smaller package footprints for
mobile devices, as well as improved thermal and electrical
performance as compared to conventional packages.
“After over a year of development and culminating in successful
customer demonstrations, we are very pleased to announce that our
MATRIX PVD system has passed the stringent selection criteria at a
leading OSAT manufacturer,” commented Wendell Blonigan, president
and chief executive officer of Intevac. “The MATRIX PVD system is a
versatile platform that can be easily configured to handle multiple
substrate sizes, including 200 and 300 millimeter wafers, as well
as panels up to 890 millimeters wide. The barrier- and seed-layer
processes developed by Intevac for the redistribution layer (RDL)
when coupled with the MATRIX System’s linear transport
architecture, provide compelling technological and
cost-of-ownership benefits to our customers.”
The MATRIX PVD system for
Advanced Packaging is configured for metal deposition utilizing
Intevac’s patented Linear Scanning Magnet Array (LSMA™) magnetron,
which achieves significantly higher target utilizations compared to
static planar magnetrons. Additionally, the system can be
configured with a proprietary pre-clean module, employing a gridded
ion source that produces a net electrically neutral beam of
well-controlled energetic Argon ions for substrate
preparation.
About INTEVAC MATRIX®
INTEVAC MATRIX® leverages Intevac's core capabilities in
high-throughput, precise thin film deposition and ports them to
applications such as advanced semiconductor packaging. The MATRIX
is a substrate-independent platform for multiple thin film
applications; from its compact, modular design to its automated
transport system, every aspect of MATRIX is optimized to maximize
productivity and minimize Cost of Ownership. Enabled by a
carrier-based transport system that accommodates variously sized
substrates, the system can be configured with multiple thin film
deposition and pre-clean technologies for in-line sequential
processing.
About Intevac
Intevac was founded in 1991 and has two businesses: Thin-film
Equipment and Photonics.
In our Thin-film Equipment business, we are a leader in the
design and development of high-productivity, thin-film processing
systems. Our production-proven platforms are designed for
high-volume manufacturing of substrates with precise thin film
properties, such as the hard drive media, display cover panel, and
solar photovoltaic markets we serve currently.
In our Photonics business, we are a recognized leading developer
of advanced high-sensitivity digital sensors, cameras and systems
that primarily serve the defense industry. We are the provider of
integrated digital imaging systems for most U.S. military night
vision programs.
For more information, call 408-986-9888 or visit the company's
website at www.intevac.com.
INTEVAC MATRIX® and LSMA™ are trademarks of Intevac, Inc.
Forward-Looking Statements
This press release includes statements that constitute
“forward-looking statements” within the meaning of the Private
Securities Litigation Reform Act of 1995 (the “Reform Act”).
Intevac claims the protection of the safe-harbor for
forward-looking statements contained in the Reform Act. These
forward-looking statements are often characterized by the terms
“may,” “believes,“ “projects,” “expects,” or “anticipates,” and do
not reflect historical facts. Specific forward-looking statements
contained in this press release include, but are not limited to;
the timing of the MATRIX shipment and the films processed. The
forward-looking statements contained herein involve risks and
uncertainties that could cause actual results to differ materially
from the company’s expectations. These risks include, but are not
limited to: the failure to meet planned shipment and customer
acceptance dates, which could have a material impact on our
business, our financial results, and the company's stock price.
These risks and other factors are detailed in the Company’s
periodic filings with the U.S. Securities and Exchange
Commission.
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version on businesswire.com: https://www.businesswire.com/news/home/20190703005092/en/
James Moniz Chief Financial Officer (408) 986-9888
Claire McAdams Investor Relations (530) 265-9899
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