Infineon Offers Ultra-Low Cost Dual SIM Integrated on a Single Platform; Next Generation of Monolithically Integrated Mobile Pho
November 18 2008 - 12:38PM
Marketwired
Today at the GSM Asia, Infineon Technologies AG (FRANKFURT: IFX)
(NYSE: IFX) introduced its latest chips for Ultra-Low Cost mobile
phones, optimizing the system performance by factor five and also
again reducing the bill-of-material (BOM) by almost 10 percent
compared to currently available Infineon platform solutions.
Infineon's single-chip solution, the X-GOLD(TM)102, enables
handset manufacturers to differentiate in the market by providing
the lowest cost solutions based on technologies already available
in high volume production. The chip will be provided as part of a
platform solution, XMM(TM)1020, which encompasses a comprehensive
suite of development tools and a support package to customers for
shortest time-to-market. This enables customers to bring mobile
phones to the market within a time frame of only five months
compared to the industry's usual 10 - 12 months. This pre-tested
platform delivers best-in-class RF performance, highest voice
quality, well-proven protocol stack, smallest form factor (8mm x
8mm) as well as smallest bill-of-material, thereby creating highest
customer value and differentiation in the market.
The X-GOLD102 single chip includes the baseband processor, the
radio frequency (RF) transceiver, RAM memory and the entire power
management unit for the mobile phone. It supports MP3 Audio (Basic
Multimedia Phone), colour display, FM Radio interface, USB charger
and is based on 130nm technology (CMOS SoC) for enhanced monolithic
integration. Additionally the XMM1020 platform can be realized in a
4-layer PCB and low via count, in a modem area of less than 5
square centimetres and a component count of less than 50
devices.
Dual-SIM XMM(TM)1028
Infineon today also announced its new Ultra-Low Cost Dual-SIM
platform. The XMM1028, based on the X-GOLD(TM)102DS, is a cost
optimized single baseband solution for Dual-SIM platforms. Negating
the need for either a second modem on the platform or complex
mechanical switching, the XMM1028 provides a fully capable Dual-SIM
solution based on a single baseband device.
The Infineon XMM1028 reference platform comprises one
single-chip that integrates baseband, power management, RF and two
SIM interfaces. This allows the user to benefit from the offerings
of two network operators at the same time, without needing to
switch the SIM-card. It offers voice call and SMS for SIM and
features unique applications for dual SIM such as Phonebook or Call
log. It furthermore allows automatic switching between
operators.
The XMM1028 platform also needs less than 50 components (Modem)
in a PCB mounted area of less than 6 square centimetres and
furthermore offers a clean migration path for developers familiar
with the XMM1010 platform with fast time-to-market and industry
lowest system BOM, which enables manufacturers to offer best
possible cost effectiveness in the Dual-SIM segment.
Availability of XMM(TM)1020 and XMM(TM)1028
Volume production of the XMM1020 and the XMM1028 has already
started.
You can find further information on Infineon's products for
mobile communications at: www.Infineon.com/Baseband_2G
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers
semiconductor and system solutions addressing three central
challenges to modern society: energy efficiency, communications,
and security. In the 2007 fiscal year (ending September), the
company reported sales of Euro 7.7 billion (including Qimonda sales
of Euro 3.6 billion) with approximately 43,000 employees worldwide
(including approximately 13,500 Qimonda employees). With a global
presence, Infineon operates through its subsidiaries in the U.S.
from Milpitas, CA, in the Asia-Pacific region from Singapore, and
in Japan from Tokyo. Infineon is listed on the Frankfurt Stock
Exchange and on the New York Stock Exchange (ticker symbol:
IFX).
Further information is available at www.infineon.com.
This news release is available online at
www.infineon.com/press/
Media Relations Technology: Worldwide Headquarters Christoph von
Schierstaedt +49 89 234 22984 vonschierstaedt@infineon.com U.S.A.
Mitch Ahiers +1 408 503 2791 mitch.ahiers@infineon.com
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