BE Semiconductor Announces Preliminary Net Sales and Orders for the First Quarter of 2006
April 10 2006 - 8:34AM
PR Newswire (US)
DRUNEN, The Netherlands, April 10 /PRNewswire-FirstCall/ -- BE
Semiconductor Industries N.V. ("the Company" or "Besi") (Nasdaq:
BESI; Euronext: BESI), a leading manufacturer of assembly equipment
for the semiconductor industry, today announced preliminary sales
and orders for the first quarter ended March 31, 2006. The Company
will issue results for the first quarter of 2006 and hold a
conference call with investors and analysts to review results on
Wednesday, April 19, 2006. Net sales for the first quarter ended
March 31, 2006 are expected to be approximately euro 44.0 million,
a decrease of approximately 7.5% as compared to euro 47.6 million
for the fourth quarter of 2005, and an increase of approximately
20% as compared to net sales of euro 36.6 million in the first
quarter of 2005. Orders for the quarter ended March 31, 2006
totaled approximately euro 60.0 million, an increase of
approximately 22% as compared to euro 49.0 million for the fourth
quarter of 2005 and an increase of approximately 49% as compared to
orders of euro 40.3 million in the first quarter of 2005. In
addition, backlog increased 27% to approximately euro 72.0 million
at March 31, 2006 as compared to euro 56.8 million at December 31,
2005. Richard W. Blickman, President and Chief Executive Officer of
the Company, commented: "We are pleased with our expected sales and
order results for the first quarter of 2006, as these sales amounts
were in-line with prior guidance and bookings exceeded
expectations. The projected order growth this quarter was primarily
driven by increased demand for assembly equipment for conventional
leadframe applications as customers increased aggregate
semiconductor manufacturing capacity. Equipment orders for array
connect assembly applications also exceeded our expectations."
Investor Conference Call BE Semiconductor Industries N.V. will
report results for the first quarter 2006 on Wednesday, April 19,
2006 at 08.30 a.m. Continental European Time (02.30 a.m. New York
Time). Besi will host a conference call on Wednesday, April 19,
2006 at 4:30 p.m Continental European Time (3:30 p.m London Time,
10:30 a.m. New York Time). Conference call details will be
available through our website http://www.besi.com/. About BE
Semiconductor Industries N.V. BE Semiconductor Industries N.V.
designs, develops, manufactures, markets and services die sorting,
flip chip bonding and multi-chip die bonding, packaging and plating
equipment for the semiconductor industry's assembly operations. Its
customers consist primarily of leading U.S., European, Asian,
Korean and Japanese semiconductor manufacturers and subcontractors
which utilize its products for both array connect and conventional
leadframe manufacturing processes. For more information visit
http://www.besi.com/. Caution Concerning Forward Looking Statements
This press release contains forward-looking statements, which are
found in various places throughout the press release, including
statements relating to expectations of orders, net sales, product
shipments, expenses, operating results and the impact of the
acquisition of Datacon on Besi's net income in fiscal year 2005.
The words "anticipate," "estimate," "expect," "intend," "may,"
"plan," "predict," "project," "will," "would" and similar
expressions are intended to identify forward looking statements,
although not all forward looking statements contain these
identifying words. While these forward- looking statements
represent our judgments and future expectations concerning the
development of our business, a number of risks, uncertainties and
other important factors could cause actual developments and results
to differ materially from our expectations. These factors include,
but are not limited to, those listed or discussed in our Annual
Report on Form 20-F for the year ended December 31, 2005, as well
as the risk that anticipated orders may not materialize or that
orders received may be postponed or canceled, generally without
charges; the volatility in the demand for semiconductors and our
products and services; acts of terrorism and violence; overall
global economic conditions; risks, such as changes in trade
regulations, currency fluctuations, political instability and war,
associated with substantial foreign customers, suppliers and
foreign manufacturing operations; potential instability in foreign
capital markets; the risk of failure to successfully manage our
expanding and more diverse operations; and other key factors that
could adversely affect our businesses and financial performance
contained in our filings and reports, including those with the
United States Securities and Exchange Commission. We are under no
obligation to (and expressly disclaim any such obligation to)
update or alter our forward-looking statements whether as a result
of new information, future events or otherwise. Contacts: Richard
W. Blickman Cor te Hennepe President & CEO Director of Finance
tel. (31) 416 384345 tel. (31) 416 384345 David Pasquale The Ruth
Group tel. (1) 646 536 7006 DATASOURCE: BE Semiconductor Industries
N.V. CONTACT: Richard W. Blickman, President & CEO, (31) 416
384345, Cor te Hennepe, Director of Finance, (31) 416 384345, David
Pasquale, The Ruth Group, +1-646-536-7006, Web site:
http://www.besi.com/
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