NEW
YORK, June 6, 2024 /PRNewswire/ -- The
global semiconductor packaging materials market size is
estimated to grow by USD
9.13 billion from 2024-2028, according to Technavio.
The market is estimated to grow at a CAGR of over 5.3%
during the forecast period. The semiconductor packaging
materials market is experiencing growth due to the increasing
adoption of lead-free packaging, driven by international compliance
standards such as RoHS. Companies are using matte tin and
nickel-palladium-silver alloys as lead substitutes in lead frame
packages. Additionally, SiP packages, which can contain multiple
ICs and passive components in a single package, are gaining
popularity for system integration and cost benefits. Flip-chip
technology, which reduces interconnect length and signal
inductance, is also contributing to market growth. These trends are
expected to continue during the forecast period.
![Technavio has announced its latest market research report titled Global semiconductor packaging materials market 2024-2028 Technavio has announced its latest market research report titled Global semiconductor packaging materials market 2024-2028](https://mma.prnewswire.com/media/2430978/Technavio_has_announced_its_latest_market_research_report_titled_Global_semiconductor_packaging_mate.jpg)
Get detailed analysis on regions,market segments,
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report
Forecast
period
|
2024-2028
|
Base Year
|
2023
|
Historic
Data
|
2018 - 2022
|
Segment
Covered
|
Material (Organic
substrates, Lead frames, Bonding wires, Ceramic packages, and
Others), End-user (Consumer electronics, Automotive, Medical
devices, Communication and telecom, and Others), and Geography
(APAC, North America, Europe, South America, and Middle East and
Africa)
|
Region
Covered
|
APAC, North America,
Europe, South America, and Middle East and Africa
|
Key companies
profiled
|
Amkor Technology Inc.,
ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES
INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus
Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium
Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and
CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp.,
Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan
SEMICONDUCTOR CO. LTD., and Texas Instruments Inc.
|
Key Market Trends Fueling Growth
The Semiconductor Packaging Materials market is experiencing
significant growth due to the increasing demand for advanced
electronic devices. Dielectrics, substrates, and encapsulants are
key packaging materials used in this industry. Notable trends
include the use of advanced materials like organics and polymers
for substrates, and the adoption of chip-on-film and flip chip
packaging technologies.
Leadframe materials, such as copper and lead, are also in high
demand. Solder materials play a crucial role in the assembly
process, while adhesives ensure the reliability and durability of
the packages. The market is expected to continue its upward
trajectory, driven by the need for smaller, faster, and more
energy-efficient devices.
Market Challenges
- The semiconductor packaging materials market faces challenges
due to the increasing cost of manufacturing ICs. With the demand
for compact ICs and new 3D packaging solutions, fabrication plants
require expensive equipment. The complex manufacturing process and
higher probability of defects add to the overall cost.
- Rapid technology advances in the semiconductor industry further
increase equipment costs. As a result, companies are outsourcing
fabrication to specialized foundries, reducing potential customers
for packaging materials vendors. This trend could impact the
market's growth during the forecast period.
- The semiconductor packaging materials market faces several
challenges in delivering advanced solutions. Dielectrics, such as
silicon oxide and silicon nitride, are crucial for insulation and
protection. However, their high cost and limited thermal stability
pose challenges. Ceramics and composites are alternatives, offering
better thermal properties but with challenges in uniformity and
consistency. Soldering materials, like solder pastes and preforms,
ensure reliable electrical connections.
- Yet, the need for high-temperature and low-melting-point
materials creates challenges. Adhesives, like epoxies and
silicones, bond various components together. However, ensuring
compatibility with different materials and maintaining reliability
over time remains a challenge. Overall, the semiconductor packaging
materials market requires continuous innovation to address these
challenges and deliver high-performance, cost-effective, and
reliable solutions.
Research report provides comprehensive data on
impact of trend, driver and challenges - Download a
Sample Report
Segment Overview
- Material
- 1.1 Organic substrates
- 1.2 Lead frames
- 1.3 Bonding wires
- 1.4 Ceramic packages
- 1.5 Others
- End-user
- 2.1 Consumer electronics
- 2.2 Automotive
- 2.3 Medical devices
- 2.4 Communication and telecom
- 2.5 Others
- Geography
- 3.1 APAC
- 3.2 North America
- 3.3 Europe
- 3.4 South America
- 3.5 Middle East and
Africa
1.1 Organic substrates- The organic substrates
market for semiconductor packaging materials is projected to expand
significantly during the forecast period. These materials serve as
the foundation for individual semiconductor devices and ICs,
requiring them to be efficient conductors of electricity and thin
for use in demanding applications. Organic substrates, surrounded
by low-loss and ultra-thin dielectric materials, are increasingly
preferred over lead frames and bonding wires due to their
flexibility as interconnects.
Samsung Electro-Mechanics is a key vendor offering advanced
organic substrates for various industries, including mobile
devices, automotive, and IoT, featuring build-up layers and
high-density interconnections. The increasing demand for
semiconductor packaging will fuel the growth of the organic
substrates segment in the global semiconductor packaging materials
market.
For more information on market segmentation with
geographical analysis including forecast (2024-2028) and historic
data (2018 - 2022) - Download a Sample Report
Research Analysis
The Semiconductor Packaging Materials Market encompasses various
components essential for the production of semiconductor packages.
These materials include Packaging Technologies, such as Liquid
Encapsulation and Wafer Bonding. Leadframes and Substrates, like IC
Substrates and Tape Substrates, serve as the foundation for
semiconductor devices. Encapsulation Resins and Die Attach
Materials ensure the protection and attachment of semiconductor
dies. Underfill Materials enhance the reliability and durability of
semiconductor packages.
Bonding Wires and Solder Balls facilitate the interconnection of
semiconductor components. Photopolymer Films and Electroless
Plating contribute to the production process through their role in
photolithography and electroless deposition, respectively.
Dielectric Materials provide insulation and electrical separation
within semiconductor packages. Through-Silicon Vias enable the
vertical interconnection of semiconductor layers. Collectively,
these materials play a crucial role in the semiconductor industry,
driving innovation and advancements in technology.
Market Research Overview
The Semiconductor Packaging Materials market encompasses various
components used in the production and protection of semiconductor
devices. These materials include adhesives, encapsulants,
underfills, substrates, and solder materials. Adhesives are used to
attach components to the substrate, while encapsulants provide
protection to the semiconductor die.
Underfills fill the gaps between the die and the substrate,
ensuring proper electrical connection. Substrates serve as the base
for the semiconductor components, while solder materials are used
to connect the semiconductor die to the package pins. The use of
these materials is essential in the semiconductor industry to
ensure the functionality and reliability of electronic devices.
Table of Contents:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation
- Material
-
- Organic Substrates
- Lead Frames
- Bonding Wires
- Ceramic Packages
- Others
- End-user
-
- Consumer Electronics
- Automotive
- Medical Devices
- Communication And Telecom
- Others
- Geography
-
- APAC
- North America
- Europe
- South America
- Middle East And Africa
7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix
About Technavio
Technavio is a leading global technology research and advisory
company. Their research and analysis focuses on emerging market
trends and provides actionable insights to help businesses identify
market opportunities and develop effective strategies to optimize
their market positions.
With over 500 specialized analysts, Technavio's report library
consists of more than 17,000 reports and counting, covering 800
technologies, spanning across 50 countries. Their client base
consists of enterprises of all sizes, including more than 100
Fortune 500 companies. This growing client base relies on
Technavio's comprehensive coverage, extensive research, and
actionable market insights to identify opportunities in existing
and potential markets and assess their competitive positions within
changing market scenarios.
Contacts
Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/
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SOURCE Technavio