Ansoft Releases TPA v4.2 with Seamless Integration to Synopsys' Encore; IC Package Designers Accurately Characterize Designs wit
July 13 2005 - 3:15PM
Business Wire
Ansoft Corporation (NASDAQ:ANST) announces Turbo Package
Analyzer(TM) (TPA) v4.2. This latest version combines new
bidirectional integration with Synopsys' Encore(TM) package-design
software with Ansoft's state-of-the-art 3D electromagnetic
simulation. It enables full parasitic extraction of complex IC
packages, such as ball-grid arrays (BGAs). "As a result of our
close collaboration, Ansoft's advanced electromagnetic technology
for package extraction and characterization can be accessed
directly from our Encore product today," said Kevin Rinebold,
Synopsys' senior technical marketing manager, Packaging Products.
"Our work with Ansoft further advances the state of the art in
package planning and design by integrating Ansoft's latest
capabilities with our IC/Package co-design environment." With
AnsoftLinks(TM), a tool for simplifying data import and export
between EDA and CAD packages, TPA v4.2 will generate resistance,
inductance and capacitance (RLC) models directly from popular
package design tools. It accepts CAD data and fully characterizes
the entire package in three dimensions. The 3D analysis provided by
the TPA v4.2 extraction engine can solve any BGA package structure,
including wirebonds, pads, vias, tapered traces, solder balls and
non-ideal power and ground structures. For crosstalk simulations,
TPA v4.2 automatically provides a multi-conductor coupled RLC model
for each lead in the package. The user specifies the number of
nearby (adjacent) leads for coupling, and the program automatically
calculates all of the parasitics. -0- *T TPA highlights include: --
RLC extraction via 3D field solvers -- Ansoft's state-of-the-art 3D
field-solver technology -- Fast Multipole Method for lumped
parasitics -- Full package extraction via automatic partitioning --
Automatic partitioning via coupling length -- Power and ground
plane inclusion -- Robust and automatic meshing -- Critical net
analysis -- Seamless integration of TPA within Synopsys Encore --
Including bondwires and solder balls -- File export in Synopsys
SNPS and SPEF formats -- Outputs RLC, SPICE, IBIS .pkg -- Package
layout support through AnsoftLinks(TM) for Cadence and Zuken *T
Pricing and Availability: TPA v4.2 is available for Windows(R) and
SUN/Solaris. Contact your nearest Ansoft sales office for pricing
information. To download a high-resolution image, please go to
ftp://ftp.ansoft.com/techsup/download/web/primg/tpa42.tif. About
Ansoft Ansoft is a leading developer of high-performance electronic
design automation (EDA) software. Engineers use Ansoft software to
design state-of-the-art electronic products, such as cellular
phones, Internet-access devices, broadband networking components
and systems, integrated circuits (ICs), printed circuit boards
(PCBs), automotive electronic systems and power electronics. Ansoft
markets its products worldwide through its own direct sales force
and has comprehensive customer-support and training offices
throughout North America, Asia and Europe. To learn more, please
visit www.ansoft.com.
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