Bruker Announces Three Next-Generation Semiconductor Metrology Products
July 10 2012 - 9:00AM
Business Wire
Today at SEMICON West 2012, Bruker announced three new 450mm
X-Ray and AFM semiconductor metrology products to support the
industry’s transition to larger wafer production. These new
products include the InSight-450 3DAFM from Bruker’s Nano
Surfaces division and both the next generation of the D8
FABLINE and the new S8 FABLINE-T X-ray systems from
Bruker’s AXS division. All three metrology systems are designed to
meet the industry roadmap challenges at future technology nodes on
the larger 450mm wafer size, enabling both greater product
capability and reliability for semi development and production
facilities.
Eliminating the need for model setup, and providing TEM-like
accuracy in fractions of the time without wafer damage, Bruker’s
automated atomic force microscopes (AFMs) have proven essential
tools for critical technology development and continued process
control in production since 200mm wafer development. Similarly,
Bruker’s X-ray metrology has a long tradition of providing a
reliable, accurate and non-contact method of characterizing various
essential semi parameters without the need to use a reference. The
wafer size transition from 300mm to 450mm represents another
critical technology inflection point that is now supported by
Bruker’s core metrology technologies.
“Bruker’s significant commitment to the SEMI industry is
embodied in these three exciting new 450mm-compatible products,”
stated Bruker AXS division president Dr. Frank Burgäzy. “Both X-Ray
and high-resolution AFM technologies have been identified by the
2011 International Technology Roadmap as critical for the success
of future semiconductor technology nodes, and Bruker is uniquely
placed with our technologies to address these future needs. We are
very pleased to be part of this critical wafer size transition, and
feel that these systems are another indication of our continuing
determination to enable the steady advance of semiconductor
technology with production-worthy X-ray and AFM metrology
solutions.”
About the InSight-450 3DAFM
Based on the production-proven InSight 3DAFM platform for
300mm, the InSight-450 3DAFM is ideally suited for a broad
range of roughness, depth and CD applications. Capabilities include
bare wafer process validation, roughness characterization and
pit/bump/scratch defect metrology; incoming substrate
qualification; thin film and epitaxial deposition performance with
micro/nano roughness and angstrom-level step height precision; etch
depth metrology for process development and control, in-line resist
profile measurements of CD, SWA, and LER with full TEM-like
profiles; and CMP flatness performance to monitor dishing and
erosion. The flexibility of the InSight 450mm AFM means all of
these applications are available in a single tool, thus reducing
overall cost for metrology. The InSight-450 3DAFM provides
this capability with no modeling required, full NIST traceability
and no material or wafer damage, making it the ideal tool to
provide early learning in 450mm process development with
scalability to 450mm production.
About the FABLINE X-ray Systems
Bruker continues its industry leadership in X-ray metrology with
the next-generation D8 FABLINE, which is equipped with the
latest high-brilliance X-ray sources, detector technology and
user-friendly software for improved data analysis. The system
provides a broad range of in-line, thin film X-ray measurements for
FEOL and BEOL process monitoring on blanket or product wafers. It
is ideally suited for determining thickness, composition and strain
in SiGe, SiC, SOI, III_V on Si, as well as composition and
thickness for metal films and stacks, including ALD layers. Bruker
has also developed the new S8 FABLINE-T TXRF (Total X-ray
Reflection Fluorescence) for non-destructive trace metal and light
element contamination analysis in order to continue the penetration
into the semiconductor market. New and emerging device processing
creates metal contamination control challenges for IC manufacturing
and the latest state-of-the-art of X-ray instrumentation will be
required to face these challenges. Together, these latest FABLINE
products provide the most advanced X-ray metrology systems for
semiconductor production floors and fabs.
About Bruker Corporation (NASDAQ: BRKR)
Bruker Corporation is a leading provider of high-performance
scientific instruments and solutions for molecular and materials
research, as well as for industrial and applied analysis. For more
information about Bruker Corporation, please visit
www.bruker.com.
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