Jabil Expands Silicon Photonics Capabilities to Enable Next-Generation AI and Data Center Technologies
September 23 2024 - 7:00AM
Business Wire
Broadened offerings at Ottawa, Canada, site
to support customers’ silicon photonics new product
introductions
Jabil Inc. (NYSE: JBL), a global leader in design,
manufacturing, and supply chain solutions, today announced its
continued investment in silicon photonics-based products and
capabilities to support the increasing demands of hyperscalers and
next-wave cloud and AI data center growth. The company is set to
roll out additional capabilities at its Ottawa, Canada, site in the
fourth calendar-year quarter of 2024 to support customers’ advanced
photonics packaging new product introductions (NPIs).
The new product introduction (NPI) line will feature innovative
capabilities designed to assist photonics customers quickly scale
from proof of concept to mass production, such as fluxless
flip-chip, fiber attachment, precise die bonding, and wire bonding.
These advancements will support silicon photonics chip packaging,
particularly in high-speed connectivity applications such as
co-packaged optics (CPO) and high-speed on-board connections. By
leveraging Jabil’s expertise, customers can benefit from enhanced
performance and reliability in their photonics solutions,
ultimately driving agility and scalability in their operations.
“The expansion of our Ottawa site is a game-changer for Jabil.
This facility will enable us to meet the growing demands for
advanced photonics solutions tailored to AI and next-generation
data centers. Through our NPI capabilities, we can assist customers
in their own product development journeys, significantly reducing
the need for costly trial and error in developing their own
solutions from scratch,” said Matt Crowley, Executive Vice
President, Global Business Units.
Continued Investments in Photonics
Jabil continues to pioneer industry-first “silicon to solutions”
manufacturing approaches that improve the scalability of current
and next-generation photonics, including 800G and 1.6T. The company
also continues to make investments in next-generation silicon
photonic technologies beyond 800G and 1.6T to support AI and cloud
computing, focusing on optimized performance and reduced power
consumption for modern data centers.
Jabil at ECOC 2024
Jabil experts will be on hand at ECOC 2024, held at the Congress
Center Messe Frankfurt in Frankfurt, Germany, Sept. 22–26. The
Jabil team will host live demos of their 800G LPO/LRO transceivers
and showcase their in-progress 1.6T module at Booth B101 and
Meeting Room M on the show floor.
About Jabil:
At Jabil (NYSE: JBL), we are proud to be a trusted partner for
the world's top brands, offering comprehensive engineering,
manufacturing, and supply chain solutions. With over 50 years of
experience across industries and a vast network of over 100 sites
worldwide, Jabil combines global reach with local expertise to
deliver both scalable and customized solutions. Our commitment
extends beyond business success as we strive to build sustainable
processes that minimize environmental impact and foster vibrant and
diverse communities around the globe. Discover more at
www.jabil.com.
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version on businesswire.com: https://www.businesswire.com/news/home/20240923564083/en/
Media Contact Timur Aydin Senior Director, Enterprise
Marketing and Communications publicrelations@jabil.com
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