The advanced, aerospace-grade all-metal coldplates are
engineered to enhance performance, efficiency and
reliability—enabling AI, high-performance computing (HPC) and dense
enterprise workloads.
CALGARY,
AB, May 9, 2024 /PRNewswire-PRWeb/ -- CoolIT
Systems (CoolIT), the world leader in liquid cooling, proudly
announces its groundbreaking OMNI™ All-Metal Coldplates with
Split-Flow™ technology. Engineered to meet demanding AI, HPC, and
dense enterprise workloads, CoolIT's OMNI Coldplates offer
industry-leading performance, reliability and scalability.
CoolIT Systems (CoolIT), the world leader
in liquid cooling, proudly announces its groundbreaking OMNI™
All-Metal Coldplates with Split-Flow™ technology. Engineered to
meet demanding AI, HPC, and dense enterprise workloads, CoolIT's
OMNI Coldplates offer industry-leading performance and
reliability.
Designed to deliver precision cooling for thermal loads
exceeding 1,500 W thermal design power (TDP) and thermal
fluxes over 300 W/cm2, OMNI Coldplates are available for CPUs and
GPUs from NVIDIA, Intel and AMD.
"Our engineering team has raised the bar on our already
industry-leading coldplates," said Patrick
McGinn, Chief Operating Officer of CoolIT. "The new OMNI
platform enables our customers with the superior performance of our
patented Split-Flow technology, while substantially improving their
time-to-market for direct liquid cooling (DLC) programs".
CoolIT's coldplates cool over 5 million CPUs and GPUs worldwide.
The company is scaling coldplate production to meet the
exponentially increasing demand for DLC servers. Driven by
ever-hotter AI chips and increasingly dense computational
workloads, Omdia forecasts the data center liquid cooling market to
grow 44% annually from just over $1B
in 2023 to $4.87B by 2027.
"Our engineering organization is already working closely with
our server OEM and ODM partners to produce OMNI coldplate cooling
loops for their DLC server product lines," commented Kamal Mostafavi, Vice President of Engineering.
"We expect AI, HPC and enterprise systems with OMNI Coldplates to
enter the market starting this summer."
For more information and to receive a preliminary OMNI Coldplate
specification sheet, visit http://www.coolitsystems.com/omni and
visit CoolIT's exhibition booth at ISC High Performance 2024 in
Hamburg, Germany, May 12-16, 2024.
OMNI™ All-Metal Coldplates Key Features:
- Highest Performance. Engineered to handle thermal loads
exceeding 1,500 W TDP and 300 W/cm2, OMNI Coldplates with
Split-Flow™ technology deliver up to 60% lower thermal resistance
compared with standard coldplates.
- Ultra-Robust, Intrinsically Reliable All-Metal Design.
Featuring an aerospace-grade all-metallic unibody construction,
OMNI Coldplates eliminate the risk of differential coefficients of
thermal expansion (CTE) from using multiple materials.
- Ready-to-Scale Design & High-Volume Production. OMNI
Coldplates are available for design-in today and ready for
high-volume production. Shipping at scale is to start from
June 2024.
About CoolIT Systems:
CoolIT Systems specializes in scalable liquid cooling solutions for
the world's most demanding computing environments. In the
high-performance computing, AI, and enterprise data center markets,
CoolIT partners with global processor and server design leaders to
develop the most efficient and reliable liquid cooling solutions
for their leading-edge products. Through its modular Direct Liquid
Cooling technology, CoolIT enables dramatic increases in rack
densities, component performance, and power efficiencies. Together,
CoolIT and its partners are leading the way for the widespread
adoption of high-performance computing.
For more information about CoolIT Systems and its technology, visit
https://www.coolitsystems.com/ and follow @CoolIT Systems on
LinkedIn.
Media Contact
Charles Robison, CoolIT Systems,
+1 403-770-5766, media@coolitsystems.com,
https://www.coolitsystems.com/
Twitter
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SOURCE CoolIT Systems