BANGKOK, Feb. 28,
2024 /PRNewswire/ -- DuPont will present an extensive
range of advanced circuit materials and solutions at Intelligent
Asia Thailand 2024. With an extensive portfolio in signal
integrity, power transmission and thermal management, DuPont will
exhibit in Booth #N309 at EH 100, Bangkok International
Trade & Exhibition Centre (BITEC) from February 29 to March 2.
Artificial Intelligence (AI) is revolutionizing the electronics
industry. DuPont is a one-stop powerhouse for AI-enabling
solutions, offering a wide range of material, chemistry and process
solutions for advanced circuit and packaging applications. DuPont's
scientists and engineers are committed to delivering greater value
to customers and advancing heterogeneous integration for AI and
High-Performance Computing (HPC).
"I am thrilled about DuPont's integrated capabilities to enhance
our leadership position in advanced packaging and printed circuit
board (PCB) industry," said Yuanyuan
Zhou, global business director, DuPont. "Our cutting-edge
solutions in metallization, photoresist and dielectrics provide us
a distinct advantage in meeting the ever-increasing demand for
miniaturization, high-speed performance, and advanced functionality
in the electronics industry. We're equipped to help PCB
manufacturers in Southeast Asia to
stay competitive in this rapidly evolving market."
With the PCB industry's growing investment in Southeast Asia, DuPont's global reach and
strategic partnership with customers support their efforts to
expand operations worldwide. DuPont's advanced packaging, IC
substrate and PCB solutions help address challenges across various
segments, including AI, HPC, consumer electronics, and
high-reliability applications such as automotive and
telecom.
PCBs with fine line patterns are mission critical for modern
automotive and consumer electronics, enabling the integration of
complex circuits into smaller spaces. To ensure reliable function,
automotive manufacturers are increasingly adopting high-density
interconnection (HDI) designs, which are better suited for
densely-packed circuit design. Through offering advanced materials
and chemistry for flex, rigid-flex, and rigid PCBs, DuPont total
solutions for the PCB market enhance efficiency and elevate
performance levels.
Along with the rapid evolution of AI, 5G, Internet of Things,
and autonomous driving technologies, PCB industry faces an
increasing challenge of minimizing insertion loss and maintaining
signal integrity for high-speed and high-frequency signal
transmission applications. Ensuring reliable performance of
electronic devices requires critical PCB signal integrity and
thermal management. DuPont's comprehensive solutions are designed
to address these challenges by enabling low-loss and signal
integrity.
At the show, DuPont experts will be available at the company's
booth to share their extensive knowledge and expertise on
technology advancements and industry trends. Visitors can explore
DuPont total solutions for the PCB market. Product offerings
include:
DuPont™ Copper Gleam™ PPR-II/III pulse acid plating
copper is a new generation electroplating solution
designed for advanced MLB, high-layer count boards, and AI server
station applications. The solution has superior throwing power for
through-hole plating, with better plated thickness distribution on
surface to fulfill fine-line and high reliability
requirements.
DuPont™ Circuposit™ 6800W electroless copper plus
Copper Gleam™ PS-100 flash copper are designed for
enhanced reliability performance in multi-stack micro-via designs,
replacing conventional electroless copper processes. The
combination of a horizontal electroless copper process with a flash
electroplating step creates a more efficient single process
solution.
DuPont™ Riston® DI9500M & DI8600 and FD3000M
dry film photoresist are multi-wavelength DI solutions
designed for use in pitch greater than or equal to 70μm tech/etch
processes for rigid and flex PCBs. These dry film photoresists
provide fine-line capability with excellent resolution and adhesion
performance, improving overall yield for
manufacturers.
DuPont™ Microfill™ EVF-III acid copper is a new
generation via-filling technology designed for fine-line HDI
applications. The solution is highly effective for panel via
filling, providing excellent throwing power for improved
through-hole performance.
DuPont™ Pyralux® AP
flexible copper-clad laminate is a versatile, double-sided
laminate that features an all-polyimide dielectric and DuPont's
unique manufacturing process. This laminate offers exceptional
reliability and reduced transmission loss. With its tailored
combination of properties, it fulfills customers' requirements for
high reliability and high-speed, high-frequency signal
transmission.
DuPont™ Interra® HK04J embedded capacitance
laminate is a thin, buried capacitance laminate that serves as
a power and ground plane in high-speed signal transmission PCBs to
improve power integrity. It excels in power bus decoupling, EMI
reduction, and power plane impedance reduction at high-speed signal
transmission.
Laird™ Tlam™ thermally conductive PCB system is a
thermally conductive insulated metal PCB substrate system designed
for efficient heat dissipation in electronic circuit boards. This
system is suitable for a wide range of applications, including
power supplies, DC-DC converters, LEDs and ballast lighting,
automotive, appliances, and commercial and industrial motor drives,
as well as military and aerospace applications.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with
technology-based materials and solutions that help transform
industries and everyday life. Our employees apply diverse science
and expertise to help customers advance their best ideas and
deliver essential innovations in key markets including electronics,
transportation, construction, water, healthcare and worker safety.
More information about the company, its businesses and solutions
can be found at www.dupont.com. Investors can access information
included on the Investor Relations section of the website at
investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and
service marks denoted with ™, SM or ® are owned by affiliates
of DuPont de Nemours, Inc. unless otherwise noted.
View original content to download
multimedia:https://www.prnewswire.com/news-releases/dupont-showcases-innovative-advanced-circuit-materials-at-intelligent-asia-2024-302073403.html
SOURCE DuPont