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| Volume | 16,560 |
|
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| News | (4) |
| Share Name | Share Symbol | Market | Stock Type |
|---|---|---|---|
| ChipMOS Technologies Inc | IMOS | NASDAQ | Depository Receipt |
| Price Change | Price Change % | Share Price | Last Trade
|
|
|---|---|---|---|---|
| -0.25 | -0.91% | 27.35 | 19:00:00 |
| Open Price | Low Price | High Price | Close Price | Previous Close |
|---|---|---|---|---|
| 27.75 | 27.35 | 27.96 | 27.35 | 27.60 |
| Trades | Shares Traded | VWAP | Financial Volume | Average Volume |
|---|---|---|---|---|
| 224 | 16,560 | 27.71 | 458,808 | - |
| Last Trade | Type | Quantity | Price | Currency |
|---|---|---|---|---|
| 17:12:25 | 3 | 28.14 | USD |
ChipMOS Technologies Inc Financials
| Market Cap | Shares in Issue | Float | Revenue | Profit/Loss | EPS | PE Ratio |
|---|---|---|---|---|---|---|
| 0 | 0.00 | - | 21.36B | 1.89B | - | - |
| Short Interest | Dividends Per Share | Dividend Yield | Ex-Div Date | Insider B/S | Insider % Owned |
|---|---|---|---|---|---|
| - | - | - | - |
News ChipMOS Technologies
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IMOS Historical
| Period †| Open | High | Low | VWAP | Avg. Daily Vol | Change | % |
|---|---|---|---|---|---|---|---|
| 1 Week | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 1 Month | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 3 Months | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 6 Months | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 1 Year | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 3 Years | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 5 Years | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| ChipMOS TECHNOLOGIES Inc provides semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers, and foundries. Back-end testing services are offered for high-density memory, mixed-signal, and liquid crystal display driver semiconductors. Packaging and testing operations are held in Taiwan, but services are offered to a global client base. Testing solutions are carried out for the complete spectrum of integrated circuits, including digital logic, ASIC, high-speed digital, memory, mixed-signal, and LCD devices. Customers seeking package solutions are also offered a diverse group of options that include leadframe-based packages, substrate-based packages, and others. |
