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Period:
Draw Mode:
| Volume | 9,653 |
|
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| News | - |
| Share Name | Share Symbol | Market | Stock Type |
|---|---|---|---|
| ChipMOS Technologies Inc | IMOS | NASDAQ | Depository Receipt |
| Price Change | Price Change % | Share Price | Last Trade
|
|
|---|---|---|---|---|
| 0.09 | 0.32% | 28.43 | 19:00:00 |
| Open Price | Low Price | High Price | Close Price | Previous Close |
|---|---|---|---|---|
| 28.43 | 28.42 | 28.61 | 28.43 | 28.34 |
| Trades | Shares Traded | VWAP | Financial Volume | Average Volume |
|---|---|---|---|---|
| 307 | 9,653 | 28.50 | 275,077 | - |
| Last Trade | Type | Quantity | Price | Currency |
|---|---|---|---|---|
| 17:25:45 | 1 | 28.42 | USD |
ChipMOS Technologies Inc Financials
| Market Cap | Shares in Issue | Float | Revenue | Profit/Loss | EPS | PE Ratio |
|---|---|---|---|---|---|---|
| 0 | 0.00 | - | 21.36B | 1.89B | - | - |
| Short Interest | Dividends Per Share | Dividend Yield | Ex-Div Date | Insider B/S | Insider % Owned |
|---|---|---|---|---|---|
| - | - | - | - |
News ChipMOS Technologies
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IMOS Historical
| Period † | Open | High | Low | VWAP | Avg. Daily Vol | Change | % |
|---|---|---|---|---|---|---|---|
| 1 Week | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 1 Month | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 3 Months | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 6 Months | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 1 Year | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 3 Years | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| 5 Years | 0.00 | 0.00 | 0.00 | 0.00 | 0 | 0.00 | 0.00% |
| ChipMOS TECHNOLOGIES Inc provides semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers, and foundries. Back-end testing services are offered for high-density memory, mixed-signal, and liquid crystal display driver semiconductors. Packaging and testing operations are held in Taiwan, but services are offered to a global client base. Testing solutions are carried out for the complete spectrum of integrated circuits, including digital logic, ASIC, high-speed digital, memory, mixed-signal, and LCD devices. Customers seeking package solutions are also offered a diverse group of options that include leadframe-based packages, substrate-based packages, and others. |
