Extends PAM4 Connectivity Leadership to Scale
Next Generation AI Server Compute Fabrics
SANTA
CLARA, Calif., Oct. 15,
2024 /PRNewswire/ -- OCP Global Summit –
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data
infrastructure semiconductor solutions, demonstrates its
industry-leading 3nm PCIe Gen 7 connectivity at the OCP Global
Summit, October 15-17, at the
San Jose Convention Center.
PCIe Gen 7 doubles data transfer speeds, enabling continued
scaling of compute fabrics inside accelerated server platforms,
general-purpose servers, CXL systems and disaggregated
infrastructure. Building on its widely deployed PAM4 technology and
utilizing its industry-leading accelerated infrastructure silicon
platform, Marvell has developed the industry's most comprehensive
interconnect portfolio addressing all high-bandwidth optical and
copper connections in AI data centers. This innovative portfolio
empowers cloud data center operators to optimize their
infrastructure for their specific architectures and workloads to
meet the exponential demands of AI.
Marvell pioneered PAM4 technology over a decade ago and leads
the industry in PAM4 interconnect shipments. Today, most of the
optical interconnects used in data center backend and frontend
networks are based on PAM4 technology. As compared to PCIe Gen 5,
which was based on NRZ modulation, PCIe Gen 6 and 7 require the use
of PAM4 modulation. With its recent PCIe Gen 6 retimer
announcement and this PCIe Gen 7 demonstration, Marvell
extends its industry-leading PAM4-based optical and copper
interconnect portfolio beyond Ethernet and InfiniBand into copper
and optical PCIe, CXL and proprietary compute fabric links.
The increasing performance of processors and accelerators
combined with the growing size of AI clusters is prompting the need
for greater bandwidth speed and capacity. PCIe Gen 7 will enable
larger volumes of data to be exchanged between processors to reduce
the cost, time and energy required for training or inference. PCIe
is the industry standard for inside-server-system connections
between CPUs, GPUs, AI accelerators, and other server components.
AI models are doubling their computation requirements every six
months and are now the primary driver of the PCIe roadmap,
with PCIe Gen 7 becoming a requirement.
"AI workloads are driving the evolution of server interconnects,
and our PCIe Gen 7 technology is engineered to meet the performance
and scalability needs of next-generation AI data centers," said
Venu Balasubramonian, vice president
of product marketing, Connectivity Business Unit at Marvell. "Our
leadership in PAM4 SerDes technology in advanced process nodes
enables us to deliver superior performance, low latency, and
industry-leading performance, power and latency, providing a
critical foundation for accelerated infrastructure."
PCIe Gen 7, operating at 128 gigatransfers per second (GT/s) per
lane, enables AI and ML workloads to scale across compute fabrics.
It delivers the high performance, low latency, and energy
efficiency needed to power next-generation AI clusters,
high-performance computing (HPC) systems, and cloud data
centers.
Marvell PCIe Gen 7 SerDes is designed using 3nm fabrication
technology enabling lower power consumption while delivering
superior reach and link margins, that are critical for emerging AI
super clusters. SerDes and parallel interconnects serve as
high-speed pathways for exchanging data between chips. A rack in a
hyperscale data center can contain up to tens of thousands of
SerDes links.
Extending PAM4 Leadership
Leveraging its PAM4 SerDes
technology leadership and its comprehensive data infrastructure IP,
Marvell has created a state-of-the-art connectivity platform that
enables leading cloud data center operators to optimize their
infrastructure for their unique architectures and workloads. In
2023, Marvell introduced the Marvell® Nova DSP, the
industry's first 1.6T PAM4 DSP. Marvell has also introduced
integrated PAM4 DSPs (Marvell® Perseus) and DSPs
optimized for efficiency (Marvell® Spica Gen2-T) to
serve the broadening spectrum of cloud data center link types and
use cases. PAM4 technology is also the foundation of the
Marvell® Alaska® A
DSP chips optimized for active electrical cable (AEC)
applications.
Marvell at the 2024 OCP Global Summit
Join Marvell in
booth B1 at the 2024 OCP Global Summit, October 15-17, in San
Jose, California.
About Marvell
To deliver the data infrastructure
technology that connects the world, we're building solutions on the
most powerful foundation: our partnerships with our customers.
Trusted by the world's leading technology companies for over 25
years, we move, store, process and secure the world's data with
semiconductor solutions designed for our customers' current needs
and future ambitions. Through a process of deep collaboration and
transparency, we're ultimately changing the way tomorrow's
enterprise, cloud, automotive, and carrier architectures
transform—for the better.
Marvell and the M logo are trademarks of Marvell or its
affiliates. Please visit www.marvell.com for a complete list
of Marvell trademarks. Other names and brands may be claimed as the
property of others.
This press release contains forward-looking statements within
the meaning of the federal securities laws that involve risks and
uncertainties. Forward-looking statements include, without
limitation, any statement that may predict, forecast, indicate or
imply future events, results or achievements. Actual events,
results or achievements may differ materially from those
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described in the "Risk Factors" section of our Annual Reports on
Form 10-K, Quarterly Reports on Form 10-Q and other documents filed
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speak only as of the date they are made. Readers are cautioned not
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For further information, contact:
Kim Markle
pr@marvell.com
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