Demo at DesignCon 2024 Highlights Spectra7's
GC1122 Chips Embedded in ACES OSFP High Speed Cable
Assemblies
SAN
JOSE, Calif., Feb. 7, 2024
/CNW/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc.
("Spectra7" or the "Company"), a leading provider of
high-performance analog semiconductor products for broadband
connectivity markets, and ACES Electronics Co., Ltd
("ACES"), a leading Taiwan-based connector and cable supplier,
announced that they successfully demonstrated best-in-class
performance of 800G Active Copper Cables (ACC's) at this year's
annual DesignCon Conference Exhibition held last week in
Santa Clara, California.
In the demonstration, ACES 800Gbps OSFP ACCs with Spectra7's
embedded GC1122 chips successfully interoperated with test
equipment from several vendors to produce very robust low pre-FEC
bit error rates (BERs) significantly below standard required
BER.
"We are extremely proud to be working with ACES to broaden
access to our 800G ACC solutions using Spectra7's innovative
GaugeChangerâ„¢ integrated chips," said Spectra7 CEO Raouf Halim. "We are delighted to have showcased
our technology with them at DesignCon 2024. "
Spectra7's analog based GaugeChangerâ„¢ GC1122 chips are used
in ACCs and offer significant cost, size, latency and energy
consumption value versus competing Active Electrical Cables (AECs)
and Active Optical Cables (AOCs) that use Digital Signal Processing
(DSP) technologies.
ABOUT ACES
ACES is a world leader in high precision electrical and
electronic connectors, electro-mechanical assemblies, and specialty
cable products in diversified industries, including notebooks,
peripherals for consumer electronics, handheld mobile communication
devices, automobiles electronics, cloud servers, and industrial
control. Products include precision connectors, micro coaxial
cables, electronic cables, USB/IO connectors and cables, Type C
connectors and cables, power connectors, card edge connectors,
high-power connectors, high-speed connectors and cables, automobile
electronic connectors and cables, wireless RF connectors and
cables, stamping parts and other components. ACES designs,
manufactures and assembles its products at research and development
and manufacturing facilities in Taiwan, China, the
Philippines, Vietnam,
Japan and the USA.
For more information, please visit http://www.acesconn.com/
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high-performance analog
semiconductor company delivering unprecedented bandwidth, speed and
resolution to enable disruptive industrial design for leading
electronics manufacturers in virtual reality, augmented reality,
mixed reality, data centers and other connectivity markets.
Spectra7 is based in San Jose,
California with a design center in Cork, Ireland and a technical support location
in Dongguan, China. For more
information, please visit www.spectra7.com.
Neither the TSX Venture Exchange nor its regulation services
provider (as that term is defined in the policies of the TSX
Venture Exchange) accepts responsibility for the adequacy or
accuracy of this release.
CAUTIONARY NOTES
Certain statements contained in this press
release constitute "forward-looking statements". All statements
other than statements of historical fact contained in this press
release, including, without limitation, the Company's strategy,
plans, objectives, goals and targets, and any statements preceded
by, followed by or that include the words "believe", "expect",
"aim", "intend", "plan", "continue", "will", "may", "would",
"anticipate", "estimate", "forecast", "predict", "project", "seek",
"should" or similar expressions or the negative thereof, are
forward-looking statements. These statements are not historical
facts but instead represent only the Company's expectations,
estimates and projections regarding future events. These statements
are not guarantees of future performance and involve assumptions,
risks and uncertainties that are difficult to predict. Therefore,
actual results may differ materially from what is expressed,
implied or forecasted in such forward-looking statements.
Additional factors that could cause actual results, performance or
achievements to differ materially include, but are not limited to,
the risk factors discussed in the Company's management's discussion
and analysis for the year ended December 31,
2022. Management provides forward-looking statements because
it believes they provide useful information to investors when
considering their investment objectives and cautions investors not
to place undue reliance on forward-looking information.
Consequently, all of the forward-looking statements made in this
press release are qualified by these cautionary statements and
other cautionary statements or factors contained herein, and there
can be no assurance that the actual results or developments will be
realized or, even if substantially realized, that they will have
the expected consequences to, or effects on, the Company. These
forward-looking statements are made as of the date of this press
release and the Company assumes no obligation to update or revise
them to reflect subsequent information, events or circumstances or
otherwise, except as required by law.
For more information, please contact:
Matt Kreps
Darrow Associates
214-597-8200
ir@spectra7.com
Spectra7 Microsystems Inc.
Dave Mier
Interim Chief Financial Officer
925-858-7011
ir@spectra7.com
Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com
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SOURCE Spectra7 Microsystems Inc.