More than 15 Product Families of Completely
Upgraded Servers Optimized for Maximum Performance or Efficiency,
Featuring Next-Generation GPU Support, Higher-Bandwidth Memory,
400GbE Networking, E1.S and E3.S Drives, and
Direct-to-Chip Liquid Cooling Support, and are Based on the New
Intel® Xeon® 6900 Series Processors with P-Cores and Intel Xeon
6700 Series Processors with E-cores
SAN
JOSE, Calif., Sept. 24,
2024 /PRNewswire/ -- Supermicro, Inc. (NASDAQ:
SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage,
and 5G/Edge, today adds new maximum performance GPU, multi-node,
and rackmount systems to the X14 portfolio, which are based on the
Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed
Granite Rapids-AP). The new industry-leading selection of
workload-optimized servers addresses the needs of modern data
centers, enterprises, and service providers. Joining the
efficiency-optimized X14 servers leveraging the Xeon 6700 Series
Processors with E-cores launched in June
2024, today's additions bring maximum compute density and
power to the Supermicro X14 lineup to create the industry's
broadest range of optimized servers supporting a wide variety of
workloads from demanding AI, HPC, media, and virtualization to
energy-efficient edge, scale-out cloud-native, and microservices
applications.
"Supermicro X14 systems have been completely re-engineered to
support the latest technologies including next-generation CPUs,
GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0,
and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro.
"Not only can we now offer more than 15 families, but we can also
use these designs to create customized solutions with complete rack
integration services and our in-house developed liquid cooling
solutions."
Approved customers can obtain early access to complete,
full-production systems via Supermicro's Early Ship Program or for
remote testing with Supermicro JumpStart.
These new Supermicro X14 systems feature completely re-designed
architectures, including all-new 10U and multi-node form factors
that support next-generation GPUs and higher CPU core densities,
updated memory slot configurations with 12 memory channels per CPU
and new MRDIMMs, which provide up to 37% better memory bandwidth
compared to DDR5 DIMMs.
The new Supermicro X14 family comprises a number of new systems
—several of which are completely new architectures—in three
distinct, workload-specific categories:
- GPU-optimized platforms designed for pure performance and
enhanced thermal capacity to support the latest technology and
highest-wattage GPUs. System architectures are built from the
ground up for large-scale AI training, LLMs, generative AI, 3D
media, and virtualization applications.
- High compute-density multi-nodes including all-new
FlexTwin™,SuperBlade®, and GrandTwin®, which leverage resources
such as shared power and cooling to increase efficiency, as well as
direct-to-chip liquid cooling on specific models to maximize
density without compromising on performance.
- Market-proven Supermicro Hyper rackmounts combine single or
dual socket architectures with flexible I/O and storage
configurations in traditional form factors to help enterprises and
data centers scale up and out as their workloads evolve.
Supermicro's new max-performance X14 systems support the new
Intel Xeon 6900 series processors with P-cores, while X14
efficiency-optimized systems support the Intel Xeon 6700 series
processors with E-cores, which launched in June 2024. These systems will also offer socket
compatibility with the upcoming Intel Xeon 6900 series processors
with E-cores and Intel Xeon 6700 series processors with P-cores in
Q1'25 to provide an additional dimension of flexibility when
optimizing systems for either performance-per-core or
performance-per-watt.
"For the first time, Intel is offering two distinct,
workload-optimized families of Xeon processors in the same
generation, each designed to deliver specific performance and
efficiency profiles that can shorten time-to-results, revolutionize
compute, power and rack density, maximizing ROI for modern data
centers," said Ryan Tabrah, VP and
GM of Xeon Products at Intel. "With the new additions, Supermicro
will be able to provide their customers with even more choice with
the introduction of these new performance optimized CPUs for AI and
compute-intensive workloads."
When configured with Intel Xeon 6900 series processors with
P-cores, Supermicro systems support new FP16 instructions on the
built-in Intel® AMX accelerator to further enhance AI workload
performance. These systems include 12 memory channels per CPU with
support for both DDR5-6400 and MRDIMMs up to 8800MT/s, CXL 2.0, and
feature more extensive support for high-density, industry-standard
EDSFF E1.S and E3.S NVMe drives.
Supermicro Liquid Cooling Solutions
Complementing this expanded X14 product portfolio are
Supermicro's rack-scale integration and liquid cooling
capabilities. With an industry-leading global manufacturing
capacity, extensive rack-scale integration and testing facilities,
and a comprehensive suite of management software solutions,
Supermicro designs, builds, tests, validates, and delivers complete
data center solutions at any scale in a matter of weeks.
Supermicro offers a complete in-house developed liquid cooling
solution including cold plates for CPUs, GPUs, memory, Cooling
Distribution Units, Cooling Distribution Manifolds, hoses,
connectors, and cooling towers. Liquid cooling is easily included
in rack-level integrations to increase system efficiency, reduce
instances of thermal throttling, and lowers both the TCO and Total
Cost to the Environment (TCE) of data center deployments.
New Supermicro max-performance X14 systems featuring Intel
Xeon 6900 series processors with P-cores include:
GPU-optimized – The highest performance Supermicro
X14 systems designed for large-scale AI training, large language
models (LLMs), generative AI and HPC, and supporting eight of the
latest-generation SXM5 and SXM6 GPUs. These systems are available
in air-cooled or liquid-cooled configurations.
PCIe GPU – Designed for maximum GPU flexibility,
supporting up to 10 double-width PCIe 5.0 accelerator cards in a
thermally-optimized 5U chassis. These servers are ideal for AI
inferencing, media, collaborative design, simulation, cloud gaming,
and virtualization workloads.
Intel® Gaudi® 3 AI Accelerators – Supermicro also plans
to deliver the industry's first AI server based on the Intel Gaudi
3 accelerator hosted by Intel Xeon 6 processors. The system is
expected to increase efficiency and lower the cost of large-scale
AI model training and AI inferencing. The system features eight
Intel Gaudi 3 accelerators on an OAM universal baseboard, six
integrated OSFP ports for cost-effective scale-out networking, and
an open platform designed to use a community-based, open-source
software stack, requiring no software licensing costs.
SuperBlade® - Supermicro's X14 6U high-performance,
density-optimized, and energy-efficient SuperBlade maximizes rack
density, with up to 100 servers and 200 GPUs per rack. Optimized
for AI, HPC, and other compute-intensive workloads, each node
features air cooling or direct-to-chip liquid cooling to maximize
efficiency and achieve the lowest PUE with the best TCO, as well as
connectivity up to four integrated Ethernet switches with 100G
uplinks and front I/O supporting a range of flexible networking
options up to 400G InfiniBand or 400G Ethernet per node.
FlexTwin™ - The new Supermicro X14 FlexTwin
architecture is purpose-built for HPC, cost-efficient, and designed
to provide maximum compute power and density in a multi-node
configuration with up to 24,576 performance cores in a 48U rack.
Optimized for HPC and other compute-intensive workloads, each node
features direct-to-chip liquid cooling only to maximize efficiency
and reduce instances of CPU thermal throttling, as well as HPC low
latency front and rear I/O supporting a range of flexible
networking options up to 400G per node.
Hyper - X14 Hyper is Supermicro's flagship rackmount
platform designed to deliver the highest performance for demanding
AI, HPC, and enterprise applications, with single or dual socket
configurations supporting double-width PCIe GPUs for maximum
workload acceleration. Both air cooling and direct-to-chip liquid
cooling models are available to facilitate the support of top-bin
CPUs without thermal limitations and reduce data center cooling
costs while also increasing efficiency.
Also, now shipping are Supermicro's X14
efficiency-optimized systems featuring Intel Xeon 6700 series
processors with E-cores:
SuperBlade® – Supermicro's high-performance,
density-optimized, and energy-efficient multi-node platform
optimized for AI, Data Analytics, HPC, Cloud, and Enterprise
workloads. Available as a 6U enclosure with 10 or 5 nodes, or an 8U
enclosure with 20 or 10 nodes, one rack can feature up to 34,560
Xeon compute cores.
Hyper – Flagship performance rackmount servers
designed for scale-out cloud workloads, with storage & I/O
flexibility that provides a custom fit for a wide range of
application needs.
CloudDC – All-in-one platform for cloud data
centers, based on the OCP Data Center Modular Hardware System
(DC-MHS) with flexible I/O and storage configurations and dual AIOM
slots (PCIe 5.0; OCP 3.0 compliant) for maximum data
throughput.
Petascale Storage – Industry-leading all-flash
storage density and performance with EDSFF E1.S and E3.S drives,
allowing unprecedented capacity and performance in a 1U or 2U
chassis.
WIO – Offers flexible I/O configurations in a
cost-effective architecture to enable optimization of acceleration,
storage, and networking alternatives to accelerate performance,
increase efficiency and find the perfect fit for specific
enterprise applications.
BigTwin® – 2U 2-Node or 2U 4-Node platform providing
superior density, performance, and serviceability with dual
processors per node and hot-swappable tool-less design. These
systems are ideal for cloud, storage, and media workloads with new
models, including E3.S drive support for superior density and
throughput.
GrandTwin® – Purpose-built for single-processor
performance and memory density, featuring front (cold aisle)
hot-swappable nodes and front or rear I/O for easier
serviceability. Now available with E1.S drives for better storage
density and throughput.
Hyper-E – Delivers the power and flexibility of our
flagship Hyper family optimized for deployment in edge
environments. Edge-friendly features include a short-depth chassis
and front I/O, making Hyper-E suitable for edge data centers and
telco cabinets. These short-depth systems support up to 3
high-performance GPU or FPGA cards.
Edge/Telco – High-density processing power in
compact form factors optimized for telco cabinet and Edge data
center installation. Optional DC power configurations and enhanced
operating temperatures up to 55° C (131° F).
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in
Application-Optimized Total IT Solutions. Founded and operating in
San Jose, California, Supermicro
is committed to delivering first to market innovation for
Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are
a Total IT Solutions provider with server, AI, storage, IoT, switch
systems, software, and support services. Supermicro's motherboard,
power, and chassis design expertise further enable our development
and production, enabling next generation innovation from cloud to
edge for our global customers. Our products are designed and
manufactured in-house (in the US, Taiwan, and the
Netherlands), leveraging global operations for scale and
efficiency and optimized to improve TCO and reduce environmental
impact (Green Computing). The award-winning portfolio of Server
Building Block Solutions® allows customers to optimize for their
exact workload and application by selecting from a broad family of
systems built from our flexible and reusable building blocks that
support a comprehensive set of form factors, processors, memory,
GPUs, storage, networking, power, and cooling solutions
(air-conditioned, free air cooling or liquid cooling).
Supermicro, Server Building Block Solutions, and We Keep IT
Green are trademarks and/or registered trademarks of Super Micro
Computer, Inc.
All other brands, names, and trademarks are the property of
their respective owners.
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