DALLAS, July 16,
2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq:
TXN) today introduced six new power modules designed to improve
power density, enhance efficiency and reduce EMI. These power
modules leverage TI's proprietary MagPack integrated magnetic
packaging technology, shrinking their size by up to 23% compared to
competing modules, enabling designers of industrial, enterprise and
communications applications to achieve previously impossible
performance levels. In fact, three of the six new devices,
the TPSM82866A, TPSM82866C and TPSM82816, are the industry's
smallest 6A power modules, supplying an industry-leading power
density of nearly 1A per 1mm2 of area.
For more information, see
TI.com/powermodules.
"Designers turn to power modules to save on time, complexity,
size and component count, but these benefits have required a
compromise on performance – until now," said Jeff Morroni, director of power management
research and development at TI's Kilby
Labs. "After nearly a decade in the making, TI's integrated
magnetic packaging technology enables power designers to meet the
defining power trend that has shaped our industry – pushing more
power in smaller spaces efficiently and cost-effectively."
Pushing more power in smaller spaces
In power design,
size matters. Power modules simplify power designs and save
valuable board space by combining a power chip with a transformer
or inductor in one package. By leveraging TI's exclusive 3D package
molding process, MagPack packaging technology maximizes the height,
width and depth of the power modules to push more power in a
smaller space.
The magnetic packaging technology includes an integrated power
inductor with proprietary, newly engineered material. As a result,
engineers can now achieve best-in-class power density and reduce
temperature and radiated emissions while minimizing both board
space and system power losses. These benefits are especially
important in applications such as data centers, where electricity
is the biggest cost factor, with some analysts predicting a 100%
increase in demand for power by the end of the decade.
To learn more, see the technical article, "MagPack Technology:
Four Benefits of new power modules that can help you pack more
power in less space."
With decades of expertise, innovative technology, and a
portfolio of more than 200 devices with optimized package types for
any power design or application, TI's power modules help designers
push power further.
Available today on TI.com
- Preproduction quantities of TI's new power modules with MagPack
packaging technology are available for purchase now on TI.com.
- Evaluation modules are also available, starting at US$49.
- Multiple payment, currency and shipping options are
available.
|
Device
|
Input voltage
range
|
Description
|
MagPack
package
|
|
TPSM82866A
|
2.4V to 5.5V
|
Industry's smallest 6A
step-down module with
integrated inductor and 13 fixed VOUT options
|
2.3mm by 3mm
|
|
TPSM82866C
|
2.4V to 5.5V
|
Industry's smallest 6A
step-down module with
integrated inductor and I2C interface
|
2.3mm by 3mm
|
|
TPSM828303
|
2.25V to
5.5V
|
3A step-down module
with integrated inductor
and noise-filtering capacitors
|
2.5mm by
2.6mm
|
|
TPSM82816
|
2.7V to 6V
|
Industry's smallest 6A
step-down module with
adjustable frequency and synchronization
|
2.5mm by 3mm
|
|
TPSM82813
|
2.75V to 6V
|
3A step-down module
with adjustable frequency
and synchronization
|
2.5mm by 3mm
|
|
TPSM81033
|
1.8V to 5.5V
|
5.5V, 5.5A valley
current limit boost module with
power good, output discharge, and pulse-frequency
and pulse-width modulation control
|
2.5mm by
2.6mm
|
About Texas Instruments
Texas Instruments Incorporated
(Nasdaq: TXN) is a global semiconductor company that designs,
manufactures, tests and sells analog and embedded processing chips
for markets such as industrial, automotive, personal electronics,
communications equipment and enterprise systems. At our core, we
have a passion to create a better world by making electronics more
affordable through semiconductors. This passion is alive today as
each generation of innovation builds upon the last to make our
technology more reliable, more affordable and lower power, making
it possible for semiconductors to go into electronics everywhere.
Learn more at TI.com.
Trademarks
MagPack is a trademark of Texas
Instruments. All registered trademarks and other trademarks belong
to their respective owners.
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SOURCE Texas Instruments