Volume | 2,682 |
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Day High | Low High |
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Day Low |
Share Name | Share Symbol | Market | Stock Type |
---|---|---|---|
ACM Research Inc | ACMR | NASDAQ | Common Stock |
Open Price | Low Price | High Price | Close Price | Previous Close |
---|---|---|---|---|
28.15 |
Trades | Shares Traded | Average Volume | 52 Week Range |
---|---|---|---|
57 | 2,682 | - | 8.75 - 34.3507 |
Last Trade | Type | Quantity | Price | Currency |
---|---|---|---|---|
07:26:17 | 1 | US$ 28.25 | USD |
ACM Research (ACMR) Options Flow Summary
ACM Research Inc Financials
Market Cap | Shares in Issue | Float | Revenue | Profit/Loss | EPS | PE Ratio |
---|---|---|---|---|---|---|
1.72B | 61.10M | - | 557.72M | 77.35M | 1.27 | 22.24 |
Short Interest | Dividends Per Share | Dividend Yield | Ex-Div Date | Insider B/S | Insider % Owned |
---|---|---|---|---|---|
- | - | - | - |
ACM Research News
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Historical ACMR Price Data
Period † | Open | High | Low | VWAP | Avg. Daily Vol | Change | % |
---|---|---|---|---|---|---|---|
1 Week | 27.70 | 29.1694 | 24.50 | 26.68 | 1,412,934 | 0.40 | 1.44% |
1 Month | 28.60 | 33.40 | 24.50 | 28.95 | 1,231,898 | -0.50 | -1.75% |
3 Months | 17.48 | 34.3507 | 15.70 | 27.10 | 1,762,186 | 10.62 | 60.76% |
6 Months | 18.57 | 34.3507 | 12.53 | 22.98 | 1,442,255 | 9.53 | 51.32% |
1 Year | 10.13 | 34.3507 | 8.75 | 19.98 | 1,144,526 | 17.97 | 177.39% |
3 Years | 81.68 | 119.12 | 5.46 | 25.66 | 788,064 | -53.58 | -65.60% |
5 Years | 16.74 | 144.8065 | 5.46 | 32.77 | 607,363 | 11.36 | 67.86% |
ACM Research Description
ACM Research Inc is an us-based company. It is engaged in developing, manufacturing, and selling single-wafer wet cleaning equipment, which is used by semiconductor manufacturers in numerous manufacturing steps to remove particles, contaminants, and other random defects to improve product yield, in fabricating integrated circuits, or chips. The company offers space alternated phase shift which employs alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces on a microscopic level; and Timely Energized Bubble Oscillation technology which provides effective, damage-free cleaning for both conventional two and three-dimensional patterned wafers at process nodes. |