TTM Technologies, Inc. and Viasystems Group, Inc. Receive Federal Trade Commission Clearance for Acquistion
May 20 2015 - 8:10AM
TTM Technologies, Inc. (Nasdaq:TTMI) ("TTM") and Viasystems Group,
Inc. (Nasdaq:VIAS) ("Viasystems") today announced that the United
States Federal Trade Commission has closed its investigation into
TTM's proposed acquisition of Viasystems and the parties are free
to complete the transaction. This satisfies the final regulatory
approval required for the acquisition. As a result, TTM intends to
close the transaction on or about May 31, 2015.
About TTM
TTM Technologies, Inc. is a major global printed circuit board
("PCB") manufacturer, focusing on quick-turn and technologically
advanced PCBs and the backplane and sub-system assembly business.
TTM stands for time-to-market, representing how TTM's
time-critical, one-stop manufacturing services enable customers to
shorten the time required to develop new products and bring them to
market. Additional information can be found at www.ttmtech.com.
About Viasystems
Viasystems Group, Inc. is a technology leader and a worldwide
provider of complex multi-layer PCBs and electro-mechanical
solutions ("E-M Solutions"). Its PCBs serve as the "electronic
backbone" of almost all electronic equipment, and its E-M Solutions
products and services include integration of PCBs and other
components into finished or semi-finished electronic equipment, for
which it also provides custom and standard metal enclosures,
cabinets, racks and sub-racks, backplanes and busbars. Viasystems'
approximately 15,300 employees around the world serve over 1,000
customers in the automotive, industrial & instrumentation,
computer and datacommunications, telecommunications, and military
and aerospace end markets. For additional information about
Viasystems, please visit the company's website at
www.viasystems.com.
Forward-Looking Statements
Certain statements in this communication may constitute
"forward-looking statements" within the meaning of the Private
Securities Litigation Reform Act of 1995. Such statements relate to
a variety of matters, including but not limited to: the timing and
consummation of the proposed merger; the ability of the parties to
consummate the proposed merger and the satisfaction of the
conditions precedent to consummation of the proposed merger; and
other statements that are not historical fact. These statements are
made on the basis of the current beliefs, expectations and
assumptions of the management of TTM and Viasystems regarding
future events and are subject to significant risks and
uncertainties, many of which are beyond the control of TTM or
Viasystems. Such statements are predictions, and actual events or
results may differ materially.
Additional factors that may cause results to differ materially
from those described in the forward-looking statements are set
forth in the Quarterly Report on Form 10-Q of TTM Technologies,
Inc. for the quarter ended March 30, 2015, which was filed with the
Securities and Exchange Commission (the "SEC") on May 5, 2015,
under the heading "Item 1A. Risk Factors" and in the Annual Report
on Form 10-K of Viasystems for the year ended December 31, 2014,
which was filed with the SEC on March 12, 2015, under the heading
"Item IA. Risk Factors," and in each company's other filings made
with the SEC available at the SEC's website at www.sec.gov.
Neither Viasystems nor TTM undertakes any obligation to update
any such forward-looking statements to reflect any new information,
subsequent events or circumstances, or otherwise, except as may be
required by law.
CONTACT: TTM Investors
Todd Schull
Chief Financial Officer
714-327-3000
Lisa Laukkanen
Investor Relations
The Blueshirt Group
415-217-4967
lisa@blueshirtgroup.com
Viasystems Investors
Kelly Wetzler
SVP Corporate Development
314-746-2217
kelly.wetzler@viasystems.com
Erica Mannion
Investor Relations
Sapphire Investor Relations, LLC
415-471-2703
emannion@sapphireir.com
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