CyberOptics Unveils WX3000™ Metrology & Inspection System for Semiconductor Wafer-Level & Advanced Packaging at Virtual SEM...
July 08 2020 - 8:00AM
Business Wire
WX3000 Systems Incorporate Proprietary
NanoResolution MRS™ Sensor Technology
CyberOptics® Corporation (NASDAQ: CYBE), a leading global
developer and manufacturer of high-precision 3D sensing technology
solutions, will unveil the new Multi-Reflection Suppression™
(MRS™)-enabled 3D and 2D WX3000 Metrology and Inspection systems
for wafer-level and advanced packaging applications at the virtual
SEMICON West show, July 20-23rd.
This press release features multimedia. View
the full release here:
https://www.businesswire.com/news/home/20200708005290/en/
WX3000 Inspection and Metrology System
for Wafer-Level and Advanced Packaging (Photo: Business Wire)
Incorporating the NanoResolution MRS sensor, the WX3000
Metrology and Inspection systems enable the ultimate combination of
high speed, high resolution and high accuracy for wafer-level and
advanced packaging, to improve yields and productivity.
Performing two to three times faster than alternate technologies
at data processing speeds in excess of 75 million 3D data points
per second, the NanoResolution MRS sensor-enabled WX3000 systems
deliver throughput greater than 25 wafers per hour. 100% 3D and 2D
metrology and inspection can be completed simultaneously at high
speed, as compared to an alternate, slow method that requires two
separate scans for 3D and 2D and only a sampling of a few die.
The proprietary NanoResolution MRS sensor, deemed best in class,
meticulously identifies and rejects multiple reflections caused by
shiny and mirror-like surfaces. Effective suppression of multiple
reflections is critical for highly accurate measurements.
“With the growing complexity and variety of advanced packaging,
the need for highly accurate, 100% 3D and 2D metrology and
inspection continues to increase,” said Dr. Subodh Kulkarni,
President and CEO, CyberOptics, "Our MRS-Enabled WX3000 systems
provide not only high resolution and high accuracy, they perform
2-3x faster than alternative technologies.”
WX3000 systems are designed specifically for various wafer-level
and advanced packaging applications including wafer bumps, solder
balls and bumps, gold bumps and copper pillars. The systems provide
superior measurement and inspection performance for features down
to 25-micron, including bump height, coplanarity, diameter and
shape, relative location and a variety of other measurements.
CyberOptics will launch a WX3000 system for 12” and 8” wafers
and a WX3000 system for 8” and 6” wafers.
For more information, visit www.cyberoptics.com.
About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading
global developer and manufacturer of high-precision 3D sensing
technology solutions. CyberOptics’ sensors are used for inspection
and metrology in the SMT and semiconductor markets to significantly
improve yields and productivity. By leveraging its leading edge
technologies, the Company has strategically established itself as a
global leader in high precision 3D sensors, allowing CyberOptics to
further increase its penetration of key vertical markets.
Headquartered in Minneapolis, Minnesota, CyberOptics conducts
worldwide operations through its facilities in North America, Asia
and Europe.
Statements regarding the Company’s anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: a possible world-wide recession or
depression resulting from the economic consequences of the Covid-19
pandemic; the negative effect on our revenue and operating results
of the Covid-19 crises on our customers and suppliers and the
global supply chain; market conditions in the global SMT and
semiconductor capital equipment industries; trade relations between
the United States and other countries; the timing of orders and
shipments of our products, particularly our 3D MRS-enabled SQ3000
Multi-Function systems and MX systems for memory module inspection;
increasing price competition and price pressure on our product
sales, particularly our SMT systems; the level of orders from our
OEM customers; the availability of parts required to meet customer
orders; unanticipated product development challenges; the effect of
world events on our sales, the majority of which are from foreign
customers; rapid changes in technology in the electronics and
semiconductor markets; product introductions and pricing by our
competitors; the success of our 3D technology initiatives; the
market acceptance of our SQ3000 Multi-Function inspection and
measurement systems and products for semiconductor advanced
packaging inspection and metrology; costly and time consuming
litigation with third parties related to intellectual property
infringement; the negative impact on our customers and suppliers
due to past and future terrorist threats and attacks and any acts
of war; and other factors set forth in the Company’s filings with
the Securities and Exchange Commission.
View source
version on businesswire.com: https://www.businesswire.com/news/home/20200708005290/en/
Jeffrey Bertelsen Chief Financial Officer, CyberOptics
763-542-5000 Carla Furanna Head of Global Marketing, CyberOptics
952-820-5837
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