SAN JOSE, Calif., Aug. 16, 2021 /CNW/ -- (TSXV:SEV)
(OTCQB:SPVND) Spectra7 Microsystems Inc. ("Spectra7" or the
"Company"), a leading provider of high-performance analog
semiconductor products for broadband connectivity markets, and
Foxconn Interconnect Technology, Inc. (Foxconn) a leading supplier
of interconnect solutions, announced that they will be
demonstrating various lengths and AWGs of 400Gbps QSFP-DD Active
Copper Cables (ACCs) at the DesignCon 2021 expo on August 17 and 18 in San
Jose, California.
400Gbps interconnects are increasingly being used to
interconnect high-powered Artificial Intelligence (AI) and Machine
Learning (ML) servers that need this massive bandwidth to analyze
increasingly large and complex data sets as well as to serve the
rising focus on parallel computing in these data centers. At lower
speeds of 25Gbps, 40Gbps and 100Gbps these servers have been
connected with passive direct attached copper (DAC) cables. Now at
400Gbps, Hyperscalers are requiring thinner and more flexible
cables to accommodate the increased rack density. Bringing a
400Gbps passive DAC to each server is challenging, as these cables
are usually 26AWG and extremely
difficult to route. Bend radius and bend space are key cable
parameters. Spectra7's GaugeChangerTM chips allow
smaller gauges down to 34AWG copper
to be used thus dramatically improving both measurements. Foxconn
will be demonstrating a 2.5-meter 34AWG ACC to address this application.
Hyperscalers are also requiring longer cables to accommodate
increased switch radix. At 400Gbps, passive DACs can only reach
about 2.5 meters. Foxconn will be demonstrating a 5 meter
28AWG ACC to address these longer
reach applications.
"Foxconn is a technology and market leader," said Spectra7 CEO
Raouf Halim. "We are proud to be
partnering with them in the burgeoning Active Copper Cable market
and delighted to be showcasing our technology with them at the
DesignCon 2021 expo."
ABOUT FOXCONN INTERCONNECT TECHNOLOGY, LIMITED
("FIT")
Foxconn Interconnect Technology (FIT) is a leading
global solutions developer and manufacturer cultivating
connectivity for a better world. With unsurpassed capabilities
in development, research, manufacturing engineering and design,
production, supply chain, and go-to-market planning for world class
brands and private label products spanning B2C and B2B categories,
FIT is at the forefront of worldwide technological
trends delivering compelling user experiences at scale. With
offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the
manufacturing of high precision interconnect components.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high-performance analog
semiconductor company delivering unprecedented bandwidth, speed and
resolution to enable disruptive industrial design for leading
electronics manufacturers in virtual reality, augmented reality,
mixed reality, data centers and other connectivity markets.
Spectra7 is based in San Jose,
California with a design center in Cork, Ireland and technical support location
in Dongguan, China. For more
information, please visit www.spectra7.com.
Neither the TSX Venture Exchange nor its regulation services
provided (as that term is defined in the policies of the TSX
Venture Exchange) accepts responsibility for the adequacy or
accuracy of this release.
CAUTIONARY NOTES
Certain statements contained in this press release constitute
"forward-looking statements". All statements other than statements
of historical fact contained in this press release, including,
without limitation, the timing of the effective date of the
Consolidation, the Company's strategy, plans, objectives, goals and
targets, and any statements preceded by, followed by or that
include the words "believe", "expect", "aim", "intend", "plan",
"continue", "will", "may", "would", "anticipate", "estimate",
"forecast", "predict", "project", "seek", "should" or similar
expressions or the negative thereof, are forward-looking
statements. These statements are not historical facts but instead
represent only the Company's expectations, estimates and
projections regarding future events. These statements are not
guarantees of future performance and involve assumptions, risks and
uncertainties that are difficult to predict. Therefore, actual
results may differ materially from what is expressed, implied or
forecasted in such forward-looking statements. Additional factors
that could cause actual results, performance or achievements to
differ materially include, but are not limited to the risk factors
discussed in the Company's Management's Discussion and Analysis for
the year ended December 31, 2020.
Management provides forward-looking statements because it believes
they provide useful information to investors when considering their
investment objectives and cautions investors not to place undue
reliance on forward-looking information. Consequently, all of the
forward-looking statements made in this press release are qualified
by these cautionary statements and other cautionary statements or
factors contained herein, and there can be no assurance that the
actual results or developments will be realized or, even if
substantially realized, that they will have the expected
consequences to, or effects on, the Company. These forward-looking
statements are made as of the date of this press release and the
Company assumes no obligation to update or revise them to reflect
subsequent information, events or circumstances or otherwise,
except as required by law.
For more information, please contact:
Spectra7 Microsystems Inc.
John Mitchell
Investor Relations
650-269-3043
ir@spectra7.com
Spectra7 Microsystems Inc.
Bonnie Tomei
Chief Financial Officer
669-212-1089
pr@spectra7.com
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SOURCE Spectra7 Microsystems Inc.