Demo to Highlight Spectra7's GC1122 and
Teledyne LeCroy's Xena Z800 Freya 800GE
Test
System
SAN
JOSE, Calif., Jan. 31,
2024 /CNW/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7
Microsystems Inc. ("Spectra7" or the "Company"), a
leading provider of high-performance analog semiconductor products
for broadband connectivity markets, and Teledyne LeCroy, a leading
provider of electronic design, test and software
solutions, announced they will demonstrate their latest
800Gbps product offerings at this year's annual DesignCon
Conference Exhibition in Santa Clara,
California from Jan 31-Feb 1,
2024. The companies plan to demonstrate robust performance
and testing of 800Gbps Active Copper Cable (ACC) products for
hyperscale data center applications.
The demo will highlight Spectra7's ACCs successfully
interoperating with the Teledyne LeCroy's Xena Z800 800GE
QSFP-DD800 Test System at 800Gbps speeds. Link training will show a
very robust low pre-FEC bit error rate (BER) which demonstrates a
wide margin over standard required BER.
DesignCon is the premier high-speed interconnect and system
design conference attended by engineers from around the world. The
Spectra7 will be on exhibit in booth #1344.
"We are excited to be working with Spectra7 on showcasing Active
Copper Cable options for the rapidly expanding data center
interconnect market," said Claus
Hoyer, VP Technology and Architecture at XENA/Teledyne
LeCroy. "Spectra7 has created a compelling solution to address the
dramatically increasing power and cost of data center
interconnects."
"Teledyne LeCroy is a global leader in the test and measurement
solutions market," said Spectra7 CEO Raouf Halim. "The
collaboration with them and demonstration of our
GaugeChangerTM technology is a significant milestone in
the coming volume deployment of our data center product line."
Spectra7's analog based GaugeChangerTM GC1122 chips
are used in ACCs and offer significant cost, size, and energy
consumption value versus competing Active Electrical Cables (AECs)
and Active Optical Cables (AOCs) that use Digital Signal Processing
(DSP) technologies.
ABOUT Teledyne LeCroy
Teledyne LeCroy is a leading manufacturer of advanced
oscilloscopes, protocol analyzers, and other test instruments that
verify performance, validate compliance, and debug complex
electronic systems quickly and thoroughly. Since its founding in
1964, the Company has focused on incorporating powerful tools into
innovative products that enhance "Time-to-Insight". Faster time to
insight enables users to rapidly find and fix defects in complex
electronic systems, dramatically improving time-to-market for a
wide variety of applications and end markets. Teledyne LeCroy is
based in Chestnut Ridge, New York.
For more information, visit Teledyne LeCroy's website at
teledynelecroy.com.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high-performance analog
semiconductor company delivering unprecedented bandwidth, speed and
resolution to enable disruptive industrial design for leading
electronics manufacturers in virtual reality, augmented reality,
mixed reality, data centers and other connectivity markets.
Spectra7 is based in San Jose,
California with a design center in Cork, Ireland and a technical support location
in Dongguan, China. For more
information, please visit www.spectra7.com.
Neither the TSX Venture Exchange nor its regulation services
provider (as that term is defined in the policies of the TSX
Venture Exchange) accepts responsibility for the adequacy or
accuracy of this release.
CAUTIONARY NOTES
Certain statements contained in this press release constitute
"forward-looking statements". All statements other than statements
of historical fact contained in this press release, including,
without limitation, the Company's strategy, plans, objectives,
goals and targets, and any statements preceded by, followed by or
that include the words "believe", "expect", "aim", "intend",
"plan", "continue", "will", "may", "would", "anticipate",
"estimate", "forecast", "predict", "project", "seek", "should" or
similar expressions or the negative thereof, are forward-looking
statements. These statements are not historical facts but instead
represent only the Company's expectations, estimates and
projections regarding future events. These statements are not
guarantees of future performance and involve assumptions, risks and
uncertainties that are difficult to predict. Therefore, actual
results may differ materially from what is expressed, implied or
forecasted in such forward-looking statements. Additional factors
that could cause actual results, performance or achievements to
differ materially include, but are not limited to, the risk factors
discussed in the Company's management's discussion and analysis for
the year ended December 31, 2022.
Management provides forward-looking statements because it believes
they provide useful information to investors when considering their
investment objectives and cautions investors not to place undue
reliance on forward-looking information. Consequently, all of the
forward-looking statements made in this press release are qualified
by these cautionary statements and other cautionary statements or
factors contained herein, and there can be no assurance that the
actual results or developments will be realized or, even if
substantially realized, that they will have the expected
consequences to, or effects on, the Company. These forward-looking
statements are made as of the date of this press release and the
Company assumes no obligation to update or revise them to reflect
subsequent information, events or circumstances or otherwise,
except as required by law.
For more information, please contact:
Matt Kreps
Darrow Associates
214-597-8200
ir@spectra7.com
Spectra7 Microsystems Inc.
Dave Mier
Interim Chief Financial Officer
925-858-7011
ir@spectra7.com
Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com
View original content to download
multimedia:https://www.prnewswire.com/news-releases/spectra7-and-teledyne-lecroy-to-demonstrate-robust-performance-testing-of-800gbps-active-copper-interconnects-at-designcon-2024-302049009.html
SOURCE Spectra7 Microsystems Inc.