SAN JOSE, Calif., Aug. 17, 2021 /CNW/ -- Spectra7 Microsystems Inc.
(TSXV: SEV) (OTCQB: SPVND) ("Spectra7" or the
"Company"), a leading provider of high-performance analog
semiconductor products for broadband connectivity markets, and
MultiLane Technologies Inc. (MultiLane), a market leading
manufacturer of High-Speed IO and Data Center Interconnect test
solutions, announced that they will be demonstrating Spectra7's new
112G PAM4 GaugeChanger chip intended for next generation 800Gbps
data center interconnects at this year's DesignCon show in the San
Jose McEnery Convention Center in San
Jose, CA from Aug 17-18,
2021.
As the industry moves to 800Gbps it will adopt 112Gbps PAM4 per
lane signaling over 8 lanes. At these ultra-high signal rates,
traditional passive copper cables will struggle to reach beyond 1.5
meters. This creates a huge problem for Hyperscalers that require
longer lengths to serve both switch-to-switch and switch-to-server
connections, but do not want to incur the power and cost penalty of
optics. ACCs enabled with Spectra7's GC1122 solution will extend
copper cable reach 2.5 times, up to 4 meters at a fraction of the
cost of optics. Critically, at a time when Hyperscale operators are
struggling with power consumption and carbon emissions, ACCs using
the Spectra7 technology will consume only 200mW of power per
channel, which is up to 12 times lower power than optical
solutions.
The GC1122 is the latest addition to the GaugeChangerTM product
line and extends the data rate from 56Gbps PAM4 to 112Gbps PAM4 per
lane. Since the GC1122 is analog and highly linear, dynamics such
as line rate adjustment, multi-level signaling, intermittent line
silence, transmit pre-emphasis or amplitude adjustment and receiver
adaptivity are fully preserved. The GC1122 is packaged in an
ultra-small 2.7mm x 4.2mm chip scale package making it easily
embeddable in even the smallest of connectors.
The DesignCon demonstration highlights Spectra7's new GC1122
device as well as MultiLane's latest high speed test equipment
including the ML4015D DSO and the ML4039E BERT.
"Spectra7's new GC1122 is set to fill a big need in the data
center interconnect market," said MultiLane CEO Fadi Daou. "We are delighted to be working with
Spectra7 and their cable partners as they anticipate bringing their
112Gbps products to mass production in 2022."
"We are seeing tremendous interest from every Hyperscaler to get
sample 800Gbps cables that are enabled by our new GC1122 solution",
said Spectra7 CEO Raouf Halim. "Both
we and our cable partners believe that 800Gbps will represent a
significant acceleration in the growth and adoption of our ACC data
center interconnect technology."
ABOUT MultiLane
MultiLane Inc. is a leading provider of High-Speed IO and Data
Center Interconnect test solutions from 10G to 800G. Products
include BERTs, TDR, optical and electrical oscilloscopes, optical
switch boxes, and a host of MSA-compliant development tools for
QSFP28, QSFP-DD, OSFP, and other standards. MultiLane's products
are used to test semiconductors, DACs, AOCs, active cables, optical
transceivers, and system switch cards. MultiLane also offers
compliance test services and fully automated, turn-key test
solutions. In addition, MultiLane develops high speed ATE modules
that fit in wafer-scale automated test systems such as Advantest's
V93K platform. For more information, please visit
www.multilaneinc.com.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high-performance analog
semiconductor company delivering unprecedented bandwidth, speed and
resolution to enable disruptive industrial design for leading
electronics manufacturers in virtual reality, augmented reality,
mixed reality, data centers and other connectivity markets.
Spectra7 is based in San Jose,
California with a design center in Cork, Ireland and technical support location
in Dongguan, China. For more
information, please visit www.spectra7.com.
Neither the TSX Venture Exchange nor its regulation services
provided (as that term is defined in the policies of the TSX
Venture Exchange) accepts responsibility for the adequacy or
accuracy of this release.
CAUTIONARY NOTES
Certain statements contained in this press release constitute
"forward-looking statements". All statements other than statements
of historical fact contained in this press release, including,
without limitation, the timing of the effective date of the
Consolidation, the Company's strategy, plans, objectives, goals and
targets, and any statements preceded by, followed by or that
include the words "believe", "expect", "aim", "intend", "plan",
"continue", "will", "may", "would", "anticipate", "estimate",
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uncertainties that are difficult to predict. Therefore, actual
results may differ materially from what is expressed, implied or
forecasted in such forward-looking statements. Additional factors
that could cause actual results, performance or achievements to
differ materially include, but are not limited to the risk factors
discussed in the Company's Management's Discussion and Analysis for
the year ended December 31, 2020.
Management provides forward-looking statements because it believes
they provide useful information to investors when considering their
investment objectives and cautions investors not to place undue
reliance on forward-looking information. Consequently, all of the
forward-looking statements made in this press release are qualified
by these cautionary statements and other cautionary statements or
factors contained herein, and there can be no assurance that the
actual results or developments will be realized or, even if
substantially realized, that they will have the expected
consequences to, or effects on, the Company. These forward-looking
statements are made as of the date of this press release and the
Company assumes no obligation to update or revise them to reflect
subsequent information, events or circumstances or otherwise,
except as required by law.
For more information, please
contact:
Spectra7 Microsystems Inc.
John Mitchell
Investor Relations
650-269-3043
ir@spectra7.com
Spectra7 Microsystems Inc.
Bonnie Tomei
Chief Financial Officer
669-212-1089
pr@spectra7.com
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SOURCE Spectra7 Microsystems Inc.