Kulicke & Soffa to Participate at SMT Hybrid Packaging 2017
May 12 2017 - 8:05AM
Business Wire
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke
& Soffa”, “K&S” or the “Company”), announced today that it
will be exhibiting at the SMT Hybrid Packaging trade show in
Nuremberg, Germany, from May 16 through May 18, 2017.
Kulicke & Soffa will be at the SMT Hybrid Packaging trade
show booth 4A-444, showcasing its new packaging solutions.
- Asterion™ UW – a new ultrasonic welding
solution built on a proven architecture with an expanded bond area,
robust pattern recognition capabilities and extremely tight process
controls. Ultrasonic welding provides an attractive alternative in
high power applications where it has higher current carrying
potential than a wire bonded connection. The enlarged area enhances
flexibility and reduces line integration costs.
- Hybrid Wafer Feeder – an innovative
solution that enables the combination of ultra-high-speed passive
and active placement with high-accuracy flip-chip bonding directly
from wafer, ideal for high-volume System-in-Package (SiP),
flip-chip, die-attach and wafer-level-package manufacturing.
Placement accuracy up to 7µm @ 3 sigma, provides a compelling
alternative to existing commercial solutions.
Other K&S’ solutions such as the IConnPS ProCu PLUS™
high-performance wire bonder, Asterion™ EV (Extended Version) wedge
bonder, iFlex H1 multifunction equipment, Quantis™ QFN capillary,
as well as FCC™ Plus and Opto™ Plus dicing blades will also be
featured at the trade show.
“The new Asterion™ UW and Horizontal Wafer Feeder on the Hybrid
provides a compelling set of high-reliability solutions serving the
automotive, semiconductor and industrial markets,” said Chan Pin
Chong, Kulicke & Soffa’s Senior Vice President, AP-Hybrid,
Electronics Assembly, Wedge Bonders, Capillaries and Blades
Business Lines.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of
semiconductor packaging and electronic assembly solutions
supporting the global automotive, consumer, communications,
computing and industrial segments. As a pioneer in the
semiconductor space, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S
has expanded its product offerings through strategic acquisitions
and organic development, adding advanced packaging, electronics
assembly, wedge bonding and a broader range of expendable tools to
its core offerings. Combined with its extensive expertise in
process technology and focus on development, K&S is well
positioned to help customers meet the challenges of packaging and
assembling the next-generation of electronic devices.
(www.kns.com)
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version on businesswire.com: http://www.businesswire.com/news/home/20170512005112/en/
Kulicke & Soffa Industries, Inc.Marilyn SimPublic
RelationsP: +65-6880-9309F: +65-6880-9580msim@kns.comorJoseph
ElgindyInvestor Relations & Strategic InitiativesP:
+1-215-784-7500F: +1-215-784-6180investor@kns.com
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