TRKN Trikon Technologies (MM)

Trikon Takes Risk Out of IC Production for Mainstream Silicon Applications with New Omega i2L(R) Dry-Etch System Perfect Fit for China Market Says Company CEO Dr. John MacNeil: Allows Chipmakers Quick Ramp Up to Profitable Production NEWPORT, Wales, March 17 /PRNewswire-FirstCall/ -- Trikon Technologies, Inc. (NASDAQ:TRKN) today released details about its new Omega i2L(R) dry-etch system. The company reports that its new platform will open up new market opportunities in mainstream silicon and power management applications, among others because of its proven technology and ability to reduce risk and improve profitability. Company CEO Dr. John MacNeil says that the new platform should be a positive "fit" for the China market and that the company is already receiving good feedback from its network in the Asia Pacific region. The new i2L etch platform combines the company's inline cassette-to- cassette handling subsystem from its proven 200 series tools with the robust Windows NT control software and process modules from Trikon's proven fxP(TM) series cluster tools. The combination of proven handling, proven process control software and the array of process modules from its established cluster tools will enable the company to take advantage of new market opportunities by surpassing the performance of competing technology for "mainstream silicon" applications. Trikon defines "mainstream silicon" as robust process technology for proven technology nodes greater than 100-nm that can be ramped quickly to profitable production. According to CEO Dr. MacNeil, "IC Manufacturers installing or upgrading mainstream fabs need low-cost, high-reliability process tools. By drawing on Trikon's proven production capabilities, we have produced a significant tool for mainstream silicon applications without the usual risks associated with developing a new tool for semiconductor manufacturing. The Omega i2L is also applicable to MEMS and wafer level packaging using our Deep Silicon etch technology; BAW device production and III-V applications. Among the multiple applications for the Omega i2L in mainstream fabs, this tool is particularly applicable for China's current emphasis on putting new 150-mm and 200-mm fabs in place," noted MacNeil. "The 200-mm tools going into China's new fabs must provide the simplicity and cost effectiveness needed today to ramp the country's semiconductor industry quickly. However, these tools must also be adaptable and cannot limit process capability or migration to the next technology node. This is exactly what the Omega i2L is designed to do." "In addition, for power management devices, the Omega i2L will extend our technology leadership for trench etch, a critical application that has a direct impact on device performance. The system will support the interferometric endpoint detection system which has been proven at customer sites to significantly improve device yield and reduce scrap." Available process modules on the i2L include plasma enhanced reactive ion etch (PERIE), inductively coupled plasma (ICP) etch, magnetic zero resonant induction (M0RI) etch, deep-silicon etch (DSi), gas phase etch (GPE), and post-etch corrosion/resist strip or isotropic oxide etch (Isopod). The Omega i2L can be configured with 1 or 2 of these process modules for wafers up to 200 mm. Trikon's proven dielectric chemical vapor deposition process technology (i.e., low-temperature NH3-free deposition with controllable stress) is also being adapted to the i2L platform and will be available later in 2005. With the i2L platform, Trikon can now put its most advanced etch process modules on its existing semi-manual tool (the Omega r4P), the new in-line tool, Omega i2L, or its existing cluster tool (the Omega fxP): a series of tools all based around a common, interchangeable set of process modules. "Because our etch process modules can be applied identically across our three tool platforms, these processes are easily transferable, and training, diagnostics and service is simplified," said Dr. Dave Thomas, Trikon's marketing manager for etch. The Omega i2L can include a flat/notch finder and cool down and is adaptable to 50-mm to 200-mm multi-wafer types, including silicon, III-V's and other materials such as sapphire and glass and can be installed through-wall or standalone in a ballroom cleanroom. First shipments are scheduled for April 2005. About Trikon Technologies Trikon Technologies is a leading provider of wafer fabrication equipment and services to the global semiconductor industry. Trikon develops and manufactures advanced capital equipment for plasma etching and chemical and physical vapor deposition (CVD and PVD) of thin films for use in the production of semiconductor devices. These are key components in all electronic products, such as telecommunication devices, consumer and industrial electronics and computers. More information is available on the World Wide Web at: http://www.trikon.com/ . DATASOURCE: Trikon Technologies, Inc. CONTACT: Stew Chalmers, +1-818-980-3762, for Trikon Technologies, Inc. Web site: http://www.trikon.com/

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