PITTSBURGH, Nov. 23, 2021 /PRNewswire/ --
/ Key Highlights
- Ansys multiphysics signoff technology is recognized as
important for classical Moore's
Law scaling as well as for TSMC's breakthrough 2.5D/3D multi-die
technologies
- Ansys secured an award in the category of Joint Development of
4nm Design Infrastructure for delivering foundry-certified,
state-of-the-art power integrity and reliability signoff
verification tools for TSMC N4 process
- Ansys earned an award in the category of Joint Development of
3DFabric™ Design Solution for providing foundry-certified thermal,
power integrity, and reliability solutions for TSMC 3DFabric™, a
comprehensive family of 3D silicon stacking and advanced packaging
technologies
Ansys (NASDAQ: ANSS) has been recognized by TSMC as a recipient
of two 2021 OIP Partner of the Year awards for Joint
Development of 4nm Design Infrastructure and Joint Development of
3DFabric™ Design Solution. The Partner of the Year award honors
TSMC Open Innovation Platform® (OIP) ecosystem partners' pursuit of
excellence in next-generation design enablement over the past
year. Ansys and other OIP ecosystem partners' collaborative
efforts effectively promote innovation in the semiconductor
industry. TSMC announced award winners at its 2021 OIP
Ecosystem Forum, a one-of-a-kind event that brings together the
semiconductor design ecosystem partners and TSMC customers,
providing an ideal platform to discuss the latest technologies and
design solutions for HPC, mobile, automotive, and IoT
applications.
Ansys provides a broad range of multiphysics analysis tools that
help address matters that have become increasingly central concerns
for advanced semiconductor manufacturing. Traditional signoff
analyses, like voltage drop and electromigration, become more acute
at 3nm and N4 technologies as the number of transistors grows, the
complexity increases, and ultra-low supply voltages lead to
vanishing safety margins. Ansys secured an award in the category of
Joint Development of 4nm Design Infrastructure for working closely
with TSMC on these issues leading to the certification of Ansys
RedHawk-SC™ and Ansys Totem™ for TSMC's most advanced 3nm and N4
processes.
TSMC 3DFabric technologies provide the industry with a solution
for greater integration density. Realizing the advantages of
3DFabric requires not only higher capacity analysis platforms but
also the integration of new physics into the design process. Ansys
earned an award in the category of Joint Development of 3DFabric™
Design Solution for Ansys RedHawk-SC Electrothermal™ development on
for full chip-and-package thermal analysis
"Congratulations to Ansys as the winner of the 2021 TSMC
OIP Partner of the Year awards," said Suk
Lee, vice president of Design Infrastructure Management
Division at TSMC. "Your continuous collaboration and effort make us
able to be at the forefront of technology development, while
enabling our customers to take full advantage of the significant
power, performance, and area improvements of TSMC's advanced
technologies to accelerate innovation for their differentiated
products."
"TSMC is one of the foremost technology developers in the entire
semiconductor industry and working closely with TSMC has been a
critical factor in the success of our signoff technology products,"
said John Lee, vice president and
general manager of Electronics and Semiconductor Business Unit at
Ansys. "Thanks to this close collaboration, our joint customers are
able to use Ansys tools with confidence on the most challenging and
advanced single and multi-die design projects in the industry."
The title of OIP Partner of the Year is awarded to partner
companies working relentlessly to achieve the highest standards of
design, development, and technology implementation. Ansys will
continue working with TSMC to enable next generation designs and
recently presented a paper on thermal analysis of 3DFabric designs
at this year's TSMC OIP Ecosystem Forum: "A Comprehensive
Hierarchical Thermal Solution for Advanced 3DIC System" by
Norman Chang et al.
Additional information is available at the TSMC Newsroom.
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge, or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation, we help
the world's most innovative companies deliver radically better
products to their customers. By offering the best and broadest
portfolio of engineering simulation software, we help them solve
the most complex design challenges and create products limited only
by imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–T
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Contacts
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Media
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Mary Kate
Joyce
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724.820.4368
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marykate.joyce@ansys.com
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Investors
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Kelsey
DeBriyn
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724.820.3927
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kelsey.debriyn@ansys.com
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SOURCE Ansys