SAN FRANCISCO, Jan. 23, 2017 /PRNewswire/ -- Today,
DesignCon previews announcements from more than 50 exhibitors
participating at the event next week. DesignCon, the premier
educational conference and technology exhibition for electronic
design engineers in the high-speed communications and semiconductor
communities, will present three days of deeply technical sessions,
special events and a robust expo hall hosting the industry's
leading solution providers. Via the expo hall, attendees will have
the opportunity to experience emerging solutions first hand and
connect with leading companies on what's to come.
DesignCon will take place January 31 – February
2 at the Santa Clara Convention Center. For
additional information and to register, please visit:
designcon.com
Below is a preview of announcements exhibitors will showcase
at DesignCon 2017:
3M (booth 514) announces Twin Axial Cable
Assemblies that bring incredible flexibility in an ultra-thin,
space-saving form. Featuring a low-profile ribbon design with a
remarkably tight bend radius, it can help save substantial space
inside congested systems, allowing for optimal airflow and cooling
to maintain the speeds and power your system demands.
Anritsu (booth 633) will display signal integrity
solutions featuring its Signal Quality Analyzer MP1800A BERT,
VectorStar® and ShockLine™ VNAs. Demos include a 56G/112 NRZ and
PAM4 Accurate Jitter Tolerance Test System that satisfies
communications standards such as OIF, IEEE, and InfiniBand.
Applied Simulation Technology (booth 1149)
introduces Mesh Gnd module for accurate modeling of flex circuits
and other mesh ground/power structures on PCBs. Mesh Gnd is a new
feature set of ApsimRLGC 2D+ field solver. ApsimRLGC now also
expands its capability by adding an optimizer which helps
synthesize trace parameters for ZO optimization.
Artek, Inc. (booth 309) will be introducing all
new, all passive & tunable ISI, XTalk, Tr/Tr, Skew controllers
for receiver physical layer tolerance testing.
Bellwether (booth 652) will showcase both Hi Speed
& Hi Power connectors and cables. Cable such as SlimChroma™ can
be used to meet USB 3.0/3.1 signal integrity requirements.
Connectors such as CrystalBand™ can provide excellent connectors
capable of handling high electrical current in small space.
Benchmark Electronics (booth 301) announces
expanded RF development capabilities and is showcasing their latest
innovations in electronics design expertise. Benchmark services
have been providing advanced product engineering and manufacturing
solutions in high-speed computing, telecommunications and related
industries for over a quarter century.
Cadence (booth 515) will show how designers can
optimize signal and power integrity design and analysis as well as
get support for designing with the PCIeÒ 4.0 interface.
EDADOC USA (booth 518) will showcase new service
offerings for turnkey solutions in addition to their high-speed PCB
design capabilities.
EMSCAN (booth 211) significantly improves the
speed and the resolution (0.06 mm) of the world's fastest EMC/EMI
scanner: the EMxpert ERX+. Now PCB and design engineers can
diagnose EMC/EMI issues on a 2.25 cm x 2.25 cm (0.89" x 0.89")
sized PCB at 0.1 mm in less than 9 minutes.
Feinmetall (booth 1153) is proud to introduce its
new RF HF66 series for reliable contacting of SMD assembled RF mini
connectors and new coaxial high current 1860 series suitable for
formation/test of Li-ion cells, quality control of batteries/power
storage and charging, and discharging processes of batteries.
Hitachi Cable America (booth 811) will showcase
new product and service offerings including Direct Attach Cables
(DAC), DensPac, ACC and more.
HSIO Technologies (booth 423) has a new line of
Zero Footprint Sockets that incorporates a device size socket
footprint with industry standard spring pins. These small test
sockets allow a customer to place them into any end application
allowing a Spring Pin socket to be
directly re-flowed into the same location as the device.
Huwin (booth 1152) will introduce a new USB 3.1
Type C test solution. It contains test fixtures and a compliance
test software. The test fixtures have been optimally designed to
measure any USB 3.1 Type C connectors using a commercial network
analyzer.
Imagineering (booth 1240) announces it is now
AS9100C Certified for printed circuit boards and Assemblies. This
certification is an internationally recognized standard focused on
quality requirements necessary in the Defense and Aerospace
industry.
Ironwood Electronics (booth 752) introduces a new
BGA socket family using high performance elastomer capable of
75GHz, very low inductance and wide temperature applications (-55C
to +160C). These low-profile sockets are only 2.5 mm per side
larger than actual IC packages (industry's smallest footprint).
Kandou Bus (booth 218), together with Keysight,
will demonstrate the Glasswing Ultra-Short-Reach PHY that uses
Chord Signaling to deliver sub-pico Joule per bit in-package
communications. The PHY delivers 125 Gb/s over 6 data wires.
Keysight Technologies (booth 725) will demonstrate
new test and measurement techniques for 400G/PAM-4 designs, data
analytics, digital interconnect test and physical layer test and
will provide complimentary workshops on these technologies.
Keysight specialists will be available to discuss new services for
calibration and technology refresh plus training and
consulting.
Luxshare-ICT (booth 801) will be showcasing its
OCuLink 4x Enhanced Vertical receptacle along with a 2 x 4x
solution for x8 OCuLink applications. Luxshare's Type C, Power
assemblies, Standard I/O, FFC/FPC, Power Bus Bar, Braided Copper
Cables, SAS, PCIe, Magnetic Jacks, Active Optical Cables, and JDM
Capabilities will all be available to discuss with its engineering
team.
Micram (booth 658) launches new and enhanced
features for its ultrafast 100 GS/s, 35 GHz bandwidth VEGA DAC4
signal generator, which now supports fully automatic
synchronization of two and four channel configurations. Software
enhancements include rational sampling, fully adjustable channel
skew and predefined filters, pre-distortion, pre-compensation,
noise cancellation, PAM-4/PAM-8 and other complex patterns.
Microlease (booth 222) will be leading hands on
demonstrations with the latest test and measurement equipment from
Keysight and Tektronix.
From the publishers of Microwave Journal comes an online journal
specializing in signal integrity, power integrity, and EMC/EMI:
Signal Integrity Journal (booth T2). The Editorial
Advisory Board includes DesignCon luminaries Eric Bogatin (Editor), Bert Simonovich, Yuriy Shlepnev, Istvan Novak, Alfred
Neves, Doug Smith, and
Vladimir Dmitriev-Zdorov. Contributing: Janine Love & Patrick Hindle.
Molex (booth 619) will showcase versatile,
high-density, space-saving connectivity solutions that are rapidly
increasing network bandwidth is the crux of next-generation system
architectures. Advancements in Molex technologies provide clear
paths to adoption of higher data transmission rates that are in
demand by manufacturers today.
National Instruments (booth 705) announces new
higher performance model of VirtualBench with 500 MHz of analog
bandwidth and 40 MHz sine output for higher performance benchtop
and automated test applications. VirtualBench consolidates five of
the most commonly used test and measurement instruments into one
device without compromising performance, creating new efficiencies
for engineers.
Neoconix (booth 320) announces the availability of
new DLBeam™ enhancements to its PCBeam™ connector products.
Engineered specifically for high speed applications, the DLBeam
construction utilizes a more streamlined electrical path with
reduced capacitance to further improve signal integrity. DLBeam has
been developed for data rates up to 56Gbps.
Novotech Technologies (booth 207) will showcase
wireless products/solutions with a focus on the new CAT M
technology which is predicted to be a true game changer for the
Internet of Things.
Oak-Mitsui Technologies (booth 1244) is thrilled
to announce the launch of its thinner product MC2TS which offers 40
nf/sq in capacitance and 18 Dk @1 KHz. MC2TS is perfect for small
factor applications such as MEMs and modules with space limitation
that require higher capacitance.
Cross-Correlator ASIC is one of Pacific Microchip Corp.'s
(booth 1237) unique products that was developed under NASA
SBIR contract. The ASIC has greatly reduced power consumption and
includes an array of 128 ADCs with 2-bit precision sampled at 1 GHz
and a 64x64 cross-correlation matrix based on a novel
architecture.
PacketMicro (booth 755) is excited to showcase the
complete hardware and software solution for Intel Delta-L+ test
methodology that allows PCB manufacturers to easily measure the PCB
loss and extract Dk and Df. This solution includes an R&S ZNB20
VNA, EMStar Advanced Interconnect Test Tool (AITT) software, and
rugged handheld D-Probes.
Paricon Technologies (booth 400) will present its
latest technologies in its new ribbon cable to board connector
system which introduces minimal signal degradation between the
cable and the PWB. Using its patented PariPoser® contact system,
very high performance electrical interconnection capability can be
obtained for a wide range of applications including test and
production interconnection products.
PCB Droid (booth 1341) will display its
easy-to-use and easy-to-learn 'WYSIWYG' printed circuit board
design application for Android mobile devices. It has an ergonomic
menu structure designed for touch screens, and offers an extended
macro library.
Polliwog Corporation (booth 1057) will showcase
DFx which allows users to reduce expense and loss of time occurring
in a mass production cycle. Numerous electrical defect items are
checked against the PCB design data, and any design errors are
reported at the point of error so that they are easily identified
and corrected.
Pulse Electronics' (booth 632) is excited to be
displaying the Pulse JT7 product line of 1 x1, 1, 10GBASET ICM, 4P
POE with options for 4 and 5 Channel magnetics, PH9400 SMT high
isolation gate drive transformers, SMPTE292M Video Baluns and
Militarized Ethernet and AFDX products.
RoBAT Ltd. (booth 200), is excited to announce the
release of two new robotic test machines: The RCI machine is a
fully automated 4-head high speed VNA/TDR tester for Backplane
assemblies. The PDM machine will detect the presence of pressfit
pins and backdrills on both Backplane and Daughtercard
assemblies.
Rohde & Schwarz (booth 841) will be featuring
test solutions for challenges in high speed digital design and
signal integrity as well as power integrity measurement solutions.
The setups cover crosstalk, PAM-4 measurements, high bit rate
channel characterization, low noise probing for signal integrity,
battery life analysis, and high speed PCB probing.
SIGLENT Technologies (booth 402) will be
displaying its latest developments in oscilloscopes, DMMs, spectrum
analyzers, and generators.
SL Power (booth 642) will showcase its external
and internal power supplies that address the Department of Energy's
(DOE's) Level VI efficiency requirements, as well as enhanced
performance to electromagnetic interference (EMI) and
electromagnetic compatibility (EMC) standards for applications in
test equipment, medical devices, and specialized LED lighting
equipment.
Socionext (booth 1239) will feature advanced SoC
design and solutions including ultra energy-efficient 56Gb/s PAM4
and 56Gb/s NRZ analog and ADC-based SR to LR CMOS transceivers,
100+Gbps transceiver utilizing the company's ultra-high speed ADC
& DAC technology, and high-end package designs for
high-performance SoCs.
Southwest Microwave (booth 411) will showcase its
SuperMini Board-to-Board DC to 67 GHz blind-mate connectors for
PCBs stacked as tightly as 3 mm. Southwest Microwave will also
display its SuperSMA, 2.92, 2.40, 1.85, 1.0, and 0.9 mm End Launch
Connectors and its matching cable and harness assemblies.
Spectra7 Microsystems (booth 803) will showcase
the GaugeChanger and GaugeChanger Plus line of data center
interconnects and components. Using Spectra7's patented active
cable technology, the GaugeChanger series of ICs and cable modules
enable the thinnest 3 meter and 5 meter QFSP cables used in
rack-to-rack applications.
SPISim (booth T6) announces enhanced IBIS-AMI and
link analysis capabilities in latest 2017.1 SPIPro release.
Datasheet based cross-platform AMI models for FFE, CTLE, DFE and
CDR stages can be configured and generated directly from
SPIPro.
SV Microwave (booth 1055) manufactures a large
variety of solderless precision RF connectors in high frequency
bands including SMA, 2.92mm and 2.4mm connector series. Our
solderless application makes assembly fast, easy and without
damaging the PCB board. Additionally, SV can customize a PCB
footprint design for your application.
T Plus Co. Ltd. (booth T4) will showcase 67GHz
Wide pitch Probes, 40GHz Handheld probes, 26.5-170GHz standard RF
probes and a variety of custom designed DC/RF probes. Additionally,
T Plus Co. Ltd. will provide a Manual Probe Station as well as
displayed measurement accessories.
Tektronix (booth 741) will be showcasing its
comprehensive set of solutions for automated transmitter and
receiver test solutions for data center technologies and emerging
serial bus standards along with automated test solutions. Tektronix
will also launch an exciting new product that will help engineers
ease 4th generation receiver testing.
Teledyne LeCroy (booth 733) will showcase the HDO
family of 12-bit high definition oscilloscopes; PAM4 signal
analysis; digital power management IC, power sequencing, and
power-integrity testing; USB 3.1 and Power Delivery compliance test
over Type-C; MIPI M-PHY physical- and protocol-layer test; PCI
Express Tx/Rx compliance; and DDR4 compliance and debug
capabilities.
TestEquity (booth 648) provides value-added
electronic test and measurement solutions, MRO tools, recently
acquiring JENSEN® Tools, and in-house line of environmental test
chambers. TestEquity works alongside customers to find the best
solutions for specific needs, offer unmatched post-sale support and
industry-leading warranties. TestEquity is an authorized stocking
distributor for hundreds of leading manufacturers.
Total Phase (booth 603) will showcase the new
Advanced Cable Tester - the quickest and most convenient way to
test USB Type-C cables. The Advanced Cable Tester provides thorough
continuity testing, DC resistance measurement for safe
operation/reliability, and E-Marker verification. Rapid
spot-checking of cables, easy-to-understand reports, and 100% test
coverage are also features of this tester.
TOYO Corp. (booth 815) will be demonstrating the
latest EMIStream Ver5.0 (EMI Simulation Software) from NEC and
67GHz near-field EMI scanner from Aprel. TOYO Corp. is also excited
to showcase the latest PCB materials from Risho and high-frequency
low-loss cables from Junkosha.
Ventec International (booth 118) will unveil the
industry's most advanced ultra-low Dk PCB materials for high-speed
low-loss applications. A technical presentation on the subject will
demonstrate how lower losses and lower system power requirements
are realized by using an ultra-low Dk material with Dk values
between 2.3 and 2.8.
Wurth Electronics Midcom (booth 949) is presenting
for the first time a seminar on High-Speed EMI Prevention
Techniques Wednesday, February 1 at
9:20am. Attendees can also stop by
the booth on Wednesday and Thursday from 1-3pm to meet presenter Ismael Molina Alba, Product Manager for CMCs,
and ask him questions about his presentation and more.
Yamaichi (booth 1049) will present 200GbE/400GbE,
and Coherent Optics Interconnect Products. Its CFP2, CFP4, CFP2-64G
and CFP8 connectors perform at high speed signal requirements
200GAUI-4 and 400GAUI-8 on 200G/400GbE, and also perform at 64Gbaud
signal requirement for Future Coherent Optics. Yamaichi will
display demos showcasing these connectors' performances.
For the full list of DesignCon 2017 exhibitors, please
visit:
http://www.designcon.com/exhibitors-list
DesignCon Media & Association Partners
DesignCon is proud to partner with the following
publications: Aspencore, Chinese American Semiconductor
Professional Association (CASPA), Chip Design Magazine,
ConnectorSupplier.com, EDA Café, Electronic System Design Alliance,
Embedded Systems Engineering, How2Power, IBIS Open Forum, Microwave
Journal, Signal Integrity Journal.
Follow DesignCon online:
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Twitter: @UBMDesignCon
Flickr: flickr.com/photos/designcon
Register for a Media
Pass: designcon.com/santaclara/media-center/
About DesignCon
DesignCon is the world's premier conference for chip, board and
systems design engineers in the high-speed communications and
semiconductor communities. DesignCon, created by
engineers for engineers, takes place annually in Silicon
Valley and remains the largest gathering of chip, board and systems
designers in the country. This three-day technical conference
and expo combines technical paper sessions, tutorials, industry
panels, product demos and exhibits from the industry's leading
experts and solutions providers. More information is available
at: designcon.com/santaclara. DesignCon is organized by UBM
Americas, a part of UBM plc (UBM.L), an Events First marketing
and communications services business. For more information,
visit ubmamericas.com.
Contact
Kimberly
Samra
DesignCon Public Relations
DesignConPR@ubm.com
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SOURCE DesignCon