BE Semiconductor to Present at Piper Jaffray's 8th Annual Hardware and Communications Conference
May 02 2006 - 2:30AM
PR Newswire (US)
DRUNEN, Netherlands, May 2 /PRNewswire-FirstCall/ -- BE
Semiconductor Industries N.V. ("the Company" or "Besi") (Nasdaq:
BESI; Euronext: BESI), a leading manufacturer of assembly equipment
for the semiconductor industry, today announced that the Company is
scheduled to present at Piper Jaffray's 8th Annual Hardware and
Communications Conference. Richard Blickman, President and CEO,
will present at the conference. The Company will webcast the
presentation live on its website at http://www.besi.com/. Place:
New York Palace Hotel, New York Time: 3:20 p.m. ET, Thursday, May
11, 2006 Web Access: http://www.besi.com/ About BE Semiconductor
Industries N.V. BE Semiconductor Industries N.V. designs, develops,
manufactures, markets and services die sorting, flip chip and
multi-chip die bonding, packaging and plating equipment for the
semiconductor industry's assembly operations. Its customers consist
primarily of leading U.S., European, Asian, Korean and Japanese
semiconductor manufacturers and subcontractors which utilize its
products for both array connect and conventional leadframe
manufacturing processes. Contacts: Richard W. Blickman Cor te
Hennepe President & CEO Director of Finance Tel. (31) 416
384345 Tel. (31) 416 384345 David Pasquale The Ruth Group Tel. (1)
646 536-7006 DATASOURCE: BE Semiconductor Industries N.V. CONTACT:
Richard W. Blickman, President & CEO, (31) 416 384345, or Cor
te Hennepe, Director of Finance, (31) 416 384345, both of BE
Semiconductor Industries N.V., ; or David Pasquale of The Ruth
Group, +1-646-536-7006, or Web site: http://www.besi.nl/
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