HSINCHU, Oct. 9, 2024
/PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC.
("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and
Nasdaq: IMOS), an industry leading provider of outsourced
semiconductor assembly and test services ("OSAT"), today reported
its unaudited consolidated revenue for the month of September 2024 and for the third quarter ended
September 30, 2024. All U.S. dollar
figures cited in this press release are based on the exchange rate
of NT$31.65 to US$1.00 as of September
30, 2024.
Revenue for the third quarter of 2024 was NT$6,068.0 million or US$191.7 million, representing an increase of
4.4% from the second quarter of 2024, and an increase of 8.7% from
the third quarter of 2023. The Company noted it is benefiting from
healthy supply and demand led by its DDIC business.
Revenue for the month of September
2024 was NT$1,888.9 million or
US$59.7 million, representing a
decrease of 10.7% from August 2024,
and a decrease of 1.2% from September
2023.
|
Consolidated Monthly
Revenues (Unaudited)
|
|
September
2024
|
August 2024
|
September
2023
|
MoM Change
|
YoY Change
|
|
Revenues
(NT$
million)
|
1,888.9
|
2,115.8
|
1,912.3
|
-10.7 %
|
-1.2 %
|
|
Revenues
(US$
million)
|
59.7
|
66.8
|
60.4
|
-10.7 %
|
-1.2 %
|
|
Consolidated
Quarterly Revenues (Unaudited)
|
|
Third
Quarter
2024
|
Second
Quarter
2024
|
Third
Quarter
2023
|
QoQ Change
|
YoY Change
|
|
Revenues
(NT$
million)
|
6,068.0
|
5,809.6
|
5,581.5
|
4.4 %
|
8.7 %
|
|
Revenues
(US$
million)
|
191.7
|
183.6
|
176.4
|
4.4 %
|
8.7 %
|
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan
Stock Exchange: 8150 and Nasdaq: IMOS) (www.chipmos.com) is an
industry leading provider of outsourced semiconductor assembly and
test services. With advanced facilities in Hsinchu Science Park,
Hsinchu Industrial Park and Southern Taiwan Science Park in
Taiwan, ChipMOS is known for its
track record of excellence and history of innovation. The Company
provides end-to-end assembly and test services to leading fabless
semiconductor companies, integrated device manufacturers and
independent semiconductor foundries serving virtually all end
markets worldwide.
Forward-Looking Statements:
This press release may contain certain forward-looking
statements. These forward-looking statements may be identified by
words such as 'believes,' 'expects,' 'anticipates,' 'projects,'
'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar
expressions or by discussion of, among other things, strategies,
goals, plans or intentions. These statements may include financial
projections and estimates and their underlying assumptions,
statements regarding plans, objectives and expectations with
respect to future operations, products and services, and statements
regarding future performance. Actual results may differ materially
in the future from those reflected in forward-looking statements
contained in this document, due to various factors. Further
information regarding these risks, uncertainties and other factors
are included in the Company's most recent Annual Report on Form
20-F filed with the U.S. Securities and Exchange Commission (the
"SEC") and in the Company's other filings with the SEC.
Contacts:
|
In Taiwan
Jesse Huang
ChipMOS TECHNOLOGIES
INC.
+886-6-5052388 ext.
7715
IR@chipmos.com
|
In the U.S.
David
Pasquale
Global IR
Partners
+1-914-337-8801
dpasquale@globalirpartners.com
|
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SOURCE ChipMOS TECHNOLOGIES INC.
