Infineon Announces a Rich Portfolio of Semiconductor Solutions for the Mobile Market
February 12 2008 - 7:00AM
Marketwired
NEUBIBERG, GERMANY and BARCELONA, SPAIN (NYSE: IFX), a leading
supplier of advanced communication ICs and solutions, today
announced sample availability of its latest low cost platform
family in 65 nanometer as well as two new highly integrated and
power-efficient members of its Mobile TV IC family. Furthermore,
Infineon introduces instant messaging and e-mail functionality for
entry mobile phones.
"We are excited to once again show such a broad portfolio of
innovative semiconductor solutions for future mobile communications
to our customers and a broad public," said Dominik Bilo, Senior
Vice President and head of Sales and Group Marketing of the
Communication Solutions Business Group with Infineon. "With the
semiconductor solutions presented today, we confirm once again our
technology leadership in the area of true monolithic
integration."
With its third generation of Single-Chips, the X-GOLD(TM) 113
and X-GOLD(TM) 213, Infineon enables advanced mobile phone features
such as camera, mobile internet and audio-entertainment accessible
in low-cost markets. The integration of these features has allowed
suppliers to reduce the production cost, of core mobile functions,
by up to 40 percent relative to more traditional solutions. The new
chips are sampling now and a first call on air has already been
successfully conducted. As part of a complete mobile platform the
company enables features, in price sensitive markets, which until
now have only been offered in the high-tier segments. Users without
personal computers can now access the Internet using their mobile
phones while they are on-the-go -- including news reports, weather
forecasts, prices of goods, navigation or e-mail. In addition
digital photos can now be taken and quickly shared. Radio programs
or MP3 data, including podcasts, can now be availed of without any
additional costs.
Infineon is the first company to demonstrate e-mail and chat
functionality on ultra-low-cost mobile phone solutions, also called
smart entry mobile phones. The solution allows simultaneous access
to all leading communication portals such as MSN, ICQ, Chikka or
Yahoo! on average WAP-based phones. Smart entry phones will enable
users to receive fast-and-easy access to chat and e-mail on low
cost mobiles.
Additionally Infineon shows new members of its successful Tuner
IC family. The two new Tuner solutions primarily address mobile
applications and offer system IP blocks to further complement
Infineon's mobile handset platform for high-end phones. The
company's latest digital tuner solutions, the OMNIVIA(TM) TUS 9090
and the OMNITUNE(TM) TUA 9001, enable customers to enter and
competitively participate in the market through value-added,
advanced solutions and target digital mobile TV applications such
as mobile phones, PDAs, mobile media players and laptops. Enabling
miniaturization of electronics system design, these new Infineon
solutions will drive towards lower system costs, reduced power
consumption and eventually an increased adoption rate of Mobile TV
technology and applications.
Furthermore the company leverages its unique advantages in the
areas of true, monolithic integration and leading 7.2 HSDPA modem
technology and has announced that another tier 1 handset company
has selected its RF chip SMARTi(TM) UE+ for HSxPA/ EDGE products.
This Single Chip RF significantly improves the signal quality from
base station to handset, increasing the effective data throughput
and reducing the required network resources. Users experience a
higher effective downlink speed, better network coverage and less
drops in Voice over IP- and video-applications while the network
operators can significantly increase their network capacity and
quality of service. With its architecture SMARTi UE+ enables phone
manufacturers to reduce testing cycles in the production processes
by more than a factor of 10.
You can find more information on Infineons innovative solutions
at the Mobile World Congress in Barcelona, Spain in Hall 1, booth
B19.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers
semiconductor and system solutions addressing three central
challenges to modern society: energy efficiency, communications,
and security. In the 2007 fiscal year (ending September), the
company reported sales of Euro 7.7 billion (including Qimonda sales
of Euro 3.6 billion) with approximately 43,000 employees worldwide
(including approximately 13,500 Qimonda employees). With a global
presence, Infineon operates through its subsidiaries in the U.S.
from Milpitas, CA, in the Asia-Pacific region from Singapore, and
in Japan from Tokyo. Infineon is listed on the Frankfurt Stock
Exchange and on the New York Stock Exchange (ticker symbol:
IFX).
Further information is available at www.infineon.com.
This news release is available online at
www.infineon.com/press/
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Media Relations Technology: Worldwide Headquarters Christoph von
Schierst�dt Phone: +49 89 234 22984 Email:
vonschierstaedt@infineon.com U.S.A. Agnes Toan Phone: +1 408 503
2587 Email: agnes.toan@infineon.com Asia Chi Kang David Ong Phone:
+65 6876 3070 Email: david.ong@infineon.com Japan Hirotaka
Shiroguchi Phone: +81 3 5745 7340 Email:
hirotaka.shiroguchi@infineon.com Investor Relations EU/APAC/USA/CAN
Phone: +49 89 234 26655 Email: investor.relations@infineon.com
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