EnSilica PLC EUR2.5m Satellite Broadband Chip Contract Secured (7203K)
August 30 2023 - 1:00AM
UK Regulatory
TIDMENSI
RNS Number : 7203K
EnSilica PLC
30 August 2023
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30 August 2023
EnSilica plc
("EnSilica", the "Company" or the "Group")
New lead customer secured for EnSilica's Satellite Broadband
Chip worth EUR2.5 million
EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs
(Application Specific Integrated Circuits), is pleased to announce
that it has secured a contract worth EUR 2.5m with a lead customer
for EnSilica's proprietary satellite broadband chip (the
"Contract"). The Contract provides the customer with early access
to the satellite broadband chip and an order for EnSilica for the
first 50,000 chips. The Customer is a vendor of user terminals for
SatCom on-the-Move (SOTM) applications, using EnSilica's chips to
address the next generation of mass market satellite broadband user
terminals.
Funding of EUR 5m for the development phase of the satellite
broadband chip was announced by EnSilica on 17 February 2023, which
was provided under the framework of the European Space Agency's
Advanced Research in Telecommunications Systems Core
Competitiveness programme, with the support of the UK Space Agency
.
This chip will enable the next generation of low-cost, low-power
satellite broadband user terminals. This type of component is a key
enabler for user terminals operating with low earth orbit satellite
systems. User terminals track the relative movement of the
satellites, allowing users to access high-capacity connectivity in
a very wide range of use cases, including automotive, maritime and
aerospace connectivity, as well as connectivity for rural
households.
Ian Lankshear, Chief Executive Officer of EnSilica plc,
commented:
"With the satellite broadband communications market a key growth
driver for our business, we are delighted to have a lead customer
adopting our innovative semiconductor solution for their next
generation of satellite broadband user terminals.
Given the high number of chips per antenna, and the millions of
users that could adopt these services, the potential growth within
this market could be significant for our business across the medium
term."
For further information please contact:
EnSilica plc Via Vigo Consulting
Ian Lankshear, Chief Executive Officer +44 (0)20 7390 0233
www.ensilica.com
Allenby Capital Limited, Nominated Adviser +44 (0)20 3328 5656
& Broker info@allenbycapital.com
Jeremy Porter / Vivek Bhardwaj (Corporate
Finance)
Joscelin Pinnington / Tony Quirke (Sales
& Corporate Broking)
Vigo Consulting (Investor & Financial Public +44 (0)20 7390 0233
Relations) ensilica @vigoconsulting.com
Jeremy Garcia / Kate Kilgallen
About EnSilica
EnSilica is a leading fabless design house focused on custom
ASIC design and supply for OEMs and system houses, as well as IC
design services for companies with their own design teams. The
Company has world-class expertise in supplying custom RF, mmWave,
mixed signal and digital ICs to its international customers in the
automotive, industrial, healthcare and communications markets. The
Company also offers a broad portfolio of core IP covering
cryptography, radar, and communications systems. EnSilica has a
track record of delivering high quality solutions to demanding
industry standards. The Company is headquartered near Oxford, UK
and has design centres across the UK, in Bangalore, India and in
Port Alegre, Brazil.
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