BILLERICA, Massachusetts,
Aug. 21, 2018 /PRNewswire/ -- MRSI
Systems (Mycronic Group), is expanding its leading high speed
MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to
offer configurations for active optical cable (AOC), gold-box
packaging, and other applications in addition to chip-on-carrier
(CoC).
This expansion is in response to our customer's request to take
advantage of the field-proven performance of the flexible high
speed MRSI-HVM3 platform, for their other essential packaging
applications in photonics manufacturing which are high volume and
high mix by nature.
The new MRSI-HVM3P is the first major extension to the HVM3
family, equipped with inline conveyor for single fixture or
multiple cassette inputs that can automatically transport large
forms of carriers of the dies. This configuration is targeted at
AOC or similar die-to-printed circuit board (PCB) applications,
gold-box packaging, and CoC in fixture. The processes include
eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV
curing.
"With these extensions to our successful HVM3 platform, MRSI
Systems is now able to offer flexible high volume die bonding
solutions, not just for CoC, but also for PCB and box levels of
packaging to our customers in photonics, sensors and other advanced
technology fields," said Dr. Yi
Qian, Vice President of Product Management of MRSI Systems.
"This is another demonstration of MRSI's commitment to provide
critical solutions promptly in response to our customers' needs,"
concluded Mr. Michael Chalsen,
President of MRSI Systems.
Both MRSI-HVM3 and MRSI-HVM3P now carry the following options
inherited from our long proven MRSI-M3 family: localized
heating, flip-chip bonding, and co-planarity bonding. These options
are increasingly critical for new applications such as 400G
transceivers and silicon photonics.
The MRSI-HVM3 product family delivers industry-leading speed,
future-proof high precision (<3mm), and superior flexibility for
true multi-process, multi-chip, high-volume production.
The launch of the MRSI-HVM3P builds on the success of our first
configuration launched last year, the MRSI-HVM3 for CoC,
Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using
eutectic and/or epoxy stamping die bonding, which has proved to be
the best-in-class die bonder with the leading speed, zero-time tool
change between dies, and <3mm accuracy. The superior performance
was enabled by dual head, dual stage, integrated "on-the-fly" tool
changer, ultrafast eutectic stage, and multi-levels of parallel
processing optimizations (see product launch press release
August 14, 2017).
MRSI Systems is exhibiting at China International Optoelectronic
Expo (CIOE) with our partner CYCAD Century Science and Technology
(Booth #1C66) in Shenzhen,
September 5-8, 2018 and ECOC (Booth
#577) in Rome, Italy, September 24-26, 2018.
The information in this press release was published
August 21, 2018, at 09:00 am ET.
For additional information, please contact:
Dr. Yi Qian Vice President of
Product Management, MRSI Systems
Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com
Time Zone: ET – Eastern Time
Tobias Bülow Director IR & Corporate Communications,
Mycronic
Tel: +46-734-018-216, e-mail: tobias.bulow@mycronic.com
Time Zone: CET – Central European Time
This information was brought to you by Cision
http://news.cision.com
The following files are available for download:
http://mb.cision.com/Main/17452/2596324/894472.pdf
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SOURCE MRSI Systems