BANGKOK, March 5,
2025 /PRNewswire/ -- DuPont is excited to showcase
its cutting-edge advancements in circuit materials at Intelligent
Asia Thailand 2025. With a broad array of solutions designed to
enhance fine-line technology, signal integrity, and thermal
management, DuPont will be exhibiting at Booth #B342 in
EH 102 at the Bangkok International Trade & Exhibition
Centre (BITEC) from March 6 to 8,
2024.
"Artificial intelligence (AI) is significantly transforming the
electronics industry, accelerating innovation speed in printed
circuit boards (PCBs) that are essential for intelligent devices,"
said Yuan Yuan Zhou, Global Business Director, Advanced Circuit
& Packaging, DuPont. "As a leader in advanced interconnect
technology, our expertise and broad product portfolio positions us
to enable the increasing needs for device miniaturization and high
computational speed and performance. Through strategic partnerships
and our global presence, we help our customers, leading PCB
manufacturers, start and grow their business in the rapidly
expanding Southeast Asian market."
Innovations in printed circuit boards (PCBs) are accelerating at
an unprecedented pace, with advanced high-density interconnects and
fine-line technology playing a crucial role in network
communications, automotive and consumer electronics sectors. As the
automotive industry transitions toward electrification and
automation, and the 5G infrastructure and server technologies
expand, both sectors require technology advancements in advanced
multilayer boards (MLBs) and high-density interconnects (HDIs) with
high reliability interconnect.
To meet these evolving technology challenges, DuPont offers
state-of-the-art materials for flexible, rigid-flex, and rigid
PCBs, enabling the seamless integration of complex circuits.
DuPont's innovative solutions encompass both high-performance
chemistry that addresses fine pitch and advanced reliability
requirements, as well as comprehensive signal integrity offerings
designed for high-frequency and high-speed data transfer
applications. These products effectively tackle industry
challenges, ensuring optimal performance, efficient power
transmission, and reliable signal integrity.
At the event, DuPont experts will be available at the company's
booth to share their extensive knowledge and insights on
technological advancements and industry trends. Attendees will have
the opportunity to explore DuPont's full range of solutions.
Product offerings include:
DuPont™ Copper Gleam™ PPR-II/III pulse acid plating
copper is a new generation electroplating solution
designed for advanced MLB, high-layer count boards, and AI server
station applications. The solution has superior throwing power for
through-hole plating, with better plated thickness distribution on
surface to fulfill fine-line and high reliability
requirements.
DuPont™ Circuposit™ 6800W electroless copper plus
Copper Gleam™ PS-100 flash copper are designed for
enhanced reliability performance in multi-stack micro-via designs,
replacing conventional electroless copper processes. The
combination of a horizontal electroless copper process with a flash
electroplating step creates a more efficient single process
solution, making it well-suited for applications in automotive and
AI server stations.
DuPont™ Riston® DI9500M & DI8600 and FD3000M
dry film photoresist are multi-wavelength direct imaging
solutions designed for use in pitch greater than or equal to 70μm
tech/etch processes for both rigid and flex PCBs. These dry film
photoresists are ideal for applications in electrified automotive
and AI server stations. They provide fine-line capability with
excellent resolution and adhesion performance, improving overall
yield for manufacturers.
DuPont™ Microfill™ EVF-III acid copper is a new
generation via-filling technology designed for fine-line HDI
applications suitable for automotive applications. The solution is
highly effective for panel via filling, providing excellent
throwing power for improved through-hole
performance.
DuPont™ Pyralux® AP flexible copper-clad
laminate is a versatile, double-sided laminate that
features an all-polyimide dielectric and DuPont's unique
manufacturing process. This laminate offers exceptional reliability
and reduced transmission loss. With its tailored combination of
properties, it fulfills customers' requirements for high
reliability and high-speed, high-frequency signal
transmission.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with
technology-based materials and solutions that help transform
industries and everyday life. Our employees apply diverse science
and expertise to help customers advance their best ideas and
deliver essential innovations in key markets including electronics,
transportation, construction, water, healthcare and worker safety.
More information about the company, its businesses and solutions
can be found at www.dupont.com. Investors can access information
included on the Investor Relations section of the website at
investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service
marks denoted with ™, SM or ® are owned
by affiliates of DuPont de Nemours, Inc. unless otherwise
noted.
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SOURCE DuPont
