Axcelis' Leadership in the Power Device
Segment Continues to Grow
BEVERLY,
Mass., Oct. 18, 2023 /PRNewswire/ -- Axcelis
Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling
ion implantation solutions for the semiconductor industry, today
announced the shipment of the Company's Purion EXE SiC Power
Series™ 200mm high energy implanter to a leading SiC power device
chipmaker located in Japan. The
system will be used in high volume production of SiC power devices
for use in automotive applications.
Executive Vice President of Marketing and Applications,
Greg Redinbo, commented, "The power
device market is one of the fastest growing segments in IC
manufacturing, due in part to the robust growth in the electric
vehicles market. The power device market is at a critical
inflection point as chipmakers transition from 150mm to 200mm SiC
wafers. The Purion Power Series family is uniquely suited to excel
at these applications due to its innovative platform that offers
the flexibility to handle multiple wafer sizes, various substrate
types and operate at various implant temperatures. We look forward
to continuing to expand the Purion platform footprint in
Japan and supporting our
customers' goals to increase their manufacturing capacity."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative,
high-productivity solutions for the semiconductor industry for over
45 years. Axcelis is dedicated to developing enabling process
applications through the design, manufacture and complete life
cycle support of ion implantation systems, one of the most critical
and enabling steps in the IC manufacturing process. Learn more
about Axcelis at www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media)
978.787.4266
Doug Lawson (investor relations)
978.787.9552
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SOURCE AXCELIS TECHNOLOGIES, INC