Aehr Introduces New FOX-CP™ Wafer-Level Test and Reliability Screening Solution
February 04 2019 - 3:05PM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
introduced the FOX-CP system, its new low-cost single-wafer compact
test and reliability verification solution for logic, memory and
photonic devices and newest addition to its FOX-P™ product family.
Aehr will showcase the new FOX-CP system in Booth 4046 at the SPIE
Photonics West conference being held at the Moscone Convention
Center in San Francisco February 5-7, 2019. The FOX-CP system is
available now for order and for shipment with standard lead times.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “The new single-wafer FOX-CP system is integrated with a
wafer prober and performs wafer-level testing and reliability
cycling for logic, memory and photonic devices. This newest
addition to our FOX-P product family is optimal for test times
ranging from minutes to a few hours or where multiple touchdowns
are required to test the entire wafer. It complements the
capabilities of the FOX-XPTM and FOX-NPTM systems, which are
optimal when the test time is measured in hours or days and the
full wafer can be tested in a single touchdown. The FOX-CP system
offers a low-cost integrated package for both initial evaluations
and production applications.
“We are very optimistic about the silicon photonics and
photonics sensors markets and believe they will be significant
growth drivers for Aehr. The rapid growth of integrated optical
devices in high-performance servers and data centers, mobile
devices, automotive applications, and now wearable biosensors is
driving substantially higher requirements for initial quality and
long-term reliability, and the requirements are increasing with
every new product generation. We believe these new applications are
driving an entirely new level of quality and reliability
expectation for these systems and pose a significant long-term
growth opportunity for Aehr.”
The FOX-CP single-wafer test system (pictured below) reduces
test cost by functionally testing wafers during reliability
screening to identify failing logic/memory/photonic die before the
die are integrated into their final package. This integrated test
system with wafer handling and stepping capabilities utilizes
Aehr’s custom FOX WaferPak™ contactor and wafer prober available
with thermal chucks to support a wide range of wafer power
requirements. Key features of the FOX-CP include:
- 2,048 “Universal Channels” per wafer, enabling massively
parallel test.
- Innovative “Universal Channel” architecture, where any channel
can be any function (I/O, Device Power Supply (DPS) or Per-pin
Precision Measurement Unit (PPMU)).
- Configurable with Universal Channel Modules, High Voltage
Channel Modules or High Current Channel Modules.
- Ability to perform single touchdown or multiple touchdown wafer
probing.
- Available as an integrated solution with prober and
custom-designed WaferPak Contactor.
- Compatible with industry-standard wafer probers and probe
cards.
Photonics Applications for the FOX-CP SystemThe
FOX-CP system features unique capabilities for testing and
reliability screening of VCSEL (vertical cavity surface-emitting
lasers) arrays for 3D sensing applications and silicon photonics
for 5G communications applications, including:
- Testing tens of thousands of arrays per wafer with amps of
current per array.
- Stabilizing lase and identifying infant mortalities through
extended stress/test programs.
- Electrical and go/no-go optical detection.
One application is to conduct single touchdown sampling test to
confirm the processing of the wafer is within specified limits and
the yield exceeds minimum requirements. The large number of 2A
channels (4A with pulsing) available enables a large sample
size (as many as 1024 die) with a single touchdown, while providing
an individual power supply per die. Individual power supplies
per die enable maximum monitoring for device reliability
characterization.
Another application is to perform multiple touchdown (stepping)
aging of the full wafer to stabilize the lasing parameters of the
die. The large number of high-current power channels can
reduce the number of steps by an order of magnitude and
increases production throughput. Stabilizing/aging the lasers
allows higher-bandwidth performance of the end product, since the
laser parameters can be matched and don’t change over time and
brings the laser parameters into the narrow range required for
effective control of the devices.
FOX-P PlatformAehr’s FOX-P platform is the
company’s next-generation multi-wafer and singulated die/module
test solution that is capable of functional test and
burn-in/cycling of photonics devices, flash memories,
microcontrollers, sensors, and other leading-edge ICs before they
are assembled into single or multi-die stacked packages. The FOX-P
wafer-level systems utilize Aehr’s FOX WaferPak contactors, which
provide cost effective solutions for making electrical contact with
a full wafer or substrate in a multi-wafer environment. The
configuration with the DiePak® Carriers enables burn-in of
singulated die and multi-die modules to screen for defects in both
the die and the module assembly process. The resulting known-good
die, single-die or stacked-die packaged parts can then be used for
high reliability and quality applications such as enterprise solid
state drives, automotive devices, highly valuable mobile
applications, and mission critical integrated circuits and
sensors.
The key features of the FOX-P platform that contribute to the
cost-effectiveness of the solution include the ability to provide
up to 2,048 “Universal Channels” per wafer or DiePak carrier, which
allows the system to test all the devices on the wafer or DiePak
carrier in parallel. The innovative “Universal Channel”
architecture allows any channel to be any function (I/O, Device
Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)).
This enhanced architecture now allows customers to perform per pin
parametric testing, more extensive digital pattern test with deeper
data stimulus / capture memory (32M per pin), and deeper scan
(768M) optimized for BIST/DFT testing. A single FOX-XP test system
may be configured with up to 18 blades of wafer test resources,
enabling up to 18 wafers to be tested simultaneously. The footprint
of the 18-wafer FOX-XP test system is similar to the footprint of
typical semiconductor Automatic Test Equipment (ATE) that can only
test one wafer at a time. The highly integrated 2-blade FOX-NP
system has a very small footprint and is designed to be easily
integrated into product design, reliability and test lab
applications. The new FOX-CP single-wafer system is integrated with
a wafer prober and performs wafer-level testing and reliability
screening.
A photo accompanying this announcement is available at
http://www.globenewswire.com/NewsRoom/AttachmentNg/aaee3e31-86c8-4ffc-8062-0bf6f46f21ed.
About Aehr Test Systems Headquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr products in package, wafer level, and singulated die/module
level test. Aehr has developed and introduced several innovative
products, including the ABTS™ and FOX-P families of test and
burn-in systems and FOX WaferPak Aligner, FOX WaferPak Contactor,
FOX DiePak Carrier and FOX DiePak Loader. The ABTS system is used
in production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The WaferPak Contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers and panels
on Aehr FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr’s website at www.aehr.com.
Safe Harbor Statement This press release
contains certain forward-looking statements based on current
expectations, forecasts and assumptions that involve risks and
uncertainties. These statements are based on information available
to Aehr as of the date hereof and actual results could differ
materially from those stated or implied due to risks and
uncertainties. Forward-looking statements include statements
regarding Aehr’s expectations, beliefs, intentions or strategies
regarding its products, including statements regarding future
market opportunities and conditions, expected product shipment
dates and customer orders or commitments. These risks and
uncertainties include, without limitation, customer demand and
acceptance of Aehr’s products, the ability of new products to meet
customer needs or perform as described, as well as general market
conditions and Aehr’s ability to execute on its business strategy.
See Aehr’s recent 10-K, 10-Q and other reports from time to time
filed with the Securities and Exchange Commission for a more
detailed description of the risks facing Aehr’s business. Aehr
disclaims any obligation to update information contained in any
forward-looking statement to reflect events or circumstances
occurring after the date of this press release.
Contacts: |
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Aehr Test
Systems Carl Buck V.P. of Marketing (510)
623-9400 x381cbuck@aehr.com |
MKR Group
Inc.Todd Kehrli or Jim ByersAnalyst/Investor Contact(323)
468-2300aehr@mkr-group.com |
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