Aehr Receives $6.7 Million Order for FOX WaferPak Full Wafer Contactors to Support Production of Silicon Carbide Power Devices for Electric Vehicles
March 14 2023 - 6:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced it has received a $6.7 million order
from its lead silicon carbide test and burn-in customer for
multiple WaferPak™ full wafer Contactors to meet their increased
production capacity needs for silicon carbide power semiconductors
for the electric vehicle market. This customer is a leading Fortune
500 supplier of semiconductor devices with a significant customer
base in the automotive semiconductor market.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “We are excited about this customer’s continued
production ramp and new design wins using our wafer level test and
burn-in systems and WaferPaks. This WaferPak order is about half of
the total WaferPak Contactors needed for the FOX-XP™ wafer level
test and burn-in systems previously ordered by this customer and
announced in January. These WaferPaks are expected to be delivered
beginning this current fiscal quarter and through our fiscal first
quarter 2024 ending August 31, 2023.
"As we have noted in the past, FOX-XP system orders are required
to increase general manufacturing capacity, while our
WaferPak Contactors are unique to each new design win. As our
customers win new designs from their customers, Aehr secures
orders for new WaferPak Contactors to fulfill these new wins.
Over time, we expect to see our follow-on WaferPak business grow
both in absolute dollars and also as a percent of our overall
revenue.
“Based on feedback and forecasts from current and prospective
customers in the last several months and particularly in recent
face-to-face visits with current and prospective customers in the
US, Europe, and Asia, we are seeing increased market momentum and
continued adoption of silicon carbide MOSFETs by electric vehicle
automobile manufacturers that will require wafer level burn-in. We
also see upside growth potential for silicon carbide usage in
electrification infrastructure, electric trains and other
high-power DC to AC inverter applications.
“Aehr is increasing its inventory and adding
additional manufacturing capacity of systems and WaferPaks in
anticipation of the potential significant upside of the broad-based
move of silicon carbide suppliers to wafer level burn-in. Future
orders of our FOX-XP multi-wafer test and burn-in systems and
WaferPak full wafer contactors are anticipated to grow to meet the
anticipated growth of silicon carbide MOSFET test and burn-in
requirements for electric vehicle DC to AC traction inverters and
electric vehicle chargers, as well as other power
conversion applications such as solar inverters.
“Aehr Test’s unique solutions allow our customers to test and
burn-in their devices with 100% confidence and traceability, which
are needed to address the reliability, safety, security, and
confidence for mission critical applications such as semiconductors
used in motor controllers and power conversion in electric
vehicles. We feel we are very well positioned to capitalize on the
long-term growth opportunities such as these silicon carbide
devices within the electric vehicle as well as the infrastructure
to support the electric vehicle market.”
The FOX-XP system, available with multiple WaferPak Contactors
(full wafer test) or multiple DiePakTM Carriers (singulated
die/module test) configurations, is capable of functional test and
burn-in/cycling of integrated devices such as silicon carbide power
devices, silicon photonics as well as other optical devices, 2D and
3D sensors, flash memories, Gallium Nitride (GaN), magnetic
sensors, microcontrollers, and other leading-edge ICs in either
wafer form factor, before they are assembled into single or
multi-die stacked packages, or in singulated die or module form
factor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in semiconductor devices in wafer level,
singulated die, and package part form, and has installed over 2,500
systems worldwide. Increased quality and reliability needs of the
Automotive and Mobility integrated circuit markets are driving
additional test requirements, incremental capacity needs, and new
opportunities for Aehr Test products in package, wafer level, and
singulated die/module level test. Aehr Test has developed and
introduced several innovative products, including the ABTSTM and
FOX-PTM families of test and burn-in systems and FOX WaferPakTM
Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP and FOX-NP systems are full wafer contact and singulated
die/module test and burn-in systems used for burn-in and functional
test of complex devices, such as leading-edge silicon carbide-based
power semiconductors, memories, digital signal processors,
microprocessors, microcontrollers, systems-on-a-chip, and
integrated optical devices. The FOX-CP system is a new low-cost
single-wafer compact test and reliability verification solution for
logic, memory and photonic devices and the newest addition to the
FOX-P product family. The WaferPak Contactor contains a unique full
wafer probe card capable of testing wafers up to 300mm that enables
IC manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPakTM and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s
recent Form 10-K, 10-Q and other reports filed from time to time
with the Securities and Exchange Commission. Aehr disclaims any
obligation to update information contained in any forward-looking
statement to reflect events or circumstances occurring after the
date of this press release.
Contacts: |
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Aehr Test Systems |
MKR Investor Relations Inc. |
Vernon Rogers |
Todd Kehrli or Jim Byers |
EVP of Sales & Marketing |
Analyst/Investor Contact |
(510) 623-9400 x215 |
(323) 468-2300 |
vrogers@aehr.com |
aehr@mkr-group.com |
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