CEVA, DiMAGIC Corporation Ltd. Partner to Integrate Adaptive
Beam-forming Using Microphone Array Technology with CEVA-TeakLite
Family of DSPs
MOUNTAIN VIEW, Calif., and
TOKYO, Nov.
19, 2012 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the
leading licensor of silicon intellectual property (SIP) platform
solutions and DSP cores, and DiMAGIC Corporation Ltd. (DiMAGIC
Corp), a provider of high-quality sound reproduction software,
today announced the companies have partnered to deliver a solution
for enhanced digital audio capabilities in automotive, mobile and
consumer products. The solution, which is already shipping in an
automotive SoC for in-car audio, leverages the beam-forming
technology contained in the popular DVM (DiMAGIC Corp Virtual
Microphone) solution, and delivers an optimized integration with
the CEVA-TeakLite family of DSPs, to address a wide range of
advanced audio/voice use cases.
(Logo:
http://photos.prnewswire.com/prnh/20120808/SF53702LOGO)
Flexbeam™ is a brand-new adaptive beam-forming technology that
can provide flexible directional control for a compact microphone
array based on the DiMAGIC Corp Virtualizer X (DVX) technology.
From sophisticated stereo recording to high directivity audio
recognition, Flexbeam represents the latest in directional control
methods using a built-in stereo microphone. The software has been
optimized to leverage the performance and flexibility advantages of
the CEVA-TeakLite family, allowing SoC developers to easily add
high-quality microphone functions into their existing designs. For
licensees of the CEVA-TeakLite-III and CEVA-TeakLite-4 DSPs, the
DiMAGIC Corp software can further harness the low power and native
32-bit high performance voice capabilities to enable better sound
quality and extended battery life, delivering highly accurate sound
reproduction capabilities for mobile devices that rivals
traditional high-end professional systems.
"DiMAGIC Corporation Ltd. has established a strong track record
in consumer and automotive applications through its offering of
very high quality, multi-channel voice enhancement capabilities. By
integrating this technology tightly with the CEVA-TeakLite family
of DSPs, product developers can quickly incorporate advanced
microphone features into their products with lower costs and lower
risk," said Eran Briman, vice
president of marketing at CEVA.
"We are continually seeing requirements for ever more
sophisticated sound capture technology, particularly in noisy
environments like in-car infotainment systems. In order to address
this, more powerful DSP capabilities are required to efficiently
implement and run our audio technologies. CEVA's proven expertise
and advantages in audio and voice processing platforms with its
CEVA-TeakLite family are well known in the industry, and together
we are able to offer a solution that is easy to implement, flexible
and meets demanding cost, size and power requirements of these
next-generation products," said Hareo Hamada, Executive Chairman at
DiMAGIC Corporation Ltd.
The CEVA-TeakLite DSP family is the most successful licensable
DSP family in the history of the semiconductor industry, with more
than 3 billion chips shipped, over 100 licensees, 30 active
ecosystem partners and more than 100 audio and voice codecs and
enhancement applications available. To learn more about the
CEVA-TeakLite DSP family, visit
http://www.ceva-dsp.com/CEVA-TeakLite-Family.html
About DiMAGIC Corporation, Ltd.
DiMAGIC Corporation, Ltd. is a leader in the development of sound
technologies that leverage advanced digital signal processing
techniques to deliver a state-of-the-art audio user experience. The
company has strong roots in the mobile, consumer and automotive
markets, with millions of devices already shipped using DiMAGIC
Corp Virtual Microphone (DVM) technology. DiMAGIC Corp is now
expanding its research to include new fields such as the
interaction between visual and sound effects, active control of
sound and vibration, and interactive 3D telepresence technology.
For more information, visit http://www.dimagic.co.jp/.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual
property (SIP) DSP cores and platform solutions for the mobile,
portable and consumer electronics markets. CEVA's IP portfolio
includes comprehensive technologies for cellular baseband (2G / 3G
/ 4G), multimedia (vision, Image Signal Processing (ISP) and HD
audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI
(SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over
1 billion devices and powers handsets from every top handset OEM,
including Nokia, Samsung, HTC, LG, Motorola, Sony, Huawei and ZTE.
Today, more than 40% of handsets shipped worldwide are powered by a
CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow
CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.