Micron and Intel Announce Update to NAND Memory Joint Development Program
January 08 2018 - 8:00AM
Micron and Intel today announced an update to their successful
NAND joint development partnership that has helped the companies
develop and deliver industry-leading NAND technologies to market.
The announcement involves the companies’ mutual agreement to
work independently on future generations of 3D NAND. The companies
have agreed to complete development of their third generation of 3D
NAND technology, which will be delivered toward the end of this
year and extending into early 2019. Beyond that technology node,
both companies will develop 3D NAND independently in order to
better optimize the technology and products for their individual
business needs. Micron and Intel expect no change in the cadence of
their respective 3D NAND technology development of future nodes.
The two companies are currently ramping products based on their
second generation of 3D NAND (64 layer) technology.
Both companies will also continue to jointly develop and
manufacture 3D XPoint™ at the Intel-Micron Flash Technologies
(IMFT) joint venture fab in Lehi, Utah, which is now entirely
focused on 3D XPoint memory production.
“Micron’s partnership with Intel has been a long-standing
collaboration, and we look forward to continuing to work with Intel
on other projects as we each forge our own paths in future NAND
development,” said Scott DeBoer, executive vice president of
Technology Development, Micron. “Our roadmap for 3D NAND technology
development is strong, and we intend to bring highly competitive
products to market based on our industry-leading 3D NAND
technology.”
“Intel and Micron have had a long-term successful partnership
that has benefited both companies, and we’ve reached a point in the
NAND development partnership where it is the right time for the
companies to pursue the markets we’re focused on,” said Rob Crooke,
senior vice president and general manager of Non-Volatile Memory
Solutions Group, Intel Corporation. “Our roadmap of 3D NAND and
Optane™ technology provides our customers with powerful solutions
for many of today’s computing and storage needs.”
About Micron We are an industry leader in
innovative memory and storage solutions. Through our global brands
– Micron®, Crucial®, and Ballistix® – our broad portfolio of
high-performance memory and storage technologies, including DRAM,
NAND, NOR Flash, and 3D XPoint™ memory, is transforming how the
world uses information to enrich life. Backed by nearly 40 years of
technology leadership, our memory and storage solutions enable
disruptive trends, including artificial intelligence, machine
learning, and autonomous vehicles in key market segments like
cloud, data center, networking, and mobile. Our common stock is
traded on the NASDAQ under the MU symbol. To learn more about
Micron Technology, Inc., visit micron.com.
About Intel Intel (NASDAQ:INTC) expands the
boundaries of technology to make the most amazing experiences
possible. Information about Intel can be found at
newsroom.intel.com and intel.com.
©2018 Micron Technology, Inc. All rights reserved. Information,
products, and/or specifications are subject to change without
notice. Micron, the Micron logo, Crucial, the Crucial logo, and The
Memory and Storage Experts are trademarks of Micron Technology,
Inc. Intel and the Intel logo are trademarks of Intel Corporation
in the United States and other countries. All other trademarks are
the property of their respective owners.
Contacts: |
Marc Musgrove |
Shanye Hudson |
|
Micron Media
Relations |
Micron Investor
Relations |
|
mmusgrove@micron.com |
shudson@micron.com |
|
(208) 363-2405 |
(208) 492-1205 |
|
|
|
|
Daniel Francisco
Intel Media
Relations
daniel.francisco@intel.com
916-377-9509
|
Mark HenningerIntel
Investor Relationsmark.h.henninger@intel.com 408-653-9944 |
Intel (NASDAQ:INTC)
Historical Stock Chart
From Apr 2024 to May 2024
Intel (NASDAQ:INTC)
Historical Stock Chart
From May 2023 to May 2024