SAN JOSE, Calif., Feb. 23, 2015 /PRNewswire/ -- Xilinx, Inc.
(NASDAQ:XLNX) today announced its 16nm UltraScale+™ family of
FPGAs, 3D ICs, and MPSoCs, combining new memory, 3D-on-3D and
multi-processing SoC (MPSoC) technologies, delivering a generation
ahead of value. In addition, to enable an even higher level of
performance and integration, the UltraScale+ family also includes a
new interconnect optimization technology, SmartConnect. These
devices extend Xilinx's UltraScale portfolio – now spanning 20nm
and 16nm FPGA, SoC, and 3D IC devices – and leverage a significant
boost in performance/watt from TSMC's 16FF+ FinFET 3D transistors.
Optimized at the system level, UltraScale+ delivers value far
beyond a traditional process node migration – providing 2–5X
greater system level performance/watt over 28nm devices, far more
systems integration and intelligence, and the highest level of
security and safety.
The new Xilinx UltraScale+ FPGA portfolio is comprised of
Xilinx's market leading Kintex® UltraScale+ FPGA and
Virtex® UltraScale+ FPGA and 3D IC families, while the
Zynq® UltraScale+ family includes the industry's first all
programmable MPSoCs. With this portfolio, Xilinx addresses a broad
range of next generation applications, including LTE Advanced and
early 5G wireless, terabit wired communications,
automotive ADAS, and industrial Internet-of-Things (IoT).
Memory Enhanced Programmable Devices: UltraRAM attacks
one of the largest bottlenecks affecting FPGA- and SoC-based system
performance and power by enabling SRAM integration. The new
technology can be leveraged to create high capacity on-chip memory
for a variety of use cases – including deep packet and video
buffering – providing predictable latency and performance. By
integrating massive amounts of embedded memory very close to the
associated processing engines, designers can achieve greater system
performance/watt and BOM cost reduction. UltraRAM scales up to 432
Mbits in a variety of configurations.
SmartConnect Technology: SmartConnect is a new and
innovative interconnect optimization technology for FPGAs. It
provides additional 20-30 percent performance, area, and power
advantages through intelligent system-wide interconnect
optimization. While the UltraScale architecture attacks the
silicon-level interconnect bottleneck through re-architected
routing, clocking, and logic fabric, SmartConnect applies
interconnect topology optimizations to match design-specific
throughput and latency requirements while reducing interconnect
logic area.
Industry's First 3D-on-3D Technology: The high end of the
UltraScale+ portfolio leverages the combined power of 3D
transistors and third generation of Xilinx 3D ICs. Just as FinFETs
enable a non-linear improvement in performance/watt over planar
transistors, 3D ICs enable a non-linear improvement in systems
integration and bandwidth/watt over monolithic devices.
Heterogeneous Multi-processing Technology: The new Zynq
UltraScale+ MPSoCs include all of the aforementioned FPGA
technologies with an unprecedented level of heterogeneous
multi-processing, deploying the "the right engines for the right
tasks." These new devices deliver approximately 5X system level
performance/watt relative to previous alternatives. At the
center of the processing-subsystem is the 64-bit quad-core ARM®
Cortex®-A53 processor, capable of hardware virtualization,
asymmetric processing, and full ARM TrustZone® technology
support.
The processing sub-system also includes a dual-core Cortex-R5
processor for real-time deterministic operation, ensuring
responsiveness, high throughput, and low latency for the highest
levels of safety and reliability. A separate security unit enables
military-class security solutions such as secure boot, key and
vault management, and anti-tamper capabilities – standard
requirements for machine-to-machine communication and industrial
IoT applications.
For complete graphics acceleration and video
compression/decompression, the new devices incorporate an ARM
Mali™-400 graphics processor as well as a H.265 video codec unit,
combined with support for Displayport, MIPI and HDMI. Finally, a
dedicated platform and power management unit (PMU) has been added
to support system monitoring, system management, and dynamic power
gating for each of the processing engines.
"Xilinx is delivering a generation ahead of value with 16nm
FinFET FPGAs and MPSoCs to a variety of next generation
applications," said Victor Peng,
executive vice president and general manager of the Programmable
Products Group at Xilinx. "Our new UltraScale+ 16nm portfolio
delivers 2-5X higher system performance-per-watt, a dramatic leap
in system integration and intelligence, and the highest level of
security and safety required by our customers. These capabilities
enable Xilinx to significantly expand its available market."
"TSMC's ongoing collaboration with Xilinx has resulted in the
realization of world class 16nm FinFET enabled products," said Dr.
B J Woo, TSMC vice president of Business Development. "Xilinx and
TSMC have clearly demonstrated leading silicon performance with the
lowest power consumption and highest system value."
Availability
Early customer engagements are in process for the UltraScale+
families. First tape out and early access release of the design
tools are scheduled for the second calendar quarter of 2015.
First ship is scheduled for the fourth calendar quarter of
2015. To see the latest Zynq UltraScale+ MPSoC technology
demonstrations, visit the Xilinx Stand H1-209 at Embedded World,
February 24-26, at the Nuremberg
Exhibition Hall in Nuremberg, Germany. To learn more visit
http://www.xilinx.com/ultrascale.
About Xilinx
Xilinx is the world's leading provider of All Programmable
FPGAs, SoCs, and 3D ICs. These industry-leading devices are coupled
with a next-generation design environment and IP to serve a broad
range of customer needs, from programmable logic to programmable
systems integration. For more information, visit
www.xilinx.com.
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© Copyright 2015 Xilinx, Inc. Xilinx, the Xilinx logo, Artix,
ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated
brands included herein are trademarks of Xilinx in the United
States and other countries. ARM is a registered trademark of ARM in
the EU and other countries. All other trademarks are the property
of their respective owners.
Xilinx Stays a Generation Ahead at 16nm with
New Memory,
3D-on-3D, and Multi-Processing SoC Technologies
February 23, 2015
Quote Sheet
"We have collaborated closely with Xilinx to ensure that
developers can take full advantage of the diverse range of ARM
technology that is integrated in this new and exciting suite of
products. The ARM DS-5 Development Studio supports all Xilinx®
Zynq® and UltraScale™ devices, and includes a certified compiler
for safety applications, heterogeneous debug and trace, as well as
system level analysis tools spanning processor, system and graphics
IP."
Hobson Bullman, General
Manager, Development Solutions Group, ARM
"As a Xilinx Premier Design Service Alliance Member, DornerWorks
is proud to be a solutions provider and system integrator to the
Xilinx 16nm UltraScale+ MPSoC. In support of customers who
have expressed the desire for an open source hypervisor capable of
running multiple operating systems on the Application Processor
Unit of the Zynq UltraScale+ MPSoC, DornerWorks will deliver the
Xen hypervisor, documented, supported and integrated within the
Xilinx development tools and workflow. DornerWorks will provide
customization and services to MPSoC customers across several system
aspects including hypervisors, real-time system development and
system certification."
David Dorner, President,
DornerWorks
"As Xilinx Premier Design Service Alliance Member, Fidus is
uniquely positioned to offer Xilinx's most advanced technology and
solutions to our customers. We are thrilled with the level of
performance and integration Xilinx has brought to the 16nm
UltraScale+ family of FPGAs, 3D ICs and the MPSoC. With Fidus'
strong capabilities in FPGA and MPSoC design and system
integration, we are already well positioned to offer leading edge,
value-added solutions to our mutual customers at 16nm."
Michael Wakim, CEO, Fidus
Systems
"With the integration of our Integrity RTOS and tools for the
Zynq-7000 platform, Green Hills has been able to offer a world
class solution for customer applications in a wide variety of
markets, including industrial, medical, automotive, software
defined radio, and aerospace and defense. We are looking forward to
continue helping customers accelerate the design process while
minimizing risk with the Zynq UltraScale+ MPSoC platform."
Robert Redfield, Director,
Business Development, Green Hills
"Lauterbach was first to market with TRACE32® Debug and Trace
tools for the Zynq platform and we are now looking forward to
offering the same world class tools for the Zynq UltraScale+ MPSoC
platform."
Norbert Weiss, Manager, Global
Sales, Lauterbach
"We are pleased to announce our LynxSecure Separation Kernel
Hypervisor support for the Zynq UltraScale+ MPSoC to enable
developers to build advanced security applications for connected
embedded systems in Automotive, Industrial IoT, Critical
Infrastructure and Medical markets. We believe that the
combination of the highly secure virtualization offered by
LynxSecure coupled with the 64-bit multi-core processing power of
the Zynq UltraScale+ MPSoC will enable large scale system
consolidation, while improving both security and power consumption
in complex connected embedded systems."
Robert Day, Vice President of
Marketing, Lynx Software Technologies
"MathWorks and Xilinx have a long history of collaboration,
bringing Model-Based Design to engineers using Xilinx All
Programmable FPGAs and SoCs. With the Zynq UltraScale+ MPSoC,
a workflow based on MATLAB® and Simulink® enables developers to
take full advantage of the performance-per-watt benefits of the
device architecture while reducing their time to production."
Jim Tung, Fellow,
MathWorks
"Mentor Graphics is excited with the new Zynq UltraScale+ MPSoC
platform that enables us to showcase our complete embedded solution
that includes Linux®, Nucleus® RTOS, Sourcery™ CodeBench and the
Mentor® Embedded Multicore Framework (MEMF). The combination
of processing engines in the Zynq UltraScale+ MPSoC provides
Mentor's customers with increased system performance while
benefiting from lower power consumption to deliver the next
generation of embedded systems in the Wireless, Automotive,
Industrial and Medical markets."
Glenn Perry - Vice President
& General Manager, Mentor Graphics
"Micrium is committed to supporting the Zynq and Zynq
UltraScale+ MPSoC platforms. Our embedded RTOS, including the
µC/OS-II® and µC/OS-III® kernels, has been ported to the Zynq-7000
All Programmable SoC, and we look forward to extending support to
include Zynq UltraScale+ MPSoC devices. Together, Xilinx and
Micrium are ideal for applications where reliability, security and
connectivity are critical, such as LTE Advanced and early 5G
wireless, terabit wired communications, automotive ADAS, and
Industrial IoT."
Mike Kaskowitz, Vice President
of Sales and Marketing, Micrium
"NI has been collaborating with Xilinx for many years to deliver
a LabVIEW® platform-based design flow that incorporates some of the
most competitive technology on the market today. Xilinx All
Programmable FPGAs and SoCs incorporated into NI reconfigurable
CompactRIO and PXI hardware abstract the complex and time-consuming
RTL and software design tasks our customers face. The new UltraRAM
and SmartConnect technologies and the scalable heterogeneous
processing in the UltraScale+ portfolio provide a tremendous
opportunity to improve system-level performance per watt and open
up new customer applications for us."
Jamie Smith, Director of
Embedded Systems Product Marketing, NI
"Northwest Logic, a Premier Member of the Xilinx Alliance
Program, provides complete, hardware proven PCI Express® based
solution IP including its high-performance PCI Express 3.0
Controller Cores, DMA Cores and Drivers (Windows and Linux).
This IP enables our customer to quickly and reliably develop PCI
Express based products on Xilinx FPGA platforms. Northwest
Logic's PCI Express IP has been a market staple for Xilinx's 28nm
and 20nm devices. We are excited about the potential of the
16nm FinFET UltraScale+ FPGA family of devices and will actively
support the devices as they become available."
Brian Daellenbach, President,
Northwest Logic
"TED Inrevium's board/kits, reference designs and IP solutions
for Xilinx All Programmable platforms have enabled thousands of
customers across Japan, APAC and
North America in developing and
deploying smarter electronics systems based on the Xilinx All
Programmable Technology. The 16nm UltraScale+ FPGAs, 3D ICs and
MPSoCs extends the current UltraScale family's performance and
system integration capabilities to a much higher and unprecedented
level. As a Xilinx Premier Design Service Alliance Member, TED
Inrevium is fully committed and ready to embrace the 16nm
UltraScale+ family with upgraded Inrevium board/kits and IP
solutions. We are confident that the Inrevium Design and
Manufacturing services can offer optimized system implementation
and integration, maximum performance/cost ratio, and enable
customers to go-to-market faster."
Yasuo Hatsumi, President of Tokyo Electron Device Limited
Inrevium Company
"As Xilinx Premier Design Service Alliance Member and solution
provider, Topic has designed our current SoM product, Miami, around the Zynq-7000 All Programmable
SoC and we are looking forward to extending the product portfolio
to include Zynq UltraScale+ MPSoC."
Rieny Rijnen, Founder &
CEO, Topic Embedded Products
"We believe that the combination of our VxWorks real-time
operating system and Wind River Linux platform with Xilinx's Zynq
and Zynq UltraScale+ MPSoC platforms will provide our customers
with a compelling offer applicable to a wide range of applications
such as LTE Advanced and early 5G wireless, terabit wired
communications, Automotive ADAS, and Industrial IoT."
Dinyar Dastoor, Vice President
and General Manager, Operating System Platform, Wind
River
"Our logicBRICKS product portfolio is currently available on the
Zynq-7000 All Programmable SoC platform, and we look forward to
extending the support to the Zynq UltraScale+ MPSoC. As a
long-standing Premier Member of the Xilinx Alliance Program, our
early access to emerging Xilinx silicon products and developments
tools also enables us to offer our IP cores and solutions to
customers who are building embedded Smarter Vision systems at the
beginning of their development cycle."
Davor Kovacec, Founder and
CEO, Xylon
Xilinx
Silvia E. Gianelli
(408)
626-4328
silvia.gianelli@xilinx.com
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SOURCE Xilinx, Inc.