AppliedMicro and Theobroma Systems Announce COMExpress Module Featuring the 64-bit HeliX(R) 2 ARM(R) Processor
April 27 2015 - 7:00AM
Applied Micro Circuits Corporation (Nasdaq:AMCC), a global leader
in computing and connectivity solutions, and Theobroma Systems
today announced a COMExpress module featuring AppliedMicro's HeliX
2 SoC (System on a Chip) designed specifically for industrial
applications.This joint effort builds upon almost three years of
close collaboration between the two companies, with Theobroma
Systems supporting AppliedMicro with software engineering expertise
and performance tuning for ARMv8 on its X-Gene® platforms.
"We have had the privilege to experience, first-hand, the
evolution of the X-Gene architecture from FPGA-based verification
boards to a market-proven processor for data-centers,
network-appliances, and cloud-computing," said Dr. Philipp Tomsich,
chief technology officer for Theobroma Systems. "With the optimized
HeliX 2 processor, we have the unique opportunity to extend the
benefits of the X-Gene family into the application domain that our
company has focused on since its inception: networked, embedded
applications."
The COMExpress SoM (System on Module) features the HeliX2
processor with SO-DIMM slots for flexible ECC-enabled memory
configurations using industry-standard memory modules. On-module
flash storage provides for a module bootable without any external
peripherals and ensures reliable storage for embedded operating
systems, customer applications and user data. An enhanced
COMExpress pin-out makes the full capabilities of the HeliX 2
processor, including one of its 10 Gigabit Ethernet interfaces,
available to compatible baseboards.
"AppliedMicro's Helix 2 processor architecture allows us to
further build on our momentum bringing 64-bit ARM technology to a
broad range of embedded markets," said John Williams, AppliedMicro
VP of Marketing. "Theobroma Systems has been an ideal partner to
collaborate with on this module as we extend our access to
developers in the networking, storage, industrial automation and
imaging markets."
A customized baseboard complements the COMExpress module to form
a complete evaluation platform and enables a quick-start for
developers adopting the HeliX 2 processor solution:
- 10 Gigabit Ethernet and 1 Gigabit Ethernet network
interfaces
- PCI Express® Gen 3 expansion
- SATA 3 for enterprise-grade mass storage connectivity
- USB 3.0 for connecting standard peripherals
- Slot for an 'intelligent HMI module' with HDMI® and
dual-channel LVDS for visual computing
- Embedded interfaces (UART, SPI, I2C, SD, GPIO) for quick
prototyping
The design documentation of the newly announced product will be
made available as a reference design to AppliedMicro's customers
through myAPM.com. An evaluation kit featuring a COMExpress module,
baseboard and an 'intelligent HMI module' will be available through
AppliedMicro's distribution channels. COMExpress modules for
production use will be available directly from Theobroma Systems
and through channel partners.
About Theobroma Systems
Theobroma Systems is a leading provider of embedded systems
solutions for industrial and high-assurance applications. Theobroma
Systems provides engineering services and turnkey system-on-module
designs, accelerating time-to-market and lowering project risk
for customers. The company is located in Vienna, Austria.
www.theobroma-systems.com.
About AppliedMicro
Applied Micro Circuits Corporation (Nasdaq:AMCC) is a
global leader in computing and connectivity solutions for
next-generation cloud infrastructure and data centers. AppliedMicro
delivers silicon solutions that dramatically lower total cost of
ownership. Corporate headquarters are located in Sunnyvale,
California. www.apm.com.
(C) Copyright 2015 Applied Micro Circuits Corporation,
AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server
are trademarks or registered trademarks of Applied Micro Circuits
Corporation. All other product or service names are the property of
their respective owners.
CONTACT: Media Contact:
Applied Micro Circuits Corporation
Mike Major
Phone: (408) 542-8831
E-mail: mmajor@apm.com
Theobroma Systems GmbH
Jennifer Hetzl
Phone: +43 1 2369893-301
E-mail: jennifer.hetzl@theobroma-systems.com
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