New Helios G4 Series DualBeam From FEI Sets New Standards
November 02 2015 - 8:00AM
First 7nm TEM Preparation Solution Available to Failure Analysis
Labs and the Only DualBeam of Its Kind to Achieve Sub-Three
Ångström Resolution
FEI (NASDAQ:FEIC) today announced the new Helios™ G4 DualBeam
series, which offers the highest throughput ultra-thin TEM lamella
preparation for leading-edge semiconductor manufacturing and
failure analysis applications. The new DualBeam series, which
includes FX and HX models, takes a significant leap forward in both
technological capability and ease-of-use.
The new Phoenix focused ion beam (FIB) makes finer cuts with
higher precision and simplifies the creation of ultra-thin (sub
10nm) lamella for transmission electron microscopy (TEM) imaging.
The FX is a flexible system that delivers dramatically improved
STEM resolution – down to sub-three Ångströms – and significantly
shortens the time to data for failure analysis. Images can now be
obtained within minutes of completing the lamella, rather than the
hours or days required previously to finalize the images on a
stand-alone S/TEM system. The HX model is geared specifically for
high-throughput TEM lamella production. It features an automated
QuickFlip holder that reduces sample preparation times.
“FEI is the first to market with a TEM sample preparation
solution capable of making 7nm thick lamella, addressing the needs
of our customers who are developing next-generation devices,”
states Rob Krueger, vice president and general manager of FEI’s
semiconductor business. “In addition, by offering the ability to
achieve sub-three Ångström image resolution in a DualBeam, failure
analysis labs can now dramatically cut ‘time to data’ without
compromising image quality. And, by combining high-resolution
imaging and sample preparation on one system, we have reduced the
amount of valuable lab real estate required.”
Failure Analysis is becoming increasingly important for
chipmakers to ramp and manage yields at sub-20nm. As a result, the
market for failure analysis equipment has experienced robust growth
compared to the overall semiconductor equipment market. Over 30
equipment suppliers are active in the market. However, a recent
report published by VLSI Research confirms that FEI continues to be
the leading supplier: http://bit.ly/1NEM3Th.
Please visit FEI at ISTFA, taking place November 1-5, 2015, at
the Oregon Convention Center in Portland, to learn more about the
Helios G4 DualBeam. Or go to the FEI website:
http://fei.com/helios-g4-fx-for-semiconductors/ or
http://fei.com/helios-g4-hx-for-semiconductors/.
About FEIFEI Company (Nasdaq:FEIC) designs,
manufactures and supports a broad range of high-performance
microscopy workflow solutions that provide images and answers at
the micro-, nano- and picometer scales. Its innovation and
leadership enable customers in industry and science to increase
productivity and make breakthrough discoveries. Headquartered
in Hillsboro, Ore., USA, FEI has over 2,600 employees and sales and
service operations in more than 50 countries around the world. More
information can be found at: www.fei.com.
FEI Safe Harbor Statement This news release
contains forward-looking statements that include statements
regarding the performance capabilities and benefits of the Helios
G4 Series, Phoenix FIB, and Quickflip holder. Factors that could
affect these forward-looking statements include but are not limited
to our ability to manufacture, ship, deliver and install the tools,
solutions or software as expected; failure of the product or
technology to perform as expected; unexpected technology problems
and challenges; changes to the technology; the inability of FEI,
its suppliers or project partners to make the technological
advances required for the technology to achieve anticipated
results; and the inability of the customer to deploy the tools or
develop and deploy the expected new applications. Please also refer
to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the
U.S. Securities and Exchange Commission for additional information
on these factors and other factors that could cause actual results
to differ materially from the forward-looking statements. FEI
assumes no duty to update forward-looking statements.
For more information contact:
Sandy Fewkes (media contact)
MindWrite Communications, Inc.
+1 408 224 4024
sandy@mind-write.com
FEI Company
Jason Willey (investors and analysts)
Investor Relations Director
+1 503 726 2533
jason.willey@fei.com
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