SAN FRANCISCO, Sept. 28, 2016 /PRNewswire/ -- DesignCon,
produced by UBM LLC (UBM.L), today announced its 2017 event which
will return to the Santa Clara
Convention Center for its 22nd year. The event, designed
by engineers for engineers, is the premier conference for deep
technical training, driving chip, board and system innovation. This
year's program will host more than 100 in-depth sessions spanning
14 technical tracks to deliver the most comprehensive and relevant
conference program for the engineering community.
To learn more about DesignCon and to take advantage of Super
Early Bird pricing, please visit:
designcon.com/santaclara/passes-pricing
DesignCon 2017 will align with the event's reputation of
providing the latest tools and education for the successful growth
of the engineering community. This year's event will help
professionals grow their design expertise and stay ahead of
industry change. Attendees will learn, network and share with peers
who are like-minded and passionate about their careers related to
chips, boards and systems. Led by industry thought leaders,
DesignCon will return with a schedule of sessions catered toward
giving attendees practical solutions to their toughest
challenges.
Below is a list of the 14 tracks that will be offered at this
year's conference:
- Overcoming chip & package challenges in signal/power
integrity
- Analog and mixed-signal modeling and simulation solutions
- Integrating photonic and electronic signaling
- System co-design modeling, correlation, and simulation
- Advances in materials and processing for PCBs, modules and
packages
- Applying PCB design and simulation tools
- Advanced IO interface design for memory and 2.5D/3D/SIP
integrations
- Optimizing high-speed serial design
- Measuring and simulating hitter, noise, and timing in serial
links to minimize BER
- High-speed signal processing for equalization and coding
- Power integrity in power distribution networks
- Electromagnetic compatibility/mitigating interference
- Apply test and measurement methodology
- Modeling and analysis of interconnects
"Our dedication to this complex and talented community has
always been evident through our evolving conference program," said
Naomi Price, DesignCon Conference
Content Director. "During its 21-year history, DesignCon has hosted
the best and brightest engineers to educate, inspire and lead their
peers toward success within an evolving industry. This year we
continue that dedication with another full conference program that
offers training for all career levels."
Apply for a Media Pass here:
designcon.tech.ubm.com/2017/registrations/Media
Follow DesignCon online:
Facebook: facebook.com/DesignCon
Twitter: @UBMDesignCon
Linkedin: linkedin.com/groups/1272607
Flickr: flickr.com/photos/designcon
About DesignCon
DesignCon is the world's premier conference for chip, board and
systems design engineers in the high-speed communications and
semiconductor communities. DesignCon, created by
engineers for engineers, takes place annually in Silicon
Valley and remains the largest gathering of chip, board and systems
designers in the country. This three-day technical conference
and expo combines technical paper sessions, tutorials, industry
panels, product demos and exhibits from the industry's leading
experts and solutions providers. More information is available
at: designcon.com. DesignCon is organized by UBM Americas, a
part of UBM plc (UBM.L), an Events First marketing and
communications services business. For more information,
visit ubmamericas.com.
Media Contact:
Kimberly Samra
DesignCon PR
DesignConPR@ubm.com
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SOURCE UBM LLC