Advanced Fan-out Technology Breakthrough: Deca Technologies’ M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 H...
August 14 2019 - 10:43PM
Deca Technologies, a wafer-level electronic interconnect solutions
provider to the semiconductor industry, today announced that
Industry researchers Yole and TechInsights have independently
confirmed that M-Series™ fan-out wafer-level packaging (FOWLP)
technology created by Deca Technologies has been adopted by
Qualcomm for power management integrated circuit (PMIC) devices in
Samsung’s flagship S10 handset, along with the Xiaomi Mi 9 and LG
G8 handsets.
https://www.i-micronews.com/new-commercialization-of-deca-technologies-fan-out-technology/
https://techinsights.com/products/qualcomm-pm8150-advanced-packaging-essentials
A remarkable development within the initial application is the
use of M-Series fan-out technology to create a “protected fan-in
WLCSP” where all the solder balls remain within the silicon area.
Deca’s patented M-Series structure and methods are used to
encapsulate the active semiconductor side and four surrounding
vertical sidewalls of the device. Additionally, Deca’s patented
Adaptive Patterning™ technology is used in the design and
manufacturing processes.
Utilization of Deca’s M-Series processes to encapsulate and
protect the device allows both integrated circuit (IC) producers
and original equipment manufacturers (OEMs) to approach zero
defects related to silicon cracking or chipping.
Sidewall chipping of conventional fan-in wafer-level chip-scale
packages (WLCSPs) remains a key quality concern for cell phone OEMs
and IC companies throughout the supply chain. Chipping or cracking
defects can arise during device singulation, in shipping or in the
board mounting process due to the exposed silicon. Adopting
M-Series FOWLP mitigates this problem.
“A growing community of semiconductor customers and end
electronic product OEMs is taking notice of the benefits that
M-Series can provide. Outstanding board level reliability
performance coupled with extreme miniaturization vs. competing
alternatives is the starting point,” said Garry Pycroft, VP Sales
& Marketing at Deca Technologies. “The fully protected nature
not only drives elimination of silicon cracking and chipping, it
also provides benefit for light-sensitive devices, blocking over
10X the ambient light compared with conventional fan-in WLCSP.
Radio frequency device users also see improved electrical
performance capabilities with the unique dielectric structure
between the active device and redistribution layers.”
A cross-sectional image of a protected fan-in device recently
built at Deca Technologies’ Philippines location is shown to the
right.
With noted success in the low-density fan-out market, Deca is
working to scale its M-Series and Adaptive Patterning™ technologies
to support the anticipated strong growth of chiplets and
heterogeneous integration. In the near future, Deca’s unique
approach will allow scaling in both directions simultaneously:
scaling up from 300mm round to 600mm square manufacturing format
while also scaling down from 8µm line and space (l/s) to below 2µm
l/s.
For more information on M-Series, please
visit:http://www.decatechnologies.com/deca-technologies-transforming-electronic-interconnect/19530-2/
About Deca Technologies
Founded in 2009, Deca Technologies is an electronic interconnect
solutions provider offering advanced interconnect foundry services
to the semiconductor industry. Headquartered in Tempe, Arizona with
high-volume manufacturing in Asia, Deca Technologies is a privately
held company with leading investors including Cypress Semiconductor
Corp. (NASDAQ: CY), ASE Technology Holding Co., Ltd. (NYSE: ASX),
Qualcomm Ventures (NASDAQ: QCOM) and SunPower (NASDAQ: SPWR).
Deca’s mission is to deliver an exceptional customer experience
through its proprietary and transformative electronic interconnect
technology. Integrating its solar and semiconductor background,
Deca leverages unique equipment, processes and operational methods
to break down traditional barriers in the continued adoption and
growth of next-generation wafer-level electronic interconnect. For
more information, please visit www.decatechnologies.com.
Company Contact:Garry Pycroft
Vice President of Sales & MarketingDeca Technologies
Garry.Pycroft@Decatechnologies.com
Press Contact: Paige
HoffmanMedia Relations, Deca TechnologiesKiterocket (701)
373-5093PHoffman@Kiterocket.com
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/676145f5-29eb-4f37-a4de-5b6be8828682
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