Music and Mobile Internet for Emerging Markets; Infineon Introduces 65-Nanometer Single-Chip Family for Low-Cost Phones
February 07 2008 - 7:00AM
Marketwired
NEUBIBERG, GERMANY (NYSE: IFX) enables advanced mobile phone
features such as camera, mobile Internet and audio-entertainment to
now be accessible in low-cost markets with the introduction of the
X-GOLD(TM) 113 and X-GOLD(TM) 213, its third generation of single
chips. The integration of these features allows customers to reduce
the production cost of core mobile functions by up to 40 percent
compared to more traditional solutions. The new chips are sampling
now and a first call on air has already been successfully
conducted.
According to market analysts roughly half of the 6.6 Billion
people worldwide have not made a phone call, not to mention having
used a digital camera or an MP3 player. With the X-GOLD 113 and
X-GOLD 213 single chips presented today, Infineon has paved the way
for this target group to more mobile applications at an affordable
price. As part of a complete mobile platform, this solution enables
additional features in price-sensitive markets which previously
were only offered in the high-tier segments. Users without personal
computers can now access the Internet using their mobile phones
while they are on-the-go -- including news reports, weather
forecasts, prices of goods, navigation or e-mail. In addition
digital photos can now be taken and quickly shared. Radio programs
or MP3 data, including podcasts, can now be availed of without any
additional costs.
With the new X-GOLD family, Infineon is taking a further step
towards single-chip integration. The baseband, power management
unit, RF transceiver and FM radio are now combined on one single
die. An ARM11 processor provides the required performance and
flexibility required for applications such as a music player, Java,
multimedia messaging, e-mail and video functionality.
"With the introduction of our new semiconductor chips
manufactured on 65-nanometer process technology, we confirm once
again our technology leadership in the area of true monolithic
integration," says Prof. Dr. Hermann Eul, Executive Vice President
of the Infineon Management Board and President of the Communication
Solutions business group. "With the X-GOLD 113 and the X-GOLD 213,
we address new and growing markets where there is a strong demand
for more features at an affordable price."
With the ULC1 (E-GOLDradio(TM)) and ULC2 (XMM(TM) 1010 /
X-Gold(TM) 101) platforms, which have accumulated shipment of more
than 50 million units to date, Infineon has established itself as
one of the leading solution providers of the ultra low cost market.
Handset manufacturers worldwide including Nokia, LGE, ZTE (supplier
to Vodafone, among others), Sagem and Ningbo Bird have selected
Infineon's Ultra low cost platforms.
The entry level phone segment is currently booming. According to
forecasts from the market research company ABI Research, ultra low
cost and entry phones had a market share of roughly 16 percent in
2007. This share should rise to nearly 28 percent by 2010.
X-GOLD(TM) 113 / XMM(TM) 1130
Available in an 8 x 8 mm wafer level package, the X-GOLD 113
combines a GSM/GPRS modem and all necessary features for a music
phone like an audio player, stereo RDS FM radio receiver, stereo
headset, class-D amplifier, audio codecs, USB interface as well as
interfaces for memory card and Bluetooth. The complete mobile
functionality can be realized by the XMM 1130 platform on an area
of less than five centimeters squared and with less than 50
components.
X-GOLD(TM) 213 / XMM(TM) 2130
The X-GOLD 213 single chip combines the properties of the X-GOLD
113 in the same package size. The X-GOLD 213 chip offers additional
functionality including an EDGE Modem, interface for up to
3-megapixel cameras, and additional connectivity for A-GPS, WLAN
and Bluetooth. The EDGE functionality and the corresponding factor
increase of three in the downlink channel data rates makes the XMM
2130 an ideal platform for real web browsing and messaging. Even
when including Bluetooth the platform is still less than six
centimeters squared, making it the smallest and most cost
attractive browsing platform in the market.
Availability
The X-GOLD 113 and the X-GOLD 213 are sampling now and will be
available in volume quantities in the first half of 2009. The
packages will be produced on Infineon's pre-announced innovative
embedded wafer level ball grid array technology (eWLB).
You can find out more about ULC-phones in our Podcast at:
www.infineon.com/podcast
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers
semiconductor and system solutions addressing three central
challenges to modern society: energy efficiency, communications,
and security. In the 2007 fiscal year (ending September), the
company reported sales of Euro 7.7 billion (including Qimonda sales
of Euro 3.6 billion) with approximately 43,000 employees worldwide
(including approximately 13,500 Qimonda employees). With a global
presence, Infineon operates through its subsidiaries in the U.S.
from Milpitas, CA, in the Asia-Pacific region from Singapore, and
in Japan from Tokyo. Infineon is listed on the Frankfurt Stock
Exchange and on the New York Stock Exchange (FRANKFURT: IFX) (NYSE:
IFX).
Further information is available at www.infineon.com.
This news release is available online at
www.infineon.com/press/
Media Relations Technology: Worldwide Headquarters Christoph von
Schierstaedt +49 89 234 22984 vonschierstaedt@infineon.com U.S.A.
Agnes Toan +1 408 503 2587 agnes.toan@infineon.com Asia Chi Kang
David Ong +65 6876 3070 david.ong@infineon.com Japan Hirotaka
Shiroguchi +81 3 5745 7340 hirotaka.shiroguchi@infineon.com
Investor Relations EU/APAC/USA/CAN +49 89 234 26655
investor.relations@infineon.com
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